JPS6095948A - 半導体素子のボンデイング用Ａｌ線 - Google Patents

半導体素子のボンデイング用Ａｌ線

Info

Publication number
JPS6095948A
JPS6095948A JP58203873A JP20387383A JPS6095948A JP S6095948 A JPS6095948 A JP S6095948A JP 58203873 A JP58203873 A JP 58203873A JP 20387383 A JP20387383 A JP 20387383A JP S6095948 A JPS6095948 A JP S6095948A
Authority
JP
Japan
Prior art keywords
wire
bonding
strength
tensile strength
corrosion resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58203873A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0454383B2 (enrdf_load_stackoverflow
Inventor
Shozo Hayashi
林　正蔵
Shinji Shirakawa
白川　信次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP58203873A priority Critical patent/JPS6095948A/ja
Publication of JPS6095948A publication Critical patent/JPS6095948A/ja
Publication of JPH0454383B2 publication Critical patent/JPH0454383B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/432—Mechanical processes
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    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01075—Rhenium [Re]
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Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58203873A 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線 Granted JPS6095948A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58203873A JPS6095948A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58203873A JPS6095948A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Publications (2)

Publication Number Publication Date
JPS6095948A true JPS6095948A (ja) 1985-05-29
JPH0454383B2 JPH0454383B2 (enrdf_load_stackoverflow) 1992-08-31

Family

ID=16481122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58203873A Granted JPS6095948A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Country Status (1)

Country Link
JP (1) JPS6095948A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022168789A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 Ａｌ配線材
WO2022168787A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 半導体装置用Ａｌボンディングワイヤ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139661A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59139661A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022168789A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 Ａｌ配線材
WO2022168787A1 (ja) * 2021-02-05 2022-08-11 日鉄マイクロメタル株式会社 半導体装置用Ａｌボンディングワイヤ

Also Published As

Publication number Publication date
JPH0454383B2 (enrdf_load_stackoverflow) 1992-08-31

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