JPS61129847A - 半導体装置の金属配線パタ−ン形成方法 - Google Patents
半導体装置の金属配線パタ−ン形成方法Info
- Publication number
- JPS61129847A JPS61129847A JP25232184A JP25232184A JPS61129847A JP S61129847 A JPS61129847 A JP S61129847A JP 25232184 A JP25232184 A JP 25232184A JP 25232184 A JP25232184 A JP 25232184A JP S61129847 A JPS61129847 A JP S61129847A
- Authority
- JP
- Japan
- Prior art keywords
- region
- type
- patterns
- impurity regions
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 20
- 230000007261 regionalization Effects 0.000 title description 2
- 239000012535 impurity Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 16
- 238000001039 wet etching Methods 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 14
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000000059 patterning Methods 0.000 abstract description 3
- 238000002955 isolation Methods 0.000 abstract description 2
- 238000005530 etching Methods 0.000 description 20
- 238000010586 diagram Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25232184A JPS61129847A (ja) | 1984-11-29 | 1984-11-29 | 半導体装置の金属配線パタ−ン形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25232184A JPS61129847A (ja) | 1984-11-29 | 1984-11-29 | 半導体装置の金属配線パタ−ン形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61129847A true JPS61129847A (ja) | 1986-06-17 |
| JPH0251252B2 JPH0251252B2 (enrdf_load_stackoverflow) | 1990-11-06 |
Family
ID=17235628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25232184A Granted JPS61129847A (ja) | 1984-11-29 | 1984-11-29 | 半導体装置の金属配線パタ−ン形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61129847A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7943436B2 (en) | 2002-07-29 | 2011-05-17 | Synopsys, Inc. | Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
-
1984
- 1984-11-29 JP JP25232184A patent/JPS61129847A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0251252B2 (enrdf_load_stackoverflow) | 1990-11-06 |
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