JPH0353873U - - Google Patents
Info
- Publication number
- JPH0353873U JPH0353873U JP11500089U JP11500089U JPH0353873U JP H0353873 U JPH0353873 U JP H0353873U JP 11500089 U JP11500089 U JP 11500089U JP 11500089 U JP11500089 U JP 11500089U JP H0353873 U JPH0353873 U JP H0353873U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- warpage prevention
- prevention member
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002265 prevention Effects 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係るプリント配線基板の反り
防止機構の説明図となるプリント基板及び装置側
を示す斜視図、第２図は第１図における−断
面図、第３図は従来のプリント配線基板の反り防
止機構の説明図である。
２…保持爪、３…反り防止部材、４…プリント
配線基板、５…突起部材。
Fig. 1 is a perspective view showing the printed circuit board and device side, which is an explanatory diagram of the warpage prevention mechanism of the printed wiring board according to the present invention, Fig. 2 is a cross-sectional view taken from Fig. 1, and Fig. 3 is a conventional printed wiring board. It is an explanatory view of a warpage prevention mechanism of a board. 2... Holding claw, 3... Warpage prevention member, 4... Printed wiring board, 5... Projection member.
Claims (1)
基板の他面にはんだ付け装置の反り防止部材によ
つて支持され得る耐熱性を有し、且つ、はんだに
濡れない突起部材をこのプリント配線基板の長手
方向に一列に複数個突出させ、前記プリント配線
基板と前記反り防止部材との間に隙間を形成した
ことを特徴とするプリント配線基板の反り防止機
構。 On the other side of the printed wiring board on which electrical components etc. are mounted, a protruding member that has heat resistance that can be supported by the warpage prevention member of the soldering device and does not get wet with solder is attached along the longitudinal direction of the printed wiring board. A warpage prevention mechanism for a printed wiring board, characterized in that a plurality of members protrude in a line in a direction, and a gap is formed between the printed wiring board and the warpage prevention member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11500089U JPH0353873U (en) | 1989-09-29 | 1989-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11500089U JPH0353873U (en) | 1989-09-29 | 1989-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0353873U true JPH0353873U (en) | 1991-05-24 |
Family
ID=31663346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11500089U Pending JPH0353873U (en) | 1989-09-29 | 1989-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353873U (en) |
-
1989
- 1989-09-29 JP JP11500089U patent/JPH0353873U/ja active Pending
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