JPS61111549A - 半導体ワイヤボンデイング装置 - Google Patents
半導体ワイヤボンデイング装置Info
- Publication number
- JPS61111549A JPS61111549A JP59232905A JP23290584A JPS61111549A JP S61111549 A JPS61111549 A JP S61111549A JP 59232905 A JP59232905 A JP 59232905A JP 23290584 A JP23290584 A JP 23290584A JP S61111549 A JPS61111549 A JP S61111549A
- Authority
- JP
- Japan
- Prior art keywords
- detection area
- bonding
- positional deviation
- reference coordinate
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/90—
-
- H10W72/932—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59232905A JPS61111549A (ja) | 1984-11-05 | 1984-11-05 | 半導体ワイヤボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59232905A JPS61111549A (ja) | 1984-11-05 | 1984-11-05 | 半導体ワイヤボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61111549A true JPS61111549A (ja) | 1986-05-29 |
| JPH0570934B2 JPH0570934B2 (cg-RX-API-DMAC10.html) | 1993-10-06 |
Family
ID=16946672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59232905A Granted JPS61111549A (ja) | 1984-11-05 | 1984-11-05 | 半導体ワイヤボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61111549A (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013051278A (ja) * | 2011-08-30 | 2013-03-14 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ及び半導体製造方法 |
-
1984
- 1984-11-05 JP JP59232905A patent/JPS61111549A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013051278A (ja) * | 2011-08-30 | 2013-03-14 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ及び半導体製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0570934B2 (cg-RX-API-DMAC10.html) | 1993-10-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |