JPS611061A - Manufacture of photodetector containing filter - Google Patents
Manufacture of photodetector containing filterInfo
- Publication number
- JPS611061A JPS611061A JP60102330A JP10233085A JPS611061A JP S611061 A JPS611061 A JP S611061A JP 60102330 A JP60102330 A JP 60102330A JP 10233085 A JP10233085 A JP 10233085A JP S611061 A JPS611061 A JP S611061A
- Authority
- JP
- Japan
- Prior art keywords
- film
- light receiving
- filter effect
- chip
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 230000000694 effects Effects 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims abstract 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract 1
- 238000004299 exfoliation Methods 0.000 abstract 1
- 238000001914 filtration Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 2
- 241000469816 Varus Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、フィルターを内蔵した受光素子の製法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a light receiving element incorporating a filter.
近年、テレビ受像機、音響機器等に赤外発行ダイオード
とシリコン受光素子を用いて遠方からテレビ受像機のチ
ャンネル切り替え、電源のオン・オフ等が行なえる遠方
操作（クモート・コントロール）方式が増加してきた。In recent years, there has been an increase in the use of remote control systems that use infrared emitting diodes and silicon light-receiving elements for television receivers, audio equipment, etc. to switch channels and turn on/off the power of television receivers from a distance. Ta.
遠方操作では、赤外発光ダイオードのピーク発光波長（
λｐ＝９４０ｎｍ）の比較的近くに受光感度ピーク（λ
ｐ＝８９０ｎｍ）をもち、しかも受光効率の高いシリコ
ン受光素子を使用している。For remote operation, the peak emission wavelength of an infrared light emitting diode (
The light receiving sensitivity peak (λp=940nm) is relatively close to
p=890 nm), and uses a silicon light receiving element with high light receiving efficiency.
しかし、このシリコン受光素子の受光感度域は、可視域
から赤外域へと広く、受光するため、遠方操作等に使う
と、太陽光・蛍光灯といった外来光により誤動作をおこ
す。このため、従来、こうしたシリコン受光素子外部容
器の前面に赤外域を通し、可視域をカットするフィルタ
効果を有する膜を置いたり、接着したりしていた。しか
し、このように、受光素子外部の前面に置いたり、接着
する方法は、膜固定のむずかしさ、外付は工数の増加、
接むけかれ等信頼性が悪いという欠点があった。However, this silicon light-receiving element has a wide light-receiving sensitivity range from the visible region to the infrared region, so if it is used for remote operation, it may malfunction due to external light such as sunlight or fluorescent lamps. For this reason, conventionally, a film having a filter effect that passes infrared light and cuts visible light has been placed or bonded on the front surface of such a silicon light-receiving element external container. However, this method of placing or gluing the light-receiving element on the outside front requires difficulty in fixing the film, and mounting it externally increases the number of man-hours.
The disadvantage was that it was unreliable in contact.
本発明の目的は、こういった膜固定のむずかしさ、外付
は工数増加、抜打はかれ等の欠点をなくした受光素子の
製造方法を提供することにある。An object of the present invention is to provide a method for manufacturing a light receiving element that eliminates the drawbacks such as difficulty in fixing the film, increased man-hours for external attachment, and damage caused by spot punching.
本発明によればリード線上の受光チップの前面Ｉこフィ
ルタ効果を有する股を置き、受光チップと膜を同じ外器
内に同時に樹脂封止する受光素子の製造方法が得られる
。According to the present invention, there is provided a method of manufacturing a light receiving element in which a crotch having a filtering effect is placed on the front surface of the light receiving chip on a lead wire, and the light receiving chip and the film are simultaneously sealed with resin in the same outer case.
以下、図面を参照して説明する。This will be explained below with reference to the drawings.
第１図は、従来の方式による一実施例で、リード線４に
接続された受光デツプ１を樹脂２で樹脂封止した受光素
子外部の前面にフィルタ効果を有する膜３を接着により
取り付けたものである。Fig. 1 shows an example of a conventional method, in which a light receiving depth 1 connected to a lead wire 4 is sealed with resin 2, and a film 3 having a filter effect is attached by adhesive to the front surface of the outside of the light receiving element. It is.
第２図は、本発明による一実施例で、リード線４上−こ
接続された受光チップｌの前面にフィルタ効果を有する
膜３を置き、受光チップ１とフィルタ効果を有する膜３
を同時に樹脂２で樹脂封止したものである。この方法は
、フィルタ効果を有する膜が内蔵されるため、膜固定の
むずかしさ、膜取り付は工数の増加、接着はがれ等によ
る信顆性低下といった欠点が除去されるという効果を有
する。FIG. 2 shows an embodiment according to the present invention, in which a film 3 having a filtering effect is placed in front of a light receiving chip l connected on a lead wire 4, and the film 3 having a filtering effect is placed between the light receiving chip 1 and the film 3 having a filtering effect.
are resin-sealed with resin 2 at the same time. This method has the effect of eliminating drawbacks such as difficulty in fixing the membrane, increased man-hours for membrane attachment, and decreased condylar reliability due to adhesive peeling, etc., because the membrane having a filter effect is built-in.
第１図は従来の受光素子の断面図、第２図は本発明の一
実施例による断面図。
１・・・・・・受光チップ、２・・・・・・樹脂（外部
容器）、３・・・・・・フィルタ効果を有する膜、４・
−・・・・リード線。
代理人 弁理士 内反 ｒ＄１′１．”；Ｊ第ｌ阿
′″ｌ１ｆＴ２回
ＱＱり一FIG. 1 is a sectional view of a conventional light receiving element, and FIG. 2 is a sectional view of an embodiment of the present invention. 1... Light receiving chip, 2... Resin (external container), 3... Film having filter effect, 4...
−・・・Lead wire. Agent Patent attorney Varus r$1'1. ”;
Claims (1)
タ効果を有する膜を置き、該受光素子チップと該膜とも
リード線とを同時に樹脂封止することを特徴とする受光
素子の製造方法。A method of manufacturing a light receiving element, comprising: placing a film having a filter effect on the front surface of a light receiving element chip connected to a lead wire, and sealing the light receiving element chip, the film, and the lead wire with a resin at the same time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60102330A JPS611061A (en) | 1985-05-13 | 1985-05-13 | Manufacture of photodetector containing filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60102330A JPS611061A (en) | 1985-05-13 | 1985-05-13 | Manufacture of photodetector containing filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS611061A true JPS611061A (en) | 1986-01-07 |
Family
ID=14324516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60102330A Pending JPS611061A (en) | 1985-05-13 | 1985-05-13 | Manufacture of photodetector containing filter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS611061A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63175483A (en) * | 1987-01-14 | 1988-07-19 | Canon Inc | Production of optical semiconductor device |
| DE102004013077B4 (en) * | 2003-03-17 | 2009-04-02 | Citizen Electronics Co., Ltd., Fujiyoshida-shi | Method for producing a photodetector |
-
1985
- 1985-05-13 JP JP60102330A patent/JPS611061A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63175483A (en) * | 1987-01-14 | 1988-07-19 | Canon Inc | Production of optical semiconductor device |
| DE102004013077B4 (en) * | 2003-03-17 | 2009-04-02 | Citizen Electronics Co., Ltd., Fujiyoshida-shi | Method for producing a photodetector |
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