JPS61123563U - - Google Patents
Info
- Publication number
- JPS61123563U JPS61123563U JP593385U JP593385U JPS61123563U JP S61123563 U JPS61123563 U JP S61123563U JP 593385 U JP593385 U JP 593385U JP 593385 U JP593385 U JP 593385U JP S61123563 U JPS61123563 U JP S61123563U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- clad laminate
- divided
- electronic
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示すプリント基板
の電子部品実装時の要部上面図、第２図は同プリ
ントパターン側より見た要部上面図、第３図は従
来のプリント基板のプリントパターン側より見た
要部上面図である。
１…プリント基板、２…プリントパターン（電
子回路）、５…分割部、８…分割部プリントパタ
ーン（印刷回路）。
Fig. 1 is a top view of the main parts of a printed circuit board showing an embodiment of the present invention when electronic components are mounted, Fig. 2 is a top view of the main parts seen from the printed pattern side, and Fig. 3 is a top view of the main parts of a conventional printed circuit board. FIG. 3 is a top view of the main parts seen from the print pattern side. 1... Printed circuit board, 2... Printed pattern (electronic circuit), 5... Divided portion, 8... Divided portion printed pattern (printed circuit).
Claims (1)
れらを電子回路接続手段により接続する印刷回路
用銅張積層板において、前記分割される印刷回路
用銅張積層板１に形成する電子回路２に分割部５
でそれぞれ電気的に接続する印刷回路８を設け、
かつこの印刷回路８のパターン幅ｗをその他の電
子回路２のパターン幅Ｗより狭くしたことを特徴
とする印刷回路用銅張積層板。 In a copper clad laminate for a printed circuit which is divided into a plurality of sheets after mounting electronic components and connected by an electronic circuit connecting means, an electronic circuit 2 formed on the divided copper clad laminate 1 for a printed circuit is provided. Divided part 5
A printed circuit 8 is provided which is electrically connected to each other.
A copper-clad laminate for a printed circuit, characterized in that the pattern width w of the printed circuit 8 is narrower than the pattern width W of the other electronic circuits 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP593385U JPS61123563U (en) | 1985-01-19 | 1985-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP593385U JPS61123563U (en) | 1985-01-19 | 1985-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61123563U true JPS61123563U (en) | 1986-08-04 |
Family
ID=30482905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP593385U Pending JPS61123563U (en) | 1985-01-19 | 1985-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61123563U (en) |
-
1985
- 1985-01-19 JP JP593385U patent/JPS61123563U/ja active Pending