JPS61117105U - - Google Patents

Info

Publication number
JPS61117105U
JPS61117105U JP20213484U JP20213484U JPS61117105U JP S61117105 U JPS61117105 U JP S61117105U JP 20213484 U JP20213484 U JP 20213484U JP 20213484 U JP20213484 U JP 20213484U JP S61117105 U JPS61117105 U JP S61117105U
Authority
JP
Japan
Prior art keywords
fixed
jig
carrier tape
semiconductor element
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20213484U
Other languages
Japanese (ja)
Other versions
JPH0213288Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984202134U priority Critical patent/JPH0213288Y2/ja
Publication of JPS61117105U publication Critical patent/JPS61117105U/ja
Application granted granted Critical
Publication of JPH0213288Y2 publication Critical patent/JPH0213288Y2/ja
Expired legal-status Critical Current

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  • Registering Or Overturning Sheets (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図はこの考案の一実施例を示す
斜視図、第３図はこの考案の一実施例を示す正面
図である。 １……固定部、１１……窪み部、１２……ピン
、２……可動部、２１……ゴム、３……軸、４…
…半導体素子、５……キヤリアテープ、５１……
位置決め穴。 1 and 2 are perspective views showing one embodiment of this invention, and FIG. 3 is a front view showing one embodiment of this invention. DESCRIPTION OF SYMBOLS 1... Fixed part, 11... Recessed part, 12... Pin, 2... Movable part, 21... Rubber, 3... Shaft, 4...
...Semiconductor element, 5...Carrier tape, 51...
positioning hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キヤリアテープの所定の位置へ半導体素子を個
別に押圧し接着する治具において、前記治具の固
定部中央に設けた半導体素子を嵌合し固定する窪
み部と、窪み部両側上面に設けたピンはキヤリア
テープの位置決め穴に挿入固定する固定部と該固
定部に回転軸を介して、連結した可動部の先端に
取付けたゴム等の弾性体押圧部の頂部平面で、固
定部上面に位置決めしたキヤリアテープと窪み部
に嵌合した半導体素子とを押圧し接着する可動部
を備えたことを特徴とする半導体素子テーピング
用治具。 A jig for individually pressing and bonding semiconductor elements to predetermined positions on a carrier tape, which includes a recess provided in the center of the fixing part of the jig into which the semiconductor element is fitted and fixed, and pins provided on the upper surface of both sides of the recess. is the top plane of a pressing part of an elastic body such as rubber attached to the tip of a movable part that is connected to a fixed part that is inserted and fixed into the positioning hole of the carrier tape through a rotating shaft, and is positioned on the upper surface of the fixed part. A jig for taping a semiconductor element, comprising a movable part that presses and adheres a carrier tape and a semiconductor element fitted into a recess.
JP1984202134U 1984-12-28 1984-12-28 Expired JPH0213288Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984202134U JPH0213288Y2 (en) 1984-12-28 1984-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984202134U JPH0213288Y2 (en) 1984-12-28 1984-12-28

Publications (2)

Publication Number Publication Date
JPS61117105U true JPS61117105U (en) 1986-07-24
JPH0213288Y2 JPH0213288Y2 (en) 1990-04-12

Family

ID=30764569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984202134U Expired JPH0213288Y2 (en) 1984-12-28 1984-12-28

Country Status (1)

Country Link
JP (1) JPH0213288Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243309A (en) * 2012-05-22 2013-12-05 Disco Abrasive Syst Ltd System for sticking surface protective tape

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561540A (en) * 1979-06-19 1981-01-09 Fujitsu Ltd Manufacture of semiconductor device
JPS59800U (en) * 1982-06-23 1984-01-06 トキコ株式会社 Air separation device in refueling equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS561540A (en) * 1979-06-19 1981-01-09 Fujitsu Ltd Manufacture of semiconductor device
JPS59800U (en) * 1982-06-23 1984-01-06 トキコ株式会社 Air separation device in refueling equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243309A (en) * 2012-05-22 2013-12-05 Disco Abrasive Syst Ltd System for sticking surface protective tape

Also Published As

Publication number Publication date
JPH0213288Y2 (en) 1990-04-12

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