JPS61101521A - 封止用樹脂組成物 - Google Patents
封止用樹脂組成物Info
- Publication number
- JPS61101521A JPS61101521A JP22136384A JP22136384A JPS61101521A JP S61101521 A JPS61101521 A JP S61101521A JP 22136384 A JP22136384 A JP 22136384A JP 22136384 A JP22136384 A JP 22136384A JP S61101521 A JPS61101521 A JP S61101521A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- sealing resin
- inorganic filler
- nonionic surfactant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 18
- 238000007789 sealing Methods 0.000 title claims abstract description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 3
- -1 polyoxyethylene Polymers 0.000 abstract description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 10
- 229920003986 novolac Polymers 0.000 abstract description 10
- 239000005011 phenolic resin Substances 0.000 abstract description 8
- 229920003171 Poly (ethylene oxide) Polymers 0.000 abstract description 7
- 229920001568 phenolic resin Polymers 0.000 abstract description 6
- 238000001721 transfer moulding Methods 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 5
- 239000000377 silicon dioxide Substances 0.000 abstract description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 4
- 125000005907 alkyl ester group Chemical group 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 229920001214 Polysorbate 60 Polymers 0.000 abstract description 2
- 150000005215 alkyl ethers Chemical class 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 239000012778 molding material Substances 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 150000003973 alkyl amines Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22136384A JPS61101521A (ja) | 1984-10-23 | 1984-10-23 | 封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22136384A JPS61101521A (ja) | 1984-10-23 | 1984-10-23 | 封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61101521A true JPS61101521A (ja) | 1986-05-20 |
| JPH0477012B2 JPH0477012B2 (enrdf_load_stackoverflow) | 1992-12-07 |
Family
ID=16765616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22136384A Granted JPS61101521A (ja) | 1984-10-23 | 1984-10-23 | 封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61101521A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333416A (ja) * | 1986-07-28 | 1988-02-13 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPH01272620A (ja) * | 1988-04-25 | 1989-10-31 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ樹脂成形材料 |
| JPH05283455A (ja) * | 1991-09-16 | 1993-10-29 | Internatl Business Mach Corp <Ibm> | はんだ相互接続、無クラック寿命延長方法及び組成物 |
| US5393805A (en) * | 1990-06-23 | 1995-02-28 | Hitachi, Ltd. | Epoxy resin composition for insulating a coil, and a coil molded from the composition |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5874743A (ja) * | 1981-10-28 | 1983-05-06 | Toshiba Corp | エポキシ樹脂成形材料 |
| JPS6013841A (ja) * | 1983-07-04 | 1985-01-24 | Toray Silicone Co Ltd | 成形用エポキシ樹脂組成物 |
| JPS6058425A (ja) * | 1983-09-07 | 1985-04-04 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
-
1984
- 1984-10-23 JP JP22136384A patent/JPS61101521A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5874743A (ja) * | 1981-10-28 | 1983-05-06 | Toshiba Corp | エポキシ樹脂成形材料 |
| JPS6013841A (ja) * | 1983-07-04 | 1985-01-24 | Toray Silicone Co Ltd | 成形用エポキシ樹脂組成物 |
| JPS6058425A (ja) * | 1983-09-07 | 1985-04-04 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333416A (ja) * | 1986-07-28 | 1988-02-13 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPH01272620A (ja) * | 1988-04-25 | 1989-10-31 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ樹脂成形材料 |
| US5393805A (en) * | 1990-06-23 | 1995-02-28 | Hitachi, Ltd. | Epoxy resin composition for insulating a coil, and a coil molded from the composition |
| JPH05283455A (ja) * | 1991-09-16 | 1993-10-29 | Internatl Business Mach Corp <Ibm> | はんだ相互接続、無クラック寿命延長方法及び組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0477012B2 (enrdf_load_stackoverflow) | 1992-12-07 |
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