JPH0426573U - - Google Patents
Info
- Publication number
- JPH0426573U JPH0426573U JP6685390U JP6685390U JPH0426573U JP H0426573 U JPH0426573 U JP H0426573U JP 6685390 U JP6685390 U JP 6685390U JP 6685390 U JP6685390 U JP 6685390U JP H0426573 U JPH0426573 U JP H0426573U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- double
- foil pattern
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図乃至第３図はこの考案に係る両面プリン
ト基板の銅箔パターン接続装置の実施例を示し、
第１図は側断面図、第２図及び第３図は両面プリ
ント基板の接続状態を示す図である。
主な符号の説明、１……両面プリント基板の銅
箔パターン接続装置、２……接続ピン、３……チ
ヤツク、４……ヒーター、５……ローラ、６……
糸半田、１０……両面プリント基板、１１……孔
。
1 to 3 show an embodiment of the copper foil pattern connecting device for double-sided printed circuit boards according to this invention,
FIG. 1 is a side sectional view, and FIGS. 2 and 3 are diagrams showing the connection state of the double-sided printed circuit board. Explanation of main symbols, 1... Copper foil pattern connection device for double-sided printed circuit board, 2... Connection pin, 3... Chack, 4... Heater, 5... Roller, 6...
Thread solder, 10...Double-sided printed circuit board, 11...hole.
Claims (1)
ターンと他方の側に形成した銅箔パターンとをピ
ンを介して接続する両面プリント基板の銅箔パタ
ーン接続装置において、 前記ピンを保持するチヤツクの近傍にピンを加
熱するためのヒーターを設けると共に銅箔パター
ンとピンとを半田付けするための半田供給部を設
けたことを特徴とする両面プリント基板の銅箔パ
ターン接続装置。[Scope of Claim for Utility Model Registration] A copper foil pattern connecting device for a double-sided printed circuit board that connects a copper foil pattern formed on one side of a double-sided printed circuit board and a copper foil pattern formed on the other side of the double-sided printed circuit board via pins, A copper foil pattern connecting device for a double-sided printed circuit board, characterized in that a heater for heating the pin is provided near the chuck holding the pin, and a solder supply section is provided for soldering the copper foil pattern and the pin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6685390U JPH0426573U (en) | 1990-06-26 | 1990-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6685390U JPH0426573U (en) | 1990-06-26 | 1990-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426573U true JPH0426573U (en) | 1992-03-03 |
Family
ID=31599919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6685390U Pending JPH0426573U (en) | 1990-06-26 | 1990-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426573U (en) |
-
1990
- 1990-06-26 JP JP6685390U patent/JPH0426573U/ja active Pending
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