JPS61105852A - ワイヤボンダ - Google Patents

ワイヤボンダ

Info

Publication number
JPS61105852A
JPS61105852A JP60172342A JP17234285A JPS61105852A JP S61105852 A JPS61105852 A JP S61105852A JP 60172342 A JP60172342 A JP 60172342A JP 17234285 A JP17234285 A JP 17234285A JP S61105852 A JPS61105852 A JP S61105852A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding
wedge
wire
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60172342A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131297B2 (enExample
Inventor
Kazuhisa Takashima
高島　一壽
Tokio Iguchi
井口　時男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP60172342A priority Critical patent/JPS61105852A/ja
Publication of JPS61105852A publication Critical patent/JPS61105852A/ja
Publication of JPH0131297B2 publication Critical patent/JPH0131297B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP60172342A 1985-08-07 1985-08-07 ワイヤボンダ Granted JPS61105852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60172342A JPS61105852A (ja) 1985-08-07 1985-08-07 ワイヤボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60172342A JPS61105852A (ja) 1985-08-07 1985-08-07 ワイヤボンダ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12683979A Division JPS5651832A (en) 1979-10-03 1979-10-03 Method and apparatus for wire bonding

Publications (2)

Publication Number Publication Date
JPS61105852A true JPS61105852A (ja) 1986-05-23
JPH0131297B2 JPH0131297B2 (enExample) 1989-06-26

Family

ID=15940126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60172342A Granted JPS61105852A (ja) 1985-08-07 1985-08-07 ワイヤボンダ

Country Status (1)

Country Link
JP (1) JPS61105852A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206407A (ja) * 2008-02-29 2009-09-10 Morioka Seiko Instruments Inc ワイヤーボンド方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5651832A (en) * 1979-10-03 1981-05-09 Hitachi Ltd Method and apparatus for wire bonding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5651832A (en) * 1979-10-03 1981-05-09 Hitachi Ltd Method and apparatus for wire bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206407A (ja) * 2008-02-29 2009-09-10 Morioka Seiko Instruments Inc ワイヤーボンド方法

Also Published As

Publication number Publication date
JPH0131297B2 (enExample) 1989-06-26

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