JPS61111667U - - Google Patents
Info
- Publication number
- JPS61111667U JPS61111667U JP20082784U JP20082784U JPS61111667U JP S61111667 U JPS61111667 U JP S61111667U JP 20082784 U JP20082784 U JP 20082784U JP 20082784 U JP20082784 U JP 20082784U JP S61111667 U JPS61111667 U JP S61111667U
- Authority
- JP
- Japan
- Prior art keywords
- drying section
- soldering device
- flux
- section
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000007723 transport mechanism Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
第1図は本考案の乾燥部の概要を示す側面図、
第2図はプリント板に搭載された乾燥中の部品の
状態を示す斜視図、第3図は自動半田付け装置の
概略を示す平面図、第4図は洗浄部の構成を示す
側断面図、第5図は乾燥部を示す側断面図、第6
図は乾燥後プリント板に搭載された部品の状態を
示す斜視図である。
図に於いて、1は自動半田付け装置、2はフラ
ツクス槽、3は予備加熱部、4は半田槽、5は洗
浄部、6は乾燥部、7はプリント板、8は固定用
治具、9は搬送機構、10は第1のガイドレール
、11はアーム、12は台車、13はローラ、1
4は第2のガイドレール、15はフアン、16は
コネクタ、16aは凹部、16bはピン、17は
滲み、18は乾燥部、19はエアーガン、20は
クロロセンである。
Figure 1 is a side view showing an outline of the drying section of the present invention;
Fig. 2 is a perspective view showing the state of parts being dried mounted on a printed circuit board, Fig. 3 is a plan view schematically showing the automatic soldering device, and Fig. 4 is a side sectional view showing the configuration of the cleaning section. Figure 5 is a side sectional view showing the drying section;
The figure is a perspective view showing the state of the components mounted on the printed board after drying. In the figure, 1 is an automatic soldering device, 2 is a flux bath, 3 is a preheating section, 4 is a soldering bath, 5 is a cleaning section, 6 is a drying section, 7 is a printed board, 8 is a fixing jig, 9 is a transport mechanism, 10 is a first guide rail, 11 is an arm, 12 is a trolley, 13 is a roller, 1
4 is a second guide rail, 15 is a fan, 16 is a connector, 16a is a recess, 16b is a pin, 17 is a bleed, 18 is a drying part, 19 is an air gun, and 20 is a chlorocene.
Claims (1)
した後に半田槽で半田付けを行い、洗浄部で洗浄
して前記フラツクスを除去し、然る後乾燥部で乾
燥するように構成された半田付け装置に於いて、
前記乾燥部で前記プリント板に対する空気の吹付
けを表裏両面から行うようにしたことを特徴とす
る半田付け装置。 In a soldering device configured to apply flux to a presto board on which components are mounted, solder it in a soldering tank, wash it in a cleaning section to remove the flux, and then dry it in a drying section. There,
A soldering device characterized in that the drying section blows air onto the printed board from both the front and back sides.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20082784U JPS61111667U (en) | 1984-12-26 | 1984-12-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20082784U JPS61111667U (en) | 1984-12-26 | 1984-12-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61111667U true JPS61111667U (en) | 1986-07-15 |
Family
ID=30762037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20082784U Pending JPS61111667U (en) | 1984-12-26 | 1984-12-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61111667U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02256294A (en) * | 1988-12-15 | 1990-10-17 | Matsushita Electric Works Ltd | Warpage correcting device for printing wiring board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51125650A (en) * | 1975-04-25 | 1976-11-02 | Clarion Co Ltd | Automatic soldering device |
JPS5881555A (en) * | 1981-11-06 | 1983-05-16 | Tamura Seisakusho Co Ltd | Automatic soldering device |
-
1984
- 1984-12-26 JP JP20082784U patent/JPS61111667U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51125650A (en) * | 1975-04-25 | 1976-11-02 | Clarion Co Ltd | Automatic soldering device |
JPS5881555A (en) * | 1981-11-06 | 1983-05-16 | Tamura Seisakusho Co Ltd | Automatic soldering device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02256294A (en) * | 1988-12-15 | 1990-10-17 | Matsushita Electric Works Ltd | Warpage correcting device for printing wiring board |
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