JPS61108139A - 導体切出し配線板 - Google Patents

導体切出し配線板

Info

Publication number
JPS61108139A
JPS61108139A JP59229525A JP22952584A JPS61108139A JP S61108139 A JPS61108139 A JP S61108139A JP 59229525 A JP59229525 A JP 59229525A JP 22952584 A JP22952584 A JP 22952584A JP S61108139 A JPS61108139 A JP S61108139A
Authority
JP
Japan
Prior art keywords
conductor
insulating plate
plate
cut
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59229525A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0584079B2 (https=
Inventor
Hisayoshi Kaneda
金田　久好
Tsuneo Sato
常雄 佐藤
Yoshiharu Kubota
久保田　芳晴
Teizo Fujii
藤井　禎三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59229525A priority Critical patent/JPS61108139A/ja
Publication of JPS61108139A publication Critical patent/JPS61108139A/ja
Publication of JPH0584079B2 publication Critical patent/JPH0584079B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
JP59229525A 1984-10-31 1984-10-31 導体切出し配線板 Granted JPS61108139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59229525A JPS61108139A (ja) 1984-10-31 1984-10-31 導体切出し配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59229525A JPS61108139A (ja) 1984-10-31 1984-10-31 導体切出し配線板

Publications (2)

Publication Number Publication Date
JPS61108139A true JPS61108139A (ja) 1986-05-26
JPH0584079B2 JPH0584079B2 (https=) 1993-11-30

Family

ID=16893532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59229525A Granted JPS61108139A (ja) 1984-10-31 1984-10-31 導体切出し配線板

Country Status (1)

Country Link
JP (1) JPS61108139A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012169550A1 (ja) * 2011-06-06 2015-02-23 凸版印刷株式会社 金属箔パターン積層体，金属箔積層体，金属箔積層基板，太陽電池モジュール，及び金属箔パターン積層体の製造方法
JP2015070230A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 太陽電池モジュール用の集電シート
JP6277342B1 (ja) * 2016-11-04 2018-02-07 達也 宮崎 電子回路用の金属箔基板とパターンの形成方法およびこれを用いた装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012169550A1 (ja) * 2011-06-06 2015-02-23 凸版印刷株式会社 金属箔パターン積層体，金属箔積層体，金属箔積層基板，太陽電池モジュール，及び金属箔パターン積層体の製造方法
JP2015070230A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 太陽電池モジュール用の集電シート
JP6277342B1 (ja) * 2016-11-04 2018-02-07 達也 宮崎 電子回路用の金属箔基板とパターンの形成方法およびこれを用いた装置

Also Published As

Publication number Publication date
JPH0584079B2 (https=) 1993-11-30

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