GB2229857A - Electro-optic transducer secured to integrated circuit package - Google Patents

Electro-optic transducer secured to integrated circuit package Download PDF

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Publication number
GB2229857A
GB2229857A GB8907287A GB8907287A GB2229857A GB 2229857 A GB2229857 A GB 2229857A GB 8907287 A GB8907287 A GB 8907287A GB 8907287 A GB8907287 A GB 8907287A GB 2229857 A GB2229857 A GB 2229857A
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United Kingdom
Prior art keywords
electro
package
optic transducer
dual
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8907287A
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GB8907287D0 (en
GB2229857B (en
Inventor
Alan Edward Dinnewell
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STC PLC
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STC PLC
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Priority to GB8907287A priority Critical patent/GB2229857B/en
Publication of GB8907287D0 publication Critical patent/GB8907287D0/en
Publication of GB2229857A publication Critical patent/GB2229857A/en
Application granted granted Critical
Publication of GB2229857B publication Critical patent/GB2229857B/en
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4262—Details of housings characterised by the shape of the housing
    • G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4262—Details of housings characterised by the shape of the housing
    • G02B6/4263—Details of housings characterised by the shape of the housing of the transisitor outline [TO] can type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4283—Electrical aspects with electrical insulation means
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/48195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
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    • H01L2924/30107—Inductance

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)

Abstract

The terminals (24) of a mount carrying an electro-optic transducer are directly secured to terminals (19) of a lead-frame based integrated circuit dual-in-line package that protrude from one end of the package encapsulaton (18). The package includes drive circuitry for the transducer. The electro-optic transducer may be a light emitting diode or a photodetector. The transducer mount may be accommodated in the rear end of an optical fibre connector (40) and the whole protected by encapsulation (50). <IMAGE>

Description

Semiconductor Device Package This invention relates to semiconductor device packages that include an electro-optic transducer together with associated electronic circuitry. An led (light emissive diode) is one such form of electro-optic transducer, and a semiconductor photodetector is another. In the case of an led package, the associated electronic circuitry will comprise a modulator.
Particularly in the case of a package containing an edge emitting led, such circuitry will typically include drive circuitry made functionally dependent upon temperature since typically edge emitting led is found to exhibit a significantly greater temperature coefficient than the equivalent surface emitting led.
In the case of a photodetector package, the associated electronic circuitry will include a front end amplifier, and this will typically be followed by one or two more amplifiers. Where two amplifiers follow the front-end amplifier, one of these further amplifiers is typically a limiting amplifier used for pulse shaping.
Additionally a status detector may be included for sensing the presence of optical traffic, and circuitry may be included to lock the data output in the sensed absence of optical traffic in order to prevent the generation of spurious chatter.
In both types of transducer package, it is desirable to mount the transducer close to its associated circuitry in order to be able to have short connecting leads. In the case of an led package, this is primarily in order to minimise self-inductance problems which are otherwise liable to set an unacceptably low limit to the maximum data rate the device is capable of handling. In the case of a photodetector package, this is primarily in order to minimise capacitance and the risk of picking up stray signals which are liable to swamp the extremely small signal current provided by the photodetector chip.
It is known to provide such associated electronic circuitry on a hybrid film circuit ceramic substrate,and to attach a transducer mount by its leads direct to that hybrid film circuit.
The assembly of hybrid film circuits typically has a number of disadvantages, including that of cost, when compared with the manufacture of equivalent circuits that are manufactured as packaged integrated circuit devices by the well-established method in which the components of the device are mounted on an integrated circuit lead-frame, for instance that of a DIL package, and are then encapsulated in a conventional manner in a suitable moulding resin. On the other hand the conventional format of lead-frame based DIL package is not suitable for electronic circuitry directly connected to the mount of an led because of the undue length of connection involved in taking leads from the led mount down through the circuit board, to which the DIL package is attached, and along to make contact with the DIL package pins.In the case of making connection with a photodetector, the problem of undue length of lead connection is associated with the fact that these leads can not readily be screened.
According to the present invention there is provided an electro-optic transducer package which contains an electro-optic transducer mounted on an electro-optic transducer mount and contains a lead-frame based integrated circuit dual-in-line package with additional terminal pins extending from one end of the dual-in-line package, to which additional terminal pins the leads of the electro-optic transducer mount are directly secured.
In the case of packages whose electro-optic transducers are optical sources the power dissipation of the modulator may be several times that of the source.
Under these circumstances, this use of a lead-frame DIL package, in place of a hybrid film circuit, can facilitate thermal management. Also, for reasons of efficient thermal management, instead of adopting the more usual practice of mounting any integrated circuit chip on an electrically isolated die plate, it is generally preferred to use a design of lead-frame in which the die plate is integrally connected with one or more of the DIL package pins.
There follows a description of electro-optic transducer packages embodying the invention in preferred forms. The description refers to the accompanying drawings in which: Fig. 1 depicts the lead-frame of a dual-in-line modulator package for an led, Fig. 2 and 3 respectively depict led chip and photodetector chip mounts, Figure 4 depicts a connector tube for either of the mounts of Figures 2 and 3, and Fig. 5 depicts a package comprising the connector tube of Figure 4 the led mount of Figure 2 and the dual-in-line package of Figure 1.
Referring to Figure 1, a dual-in-line lead-frame 10 for an led modulator has a die plate 11 on which an integrated circuit chip 12 is mounted.
Additional discrete components comprise two capacitors 13, 14 and a resistor 15. In accordance with normal practice, the lead-frame is initially constructed with two webs 16 which link the members of two sets of terminal pins 17, and then, subsequent to encapsulation of the integrated circuit chip and the other discrete components, these webs 16, which lie just outside the perimeter 18 of the encapsulation, are cropped off at the same time as the terminal pins are folded down to form the dual-in-line pin array. In this design of lead-frame the die plate 11 is left integrally connected with two of the sixteen pins 17 subsequent to the cropping off of the webs 16.Unlike more conventional dual-in-line lead-frame based packages, this lead-frame design provides two additional terminals 19 which protrude from one end of the encapsulation 18 and are initially linked by a web 16a which is cropped off at the same time as the cropping off of webs 16. These terminals 19 are not folded down with the folding of the pins 17, but are left unbent.
The equivalent lead-frame for a photodetector amplifier (not illustrated) may have the same layout of pins 17 terminals 19 and webs 16, 16a external of the encapsulation, but the internal layout is arranged differently. The die plate is similarly integrally connected with at least one of the terminal pins 17, but in this instance, is large enough to accommodate two integrated circuit chips. In place of two terminals 19 there may be three, with consequent modification of the web 16a.
Mounts respectively for the led chip and the photodetector chip are depicted in Figure 2 and 3. Each mount has a generally cylindrically-shaped base member 20 to the underside of which is secured a flange 21.
The led mount has a generally Dee-shaped heat sink 22 attached to the base 20, and an edge emissive led chip 23 is secured to the side of this heat sink with its emitting facet substantially flush with the front of the heat sink. One terminal connection with the led chip 23 is by way of a terminal pin 24 and flying-lead connection 25. Terminal pin 24 threads an electrically insulating seal 26 in the base member and flange assembly. The other terminal connection is by way of a terminal pin 27 secured to the base member and flange assembly, and by way of that assembly and the heat sink.
The photodetector mount has its photodetector chip 30 mounted on the front face of the base member 20 with an intervening ceramic substrate 31 to prove electrical insulation. One terminal connection with the chip is by way of a terminal pin 32 and a flying lead 33 making connection with the front face of the chip 30.
The other terminal connection with the chip is by way of a second terminal pin 34 and a second flying lead 35.
This flying lead 35 makes electrical connection with the rear face of the chip 30 by way of the substrate 31 prior to assembly. Both terminal pins thread electrically insulating seals 36 in the base member and flange assembly. A third terminal pin 37 is secured directly in the assembly so as to make direct electrical connection with that assembly.
The mount, complete with its led or photodetector chip, is located in the rear end of an optical fibre connector tube 40 (Figure 4). The forward end of this tube has a chamber 41 for receiving the forward end of a mating fibre connector (not shown).
This mating connector is engaged with the connector tube 40 by means of bayonet pins 42. The rear of the receiving chamber 41 communicates with an inner chamber 43 of smaller diameter for receiving a ferrule-terminated optical fibre portion (not shown) of the mating connector. The end of this ferrule is urged against an internal shoulder 44 so that its fibre end is held in a predetermined relationship with respect to a lens 45, typically a graded index lens, secured in a bore to the rear of the shoulder 44. The electro-optic transducer mount (not shown in Figure 4) is then located in the chamber 46 at the rear end of the connector tube, and its position adjusted for optimum optical coupling with the fibre of the mating connector before being secured in that position by welding the flange of the mount to the rear face of the connector tube 40.In the case of a connector tube 40 made of moulded plastics material, a metal ring 47 is moulded into a plastics connector tube to provide a rear face to which the flange can be welded.
When the transducer mount has been welded in position in the connector tube 40, for instance by laser beam welding, the resulting assembly is ready for attachment,as depicted in Figure 5, to the lead-frame based dual-in-line package. In the case of a connector tube and led mount assembly, as illustrated in Figure 5, terminal pin 24 of the mount is welded, or alternatively soldered, to the nearer one of terminals 17 of the dual-in-line package 18 while, behind pin 24, pin 27 is similarly welded to the-other terminal 19. Welding is preferably achieved by laser beam welding. In the case of attaching the lead-frame based dual-in-line amplifier package to a connector tube and photodetector mount assembly, the connections are different according to whether the dual-in-line package is provided with two or three terminal pins extending forwardly of the end of the package. If there are three, then the three pins 32,34 and 37 of the mount are connected respectively to the three pins of the dual-in-line package. If there are only two, then the outer pins 32 and 34 are connected to the two pins of the dual-in-line package while the third pin 37 of the mount is connected to a screen (not shown) which covers the top and bottom surfaces of the dual-in-line package moulding.
Finally the joint between the led or photodetector mount and its associated dual-in-line package is protected by encapsulation 50 (Figure 5).
This encapsulation extends around a forward-facing external shoulder 51 on the connector tube 40, and also around two lugs 52 protruding from the rear face of the connector tube 40 in order to restrain both axial movement and rotation of the connector dual with respect to the dual-in-line package.

Claims (6)

CLAIMS.
1. An electro-optic transducer package which contains an electro-optic transducer mounted on an electro-optic transducer mount and contains a lead-frame based integrated circuit dual-in-line package with additional terminal pin#s extending from one end of the dual-in-line package, to which additional terminal pins the leads of the electro-optic transducer mount are directly secured.
2. An electro-optic transducer package as claimed in claim 1, which electro-optic transducer package includes an optical fibre connector adapted to receive a ferrule-terminated optical fibre and locate it in optically coupled relationship with the electro-optic transducer.
3. An electro-optic transducer package as claimed in claim 1 or 2, wherein the lead-frame of the dual-in-line package includes a die plate integrally connected with one or more of the dual-in-line terminal pins of the lead-frame package.
4. An electro-optic transducer package as claimed in claim 1, 2 or 3 wherein the electro-optic transducer is a light emissive diode.
5. An electro-optic transducer package as claimed in claim 1, 2 or 3 wherein the electro-optic transducer is a photodetector.
6. An electro-optic transducer package substantially as hereinbefore described with reference to the accompanying drawings.
GB8907287A 1989-03-31 1989-03-31 Semiconductor device package Expired - Lifetime GB2229857B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8907287A GB2229857B (en) 1989-03-31 1989-03-31 Semiconductor device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8907287A GB2229857B (en) 1989-03-31 1989-03-31 Semiconductor device package

Publications (3)

Publication Number Publication Date
GB8907287D0 GB8907287D0 (en) 1989-05-17
GB2229857A true GB2229857A (en) 1990-10-03
GB2229857B GB2229857B (en) 1992-12-23

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ID=10654249

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8907287A Expired - Lifetime GB2229857B (en) 1989-03-31 1989-03-31 Semiconductor device package

Country Status (1)

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GB (1) GB2229857B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0510859A2 (en) * 1991-04-25 1992-10-28 AT&T Corp. Molded optical package utilizing leadframe technology
EP0510860A2 (en) * 1991-04-25 1992-10-28 AT&T Corp. Molded optical packaging arrangement
DE19508284A1 (en) * 1994-06-24 1996-01-04 Hewlett Packard Co Optical transceiver for optical communication system
GB2432457A (en) * 2005-11-16 2007-05-23 Bosch Gmbh Robert Sensor arrangement and method for fabricating a sensor arrangement
WO2012094720A1 (en) * 2011-01-12 2012-07-19 Nii Northern International Inc. Light emitting diode with oscillator

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0510859A2 (en) * 1991-04-25 1992-10-28 AT&T Corp. Molded optical package utilizing leadframe technology
EP0510860A2 (en) * 1991-04-25 1992-10-28 AT&T Corp. Molded optical packaging arrangement
EP0510860A3 (en) * 1991-04-25 1993-03-10 American Telephone And Telegraph Company Molded optical packaging arrangement
EP0510859A3 (en) * 1991-04-25 1993-03-10 American Telephone And Telegraph Company Molded optical package utilizing leadframe technology
DE19508284A1 (en) * 1994-06-24 1996-01-04 Hewlett Packard Co Optical transceiver for optical communication system
DE19508284C2 (en) * 1994-06-24 1998-12-10 Hewlett Packard Co Optical transmit / receive module with various possible mounting positions on a circuit board
GB2432457A (en) * 2005-11-16 2007-05-23 Bosch Gmbh Robert Sensor arrangement and method for fabricating a sensor arrangement
GB2432457B (en) * 2005-11-16 2008-01-23 Bosch Gmbh Robert Sensor arrangement having a substrate and having a casing and method for fabricating a sensor arrangement
WO2012094720A1 (en) * 2011-01-12 2012-07-19 Nii Northern International Inc. Light emitting diode with oscillator
US8618741B2 (en) 2011-01-12 2013-12-31 Winvic Sales Inc. Light emitting diode with oscillator

Also Published As

Publication number Publication date
GB8907287D0 (en) 1989-05-17
GB2229857B (en) 1992-12-23

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Effective date: 19950331