JPS5961567U - Printed circuit board solder welding equipment - Google Patents
Printed circuit board solder welding equipmentInfo
- Publication number
- JPS5961567U JPS5961567U JP15655082U JP15655082U JPS5961567U JP S5961567 U JPS5961567 U JP S5961567U JP 15655082 U JP15655082 U JP 15655082U JP 15655082 U JP15655082 U JP 15655082U JP S5961567 U JPS5961567 U JP S5961567U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- box
- circuit board
- solder welding
- welding apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す縦断正面図、第２図は
第１図の■−■断面図である。
Ａ・・・被処理部材、２・・・コンベア、５，６・・・
空気吸入口、１０・・・予熱部、１１・・・箱体、１２
・・・上ヒータ、１３・・・ファン、１４・・・整流板
、１５川下ヒータ、２−０・・・加熱部、３０・・・冷
却部、３２．・・・吸入ファン、３３・・・案内フード
、４０・・・排気ダクト、４１．４２・・・ダンパ、５
０・・・排気ファン。
−−Ｊ！＝１
１ ｌｌ
−Ｏ−
ＯFIG. 1 is a longitudinal sectional front view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line 1--2 of FIG. A... Part to be processed, 2... Conveyor, 5, 6...
Air intake port, 10... Preheating section, 11... Box body, 12
. . . Upper heater, 13. Fan, 14. Current plate, 15 Downstream heater, 2-0. Heating section, 30. Cooling section, 32. ... Suction fan, 33... Guide hood, 40... Exhaust duct, 41.42... Damper, 5
0...Exhaust fan. --J! =1 1ll -O- O
Claims (6)
ベア搬送面に離んで搬送方向上流側から下流側へ順に、
予熱部、加熱部および冷却部が配置されたプリント基板
の半田溶着装置において、前記予熱部は、前記コンベア
ベルトが貫通する断熱箱体と、該箱体内に設置されたヒ
ータと、該ヒータで加熱された空気を前記ベル”ト上の
被処理部材へ向って流動させるファンと、前記箱体の壁
に貫設された排気口とを有することを特徴とするプリン
ト基板の半田溶着装置。(1) A member to be processed is placed on the conveyor conveyance surface, and is separated from the conveyor conveyance surface in order from the upstream side to the downstream side in the conveyance direction.
In the printed circuit board solder welding apparatus in which a preheating section, a heating section, and a cooling section are arranged, the preheating section includes an insulating box through which the conveyor belt passes, a heater installed in the box, and heating by the heater. 1. A solder welding apparatus for printed circuit boards, comprising: a fan for causing the air to flow toward the workpiece on the belt; and an exhaust port penetrating the wall of the box body.
の範囲第１項記載のプリント基板の半田溶着装置。(2) The printed circuit board solder welding apparatus according to claim 1, wherein the preheating section is divided into upper and lower halves.
方向に沿って覆う整流板が搬送面に対しナーチ状にまた
がり、トンネルを形成した実用新案登録請求の範囲第１
項または第２項記載のプリント基板の半田溶着装置。(3) In the upper half of the preheating section, a rectifying plate that covers the conveyor conveyance surface along the flow direction straddles the conveyor surface in a narch shape, forming a tunnel.Claim 1 of Utility Model Registration
The solder welding device for a printed circuit board according to item 1 or 2.
新案登録請求の範囲第１項記載のプリント基板の半田溶
着装置。(4) The printed circuit board solder welding apparatus according to claim 1, wherein the heating section includes a radiant heater in the upper half.
タで加熱された空気を被処理部材へ向って流動させるフ
ァンと、前記箱体の壁に貫設された排気口とを有する実
用新案登録請求の範囲第１項記載のプリント基板の半田
溶着装置。(5) The heating section includes a heater installed inside the box, a fan that causes air heated by the heater to flow toward the workpiece, and an exhaust port penetrating the wall of the box. A printed circuit board solder welding apparatus according to claim 1 of the utility model registration claim.
箱体の側面で前記ベルトの上側に位置する部分に設けら
れた給気手段と、該給気手段からの電流を前記ベルトの
被処理部材搬送面へ向けて下方へ変向する土壁をもつ案
内フードと、前記箱体の土壁を貫通して接続された排気
ファンとを有し、前記被処理部材搬送面へ衝突した気流
が前記フードの側方から上方へ変向流動できるような間
隔がフードと箱体内面どの間に残された実用新案登録請
求の範囲第１項記載のプリント基板のパンダ溶着装置。(6) The cooling unit includes a box through which the conveyor belt passes, an air supply means provided on a side surface of the box above the belt, and a current from the air supply means to the belt. It has a guide hood having a clay wall that deflects downward toward the processing object conveyance surface, and an exhaust fan that is connected to the box body through the earthen wall, and collides with the processing object transfer surface. A panda welding apparatus for printed circuit boards according to claim 1, wherein a gap is left between the hood and the inner surface of the box body so that airflow can be diverted upward from the side of the hood.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15655082U JPS5961567U (en) | 1982-10-15 | 1982-10-15 | Printed circuit board solder welding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15655082U JPS5961567U (en) | 1982-10-15 | 1982-10-15 | Printed circuit board solder welding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5961567U true JPS5961567U (en) | 1984-04-23 |
| JPH0123666Y2 JPH0123666Y2 (en) | 1989-07-19 |
Family
ID=30345399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15655082U Granted JPS5961567U (en) | 1982-10-15 | 1982-10-15 | Printed circuit board solder welding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5961567U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63180368A (en) * | 1987-01-21 | 1988-07-25 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
| JPS63278668A (en) * | 1987-05-11 | 1988-11-16 | Eiteitsuku Tekutoron Kk | Reflow soldering device |
| JPH01215462A (en) * | 1988-02-23 | 1989-08-29 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49134551A (en) * | 1972-11-09 | 1974-12-25 | ||
| JPS5762859A (en) * | 1980-09-30 | 1982-04-16 | Chugai Ro Kogyo Kaisha Ltd | Method and furnace for aluminum brazing using protective atmosphere |
-
1982
- 1982-10-15 JP JP15655082U patent/JPS5961567U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49134551A (en) * | 1972-11-09 | 1974-12-25 | ||
| JPS5762859A (en) * | 1980-09-30 | 1982-04-16 | Chugai Ro Kogyo Kaisha Ltd | Method and furnace for aluminum brazing using protective atmosphere |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63180368A (en) * | 1987-01-21 | 1988-07-25 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
| JPS63278668A (en) * | 1987-05-11 | 1988-11-16 | Eiteitsuku Tekutoron Kk | Reflow soldering device |
| JPH01215462A (en) * | 1988-02-23 | 1989-08-29 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0123666Y2 (en) | 1989-07-19 |
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