JPS6042456U - soldering equipment - Google Patents

soldering equipment

Info

Publication number
JPS6042456U
JPS6042456U JP13180883U JP13180883U JPS6042456U JP S6042456 U JPS6042456 U JP S6042456U JP 13180883 U JP13180883 U JP 13180883U JP 13180883 U JP13180883 U JP 13180883U JP S6042456 U JPS6042456 U JP S6042456U
Authority
JP
Japan
Prior art keywords
solder tank
tank
printed circuit
electronic components
soldering device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13180883U
Other languages
Japanese (ja)
Inventor
山田　辰彦
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP13180883U priority Critical patent/JPS6042456U/en
Publication of JPS6042456U publication Critical patent/JPS6042456U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半田付装置の側面透視図、第２図は本考
案による半田付装置の側面透視図である。　　− １・・・溶融半田槽、３・・・フラックス槽、４・・・
プリント基板、８・・・集気ダクト、９・・・送風ファ
ン、１０・・・電子部品、１１・・・吹付ダクト。FIG. 1 is a side perspective view of a conventional soldering device, and FIG. 2 is a side perspective view of a soldering device according to the present invention. - 1... Molten solder tank, 3... Flux tank, 4...
Printed circuit board, 8...Air collection duct, 9...Blower fan, 10...Electronic components, 11...Blowing duct.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品が挿入あるいは搭載されたプリント基板を搬送
するコンベアに沿ってフラックス槽、溶融半田槽を設置
した半田付装置において、前記半田槽から発生する熱気
を回収し、これを半田槽に搬入されるプリント基板及び
電子部品に供給する予熱機構を備えたことを特徴とする
半田付装置。In a soldering device in which a flux tank and a molten solder tank are installed along a conveyor that transports printed circuit boards on which electronic components are inserted or mounted, the hot air generated from the solder tank is collected and transported to the solder tank. A soldering device characterized by being equipped with a preheating mechanism for supplying heat to printed circuit boards and electronic components.
JP13180883U 1983-08-26 1983-08-26 soldering equipment Pending JPS6042456U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13180883U JPS6042456U (en) 1983-08-26 1983-08-26 soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13180883U JPS6042456U (en) 1983-08-26 1983-08-26 soldering equipment

Publications (1)

Publication Number Publication Date
JPS6042456U true JPS6042456U (en) 1985-03-26

Family

ID=30297871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13180883U Pending JPS6042456U (en) 1983-08-26 1983-08-26 soldering equipment

Country Status (1)

Country Link
JP (1) JPS6042456U (en)

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