JPS61112963A - 工具折損検出装置 - Google Patents

工具折損検出装置

Info

Publication number
JPS61112963A
JPS61112963A JP23542784A JP23542784A JPS61112963A JP S61112963 A JPS61112963 A JP S61112963A JP 23542784 A JP23542784 A JP 23542784A JP 23542784 A JP23542784 A JP 23542784A JP S61112963 A JPS61112963 A JP S61112963A
Authority
JP
Japan
Prior art keywords
tool
signal
sensitivity
breakage
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23542784A
Other languages
English (en)
Japanese (ja)
Other versions
JPH055621B2 (cg-RX-API-DMAC10.html
Inventor
Koji Takinami
滝波　孝治
Koichi Tsujino
辻野　孝一
Tatemitsu Hirayama
平山　盾満
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP23542784A priority Critical patent/JPS61112963A/ja
Publication of JPS61112963A publication Critical patent/JPS61112963A/ja
Publication of JPH055621B2 publication Critical patent/JPH055621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/14—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
JP23542784A 1984-11-08 1984-11-08 工具折損検出装置 Granted JPS61112963A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23542784A JPS61112963A (ja) 1984-11-08 1984-11-08 工具折損検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23542784A JPS61112963A (ja) 1984-11-08 1984-11-08 工具折損検出装置

Publications (2)

Publication Number Publication Date
JPS61112963A true JPS61112963A (ja) 1986-05-30
JPH055621B2 JPH055621B2 (cg-RX-API-DMAC10.html) 1993-01-22

Family

ID=16985946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23542784A Granted JPS61112963A (ja) 1984-11-08 1984-11-08 工具折損検出装置

Country Status (1)

Country Link
JP (1) JPS61112963A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPH055621B2 (cg-RX-API-DMAC10.html) 1993-01-22

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