JPS61120451A - 半導体容器 - Google Patents

半導体容器

Info

Publication number
JPS61120451A
JPS61120451A JP59242118A JP24211884A JPS61120451A JP S61120451 A JPS61120451 A JP S61120451A JP 59242118 A JP59242118 A JP 59242118A JP 24211884 A JP24211884 A JP 24211884A JP S61120451 A JPS61120451 A JP S61120451A
Authority
JP
Japan
Prior art keywords
cap
semiconductor
input
substrate
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59242118A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0326544B2 (cg-RX-API-DMAC10.html
Inventor
Yukio Yamaguchi
幸雄 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP59242118A priority Critical patent/JPS61120451A/ja
Priority to FR8513819A priority patent/FR2570383B1/fr
Publication of JPS61120451A publication Critical patent/JPS61120451A/ja
Publication of JPH0326544B2 publication Critical patent/JPH0326544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/70—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59242118A 1984-09-20 1984-11-16 半導体容器 Granted JPS61120451A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59242118A JPS61120451A (ja) 1984-11-16 1984-11-16 半導体容器
FR8513819A FR2570383B1 (fr) 1984-09-20 1985-09-18 Composition stable conductrice de la chaleur et bloc de dispositif semi-conducteur dans lequel cette composition est utilisee

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59242118A JPS61120451A (ja) 1984-11-16 1984-11-16 半導体容器

Publications (2)

Publication Number Publication Date
JPS61120451A true JPS61120451A (ja) 1986-06-07
JPH0326544B2 JPH0326544B2 (cg-RX-API-DMAC10.html) 1991-04-11

Family

ID=17084561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59242118A Granted JPS61120451A (ja) 1984-09-20 1984-11-16 半導体容器

Country Status (1)

Country Link
JP (1) JPS61120451A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
JPH05129482A (ja) * 1991-08-27 1993-05-25 Kyocera Corp 電子部品収納用パツケージ
JP2003019525A (ja) * 2001-07-03 2003-01-21 Denso Corp 鋏め装置の着座検出機構及びその検出方法
JP2006269564A (ja) * 2005-03-22 2006-10-05 Sony Corp 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
JPH05129482A (ja) * 1991-08-27 1993-05-25 Kyocera Corp 電子部品収納用パツケージ
JP2003019525A (ja) * 2001-07-03 2003-01-21 Denso Corp 鋏め装置の着座検出機構及びその検出方法
JP2006269564A (ja) * 2005-03-22 2006-10-05 Sony Corp 半導体装置

Also Published As

Publication number Publication date
JPH0326544B2 (cg-RX-API-DMAC10.html) 1991-04-11

Similar Documents

Publication Publication Date Title
CN1331221C (zh) 芯片球栅阵列封装结构
KR970013389A (ko) 반도체장치
KR20010044277A (ko) 방열지붕이 몰딩된 플라스틱 패캐지(피피엠시)
JPS61120451A (ja) 半導体容器
NL7504380A (nl) Keramisch pakket zonder aansluitleidingen, be- stemd voor een geintegreerde keten.
JPS61234550A (ja) チツプキヤリア
JPH01298753A (ja) ヒートシンク付ピングリッドアレイｉｃパッケージ
JPS6063952A (ja) レジン封止半導体装置の実装方法
JPS6129158A (ja) 半導体装置
JP2646994B2 (ja) ヒートシンク付ピングリッドアレイ
JPH046860A (ja) 半導体装置
JPS6221251A (ja) 多層セラミツクパツケ−ジ
JPH0448740A (ja) Ｔａｂ半導体装置
JPS6362364A (ja) 半導体集積回路パツケ−ジ
TWI237361B (en) Chip package structure
JPS61193470A (ja) チツプキヤリアのチツプ搭載構造
JPH04219966A (ja) 半導体素子
JPH04207059A (ja) 半導体装置
JPS59231841A (ja) 半導体装置
KR970006162Y1 (ko) 반도체패키지의 외부돌출형 히트싱크
JPH01282846A (ja) 混成集積回路
JPS60154648A (ja) 半導体装置
JPH034039Y2 (cg-RX-API-DMAC10.html)
JPH0283955A (ja) 半導体装置
JPH0370163A (ja) 半導体装置