JPS63128759U - - Google Patents
Info
- Publication number
- JPS63128759U JPS63128759U JP2165887U JP2165887U JPS63128759U JP S63128759 U JPS63128759 U JP S63128759U JP 2165887 U JP2165887 U JP 2165887U JP 2165887 U JP2165887 U JP 2165887U JP S63128759 U JPS63128759 U JP S63128759U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- soldering
- printed circuit
- soldering points
- points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
図面は本考案の一実施例を示すプリント基板の
裏面図である。
４６，４８，５０，５２，５４，５６……半田
付個所（第１半田付個所）、５８，６０，６２，
６４，６６，６８……半田付個所（第２半田付個
所）、２０，２２……導体パターン（第１導箔部
）、２４，２６……導体パターン（第２導箔部）
、２８……ソルダーレジスト部（レジスト部）、
１０……プリント基板、１０４，１０６，１０８
……インク印刷部。
The drawing is a back view of a printed circuit board showing an embodiment of the present invention. 46, 48, 50, 52, 54, 56...Soldering location (first soldering location), 58, 60, 62,
64, 66, 68... Soldering location (second soldering location), 20, 22... Conductor pattern (first foil conducting portion), 24, 26... Conductor pattern (second conducting foil portion)
, 28... solder resist section (resist section),
10...Printed circuit board, 104, 106, 108
...Ink printing department.
Claims (1)
１、第２半田付個所と、 この第１、第２半田付個所に接続された第１、
第２導箔部と、 前記第１、第２半田付個所を除いて施されたレ
ジスト部とを、 備えるプリント基板に於いて、 前記レジスト部上で且つ前記第１又は第２導箔
部の少なくとも一方の上に施されたインク印刷部
を備えることを特徴とするプリント基板。[Claims for Utility Model Registration] First and second soldering points to which the primary and secondary sides of the transformer are connected, respectively; a first soldering point connected to the first and second soldering points;
In a printed circuit board comprising a second foil guiding portion and a resist portion applied except for the first and second soldering points, A printed circuit board comprising an ink printed portion on at least one side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2165887U JPS63128759U (en) | 1987-02-17 | 1987-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2165887U JPS63128759U (en) | 1987-02-17 | 1987-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63128759U true JPS63128759U (en) | 1988-08-23 |
Family
ID=30818298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2165887U Pending JPS63128759U (en) | 1987-02-17 | 1987-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63128759U (en) |
-
1987
- 1987-02-17 JP JP2165887U patent/JPS63128759U/ja active Pending
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