JPS61125711A - 多層印刷配線板の孔穿設位置検出法 - Google Patents

多層印刷配線板の孔穿設位置検出法

Info

Publication number
JPS61125711A
JPS61125711A JP24920284A JP24920284A JPS61125711A JP S61125711 A JPS61125711 A JP S61125711A JP 24920284 A JP24920284 A JP 24920284A JP 24920284 A JP24920284 A JP 24920284A JP S61125711 A JPS61125711 A JP S61125711A
Authority
JP
Japan
Prior art keywords
hole
wiring board
mark
printed wiring
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24920284A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325884B2 (enrdf_load_stackoverflow
Inventor
Shinji Okamoto
岡本　紳二
Toshinori Fujii
藤井　利憲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP24920284A priority Critical patent/JPS61125711A/ja
Publication of JPS61125711A publication Critical patent/JPS61125711A/ja
Publication of JPS6325884B2 publication Critical patent/JPS6325884B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)
JP24920284A 1984-11-26 1984-11-26 多層印刷配線板の孔穿設位置検出法 Granted JPS61125711A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24920284A JPS61125711A (ja) 1984-11-26 1984-11-26 多層印刷配線板の孔穿設位置検出法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24920284A JPS61125711A (ja) 1984-11-26 1984-11-26 多層印刷配線板の孔穿設位置検出法

Publications (2)

Publication Number Publication Date
JPS61125711A true JPS61125711A (ja) 1986-06-13
JPS6325884B2 JPS6325884B2 (enrdf_load_stackoverflow) 1988-05-27

Family

ID=17189426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24920284A Granted JPS61125711A (ja) 1984-11-26 1984-11-26 多層印刷配線板の孔穿設位置検出法

Country Status (1)

Country Link
JP (1) JPS61125711A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899440A (en) * 1986-12-31 1990-02-13 Systems Analysis And Integration Method and apparatus for locating targets on a panel and performing work operations thereon
JPH0271957A (ja) * 1988-09-01 1990-03-12 Matsushita Electric Works Ltd 穴加工方法及び装置
EP0730210A1 (en) * 1995-03-03 1996-09-04 Faro Technologies Inc. Three dimensional coordinate measuring apparatus
JP2007059454A (ja) * 2005-08-22 2007-03-08 Mitsumi Electric Co Ltd 多層配線基板およびｂｖｈ断線チェック方法
CN108811333A (zh) * 2018-06-22 2018-11-13 胜宏科技（惠州）股份有限公司 一种提高背钻孔品质的方法
CN111113549A (zh) * 2019-12-16 2020-05-08 广州兴森快捷电路科技有限公司 超厚芯板冲孔系统及超厚芯板冲孔方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899440A (en) * 1986-12-31 1990-02-13 Systems Analysis And Integration Method and apparatus for locating targets on a panel and performing work operations thereon
JPH0271957A (ja) * 1988-09-01 1990-03-12 Matsushita Electric Works Ltd 穴加工方法及び装置
US5611147A (en) * 1993-02-23 1997-03-18 Faro Technologies, Inc. Three dimensional coordinate measuring apparatus
EP0730210A1 (en) * 1995-03-03 1996-09-04 Faro Technologies Inc. Three dimensional coordinate measuring apparatus
JP2007059454A (ja) * 2005-08-22 2007-03-08 Mitsumi Electric Co Ltd 多層配線基板およびｂｖｈ断線チェック方法
CN108811333A (zh) * 2018-06-22 2018-11-13 胜宏科技（惠州）股份有限公司 一种提高背钻孔品质的方法
CN111113549A (zh) * 2019-12-16 2020-05-08 广州兴森快捷电路科技有限公司 超厚芯板冲孔系统及超厚芯板冲孔方法
CN111113549B (zh) * 2019-12-16 2021-11-09 广州兴森快捷电路科技有限公司 超厚芯板冲孔系统及超厚芯板冲孔方法

Also Published As

Publication number Publication date
JPS6325884B2 (enrdf_load_stackoverflow) 1988-05-27

Similar Documents

Publication Publication Date Title
JPS61125712A (ja) 多層印刷配線板の孔穿設法
JP2001340980A (ja) レーザ加工方法および加工装置
KR100381673B1 (ko) 다층인쇄회로기판 및 그 층간 어긋남 측정방법
JPS61125711A (ja) 多層印刷配線板の孔穿設位置検出法
CN114226289A (zh) 基于机器视觉的自动化激光标记系统、标记方法及应用
JPS62166914A (ja) 多層印刷配線板の基準孔穿孔装置
JPS61125713A (ja) 多層印刷配線板の孔穿設位置検出法
JPS6224906A (ja) 多層印刷配線板の孔穿設位置検出法
JPS61125715A (ja) 多層印刷配線板の孔マ−ク位置検出法
JPS61125714A (ja) 多層印刷配線板の孔穿設位置検出法
JP2570625B2 (ja) 座ぐり装置
JPH0749166B2 (ja) ワーク上面を基準とする加工方法およびその装置
JPH01199796A (ja) 多層積板の内層基準穴の穴あけ方法
JPH0149039B2 (enrdf_load_stackoverflow)
JPS61171199A (ja) 多層印刷配線板の加工基準穴の穿孔方法
JPH0367810B2 (enrdf_load_stackoverflow)
JP2006210874A (ja) 標示および判読を自動で行う複合システム
JPH02135800A (ja) 部品供給テープの部品残量検知方法
JPS61196593A (ja) 印刷配線板
JPH04310353A (ja) 盲穴加工方法
JPH01159198A (ja) 多層回路基板切断方法
JP2571139Y2 (ja) 加工装置
JP2023028658A (ja) 多層プリント配線基板の加工方法
JPH07231175A (ja) 多層印刷配線板の切断方法
JPH0457392A (ja) 多層プリント基板のｎｃ基準穴穴あけ方法