JPS61111549A - 半導体ワイヤボンデイング装置 - Google Patents

半導体ワイヤボンデイング装置

Info

Publication number
JPS61111549A
JPS61111549A JP59232905A JP23290584A JPS61111549A JP S61111549 A JPS61111549 A JP S61111549A JP 59232905 A JP59232905 A JP 59232905A JP 23290584 A JP23290584 A JP 23290584A JP S61111549 A JPS61111549 A JP S61111549A
Authority
JP
Japan
Prior art keywords
detection area
bonding
positional deviation
reference coordinate
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59232905A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0570934B2 (enExample
Inventor
Mitsuki Tsukada
塚田　光記
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59232905A priority Critical patent/JPS61111549A/ja
Publication of JPS61111549A publication Critical patent/JPS61111549A/ja
Publication of JPH0570934B2 publication Critical patent/JPH0570934B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59232905A 1984-11-05 1984-11-05 半導体ワイヤボンデイング装置 Granted JPS61111549A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59232905A JPS61111549A (ja) 1984-11-05 1984-11-05 半導体ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59232905A JPS61111549A (ja) 1984-11-05 1984-11-05 半導体ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS61111549A true JPS61111549A (ja) 1986-05-29
JPH0570934B2 JPH0570934B2 (enExample) 1993-10-06

Family

ID=16946672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59232905A Granted JPS61111549A (ja) 1984-11-05 1984-11-05 半導体ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61111549A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013051278A (ja) * 2011-08-30 2013-03-14 Hitachi High-Tech Instruments Co Ltd ダイボンダ及び半導体製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013051278A (ja) * 2011-08-30 2013-03-14 Hitachi High-Tech Instruments Co Ltd ダイボンダ及び半導体製造方法

Also Published As

Publication number Publication date
JPH0570934B2 (enExample) 1993-10-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term