JPS61110441A - マイクロエレクトロニツク素子を電気的に接続するための変形可能のマルチ結合の製法 - Google Patents

マイクロエレクトロニツク素子を電気的に接続するための変形可能のマルチ結合の製法

Info

Publication number
JPS61110441A
JPS61110441A JP60243051A JP24305185A JPS61110441A JP S61110441 A JPS61110441 A JP S61110441A JP 60243051 A JP60243051 A JP 60243051A JP 24305185 A JP24305185 A JP 24305185A JP S61110441 A JPS61110441 A JP S61110441A
Authority
JP
Japan
Prior art keywords
electroplating
substrate
manufacturing
plate
deformable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60243051A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0482055B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
ヴオルフガング・エールフエルト
ペーター・ハークマン
デイートリツヒ・ミユンヒマイヤー
エルヴイン・ヴイリイ・ベツカー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Karlsruher Institut fuer Technologie KIT
Original Assignee
Kernforschungszentrum Karlsruhe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kernforschungszentrum Karlsruhe GmbH filed Critical Kernforschungszentrum Karlsruhe GmbH
Publication of JPS61110441A publication Critical patent/JPS61110441A/ja
Publication of JPH0482055B2 publication Critical patent/JPH0482055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Micromachines (AREA)
JP60243051A 1984-11-02 1985-10-31 マイクロエレクトロニツク素子を電気的に接続するための変形可能のマルチ結合の製法 Granted JPS61110441A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3440109.1 1984-11-02
DE19843440109 DE3440109A1 (de) 1984-11-02 1984-11-02 Verfahren zur herstellung verformbarer vielfach-verbindungen fuer den elektrischen anschluss mikroelektronischer bauelemente und nach diesem verfahren hergestellte vielfachverbindungen

Publications (2)

Publication Number Publication Date
JPS61110441A true JPS61110441A (ja) 1986-05-28
JPH0482055B2 JPH0482055B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-25

Family

ID=6249359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60243051A Granted JPS61110441A (ja) 1984-11-02 1985-10-31 マイクロエレクトロニツク素子を電気的に接続するための変形可能のマルチ結合の製法

Country Status (3)

Country Link
EP (1) EP0183910A3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS61110441A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3440109A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01155633A (ja) * 1987-12-14 1989-06-19 Hitachi Ltd 半導体装置
JPH01170035A (ja) * 1987-12-02 1989-07-05 Amp Inc マイクロ入出力ピンおよびその製造方法
JPH0277138A (ja) * 1987-10-28 1990-03-16 Hitachi Ltd 電子部品の接続構造及びそれを用いた電子装置
JPH03502388A (ja) * 1988-02-05 1991-05-30 レイケム・リミテッド 単一軸状電気伝導部品の製造方法
US6129559A (en) * 1996-01-19 2000-10-10 Sumitomo Electric Industries, Ltd. Microconnector and method of manufacturing the same
US7692521B1 (en) 2005-05-12 2010-04-06 Microassembly Technologies, Inc. High force MEMS device
US7750462B1 (en) 1999-10-12 2010-07-06 Microassembly Technologies, Inc. Microelectromechanical systems using thermocompression bonding

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2643754B1 (fr) * 1989-02-28 1993-09-17 Thomson Brandt Armements Procede de realisation d'une connexion a plat
US20020096421A1 (en) 2000-11-29 2002-07-25 Cohn Michael B. MEMS device with integral packaging
CH708113B1 (de) 2007-09-13 2014-12-15 Stéphane Von Gunten Anker für eine Uhrenhemmung.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1387587A (en) * 1971-07-22 1975-03-19 Plessey Co Ltd Electrical interconnectors and connector assemblies
US4067104A (en) * 1977-02-24 1978-01-10 Rockwell International Corporation Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components
DE3039110A1 (de) * 1980-10-16 1982-05-13 Siemens AG, 1000 Berlin und 8000 München Verfahren fuer die spannungsfreie entwicklung von bestrahlten polymethylmetacrylatschichten

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0277138A (ja) * 1987-10-28 1990-03-16 Hitachi Ltd 電子部品の接続構造及びそれを用いた電子装置
JPH01170035A (ja) * 1987-12-02 1989-07-05 Amp Inc マイクロ入出力ピンおよびその製造方法
JPH01155633A (ja) * 1987-12-14 1989-06-19 Hitachi Ltd 半導体装置
JPH03502388A (ja) * 1988-02-05 1991-05-30 レイケム・リミテッド 単一軸状電気伝導部品の製造方法
US6129559A (en) * 1996-01-19 2000-10-10 Sumitomo Electric Industries, Ltd. Microconnector and method of manufacturing the same
US7750462B1 (en) 1999-10-12 2010-07-06 Microassembly Technologies, Inc. Microelectromechanical systems using thermocompression bonding
US7692521B1 (en) 2005-05-12 2010-04-06 Microassembly Technologies, Inc. High force MEMS device

Also Published As

Publication number Publication date
DE3440109A1 (de) 1986-05-07
EP0183910A2 (de) 1986-06-11
EP0183910A3 (de) 1989-01-04
DE3440109C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-05-27
JPH0482055B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-25

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