JPS6095947A - 半導体素子のボンデイング用Ａｌ線 - Google Patents

半導体素子のボンデイング用Ａｌ線

Info

Publication number
JPS6095947A
JPS6095947A JP58203872A JP20387283A JPS6095947A JP S6095947 A JPS6095947 A JP S6095947A JP 58203872 A JP58203872 A JP 58203872A JP 20387283 A JP20387283 A JP 20387283A JP S6095947 A JPS6095947 A JP S6095947A
Authority
JP
Japan
Prior art keywords
wire
bonding
addition
tensile strength
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58203872A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0347578B2 (enExample
Inventor
Yasuo Fukui
福井　康夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP58203872A priority Critical patent/JPS6095947A/ja
Publication of JPS6095947A publication Critical patent/JPS6095947A/ja
Publication of JPH0347578B2 publication Critical patent/JPH0347578B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/015—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H10W72/50—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP58203872A 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線 Granted JPS6095947A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58203872A JPS6095947A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58203872A JPS6095947A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Publications (2)

Publication Number Publication Date
JPS6095947A true JPS6095947A (ja) 1985-05-29
JPH0347578B2 JPH0347578B2 (enExample) 1991-07-19

Family

ID=16481105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58203872A Granted JPS6095947A (ja) 1983-10-31 1983-10-31 半導体素子のボンデイング用Ａｌ線

Country Status (1)

Country Link
JP (1) JPS6095947A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801445A (en) * 1996-03-15 1998-09-01 Denso Corporation Semiconductor device and method of manufacturing same
US6693350B2 (en) 1999-11-24 2004-02-17 Denso Corporation Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
US6703707B1 (en) 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
US6946730B2 (en) 2001-04-25 2005-09-20 Denso Corporation Semiconductor device having heat conducting plate
WO2025028382A1 (ja) * 2023-07-31 2025-02-06 田中電子工業株式会社 アルミニウム配線材及びその製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801445A (en) * 1996-03-15 1998-09-01 Denso Corporation Semiconductor device and method of manufacturing same
US6693350B2 (en) 1999-11-24 2004-02-17 Denso Corporation Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
US6703707B1 (en) 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
US6798062B2 (en) 1999-11-24 2004-09-28 Denso Corporation Semiconductor device having radiation structure
US6891265B2 (en) 1999-11-24 2005-05-10 Denso Corporation Semiconductor device having radiation structure
US6960825B2 (en) 1999-11-24 2005-11-01 Denso Corporation Semiconductor device having radiation structure
US6967404B2 (en) 1999-11-24 2005-11-22 Denso Corporation Semiconductor device having radiation structure
US6992383B2 (en) 1999-11-24 2006-01-31 Denso Corporation Semiconductor device having radiation structure
US6998707B2 (en) 1999-11-24 2006-02-14 Denso Corporation Semiconductor device having radiation structure
US6946730B2 (en) 2001-04-25 2005-09-20 Denso Corporation Semiconductor device having heat conducting plate
US6963133B2 (en) 2001-04-25 2005-11-08 Denso Corporation Semiconductor device and method for manufacturing semiconductor device
WO2025028382A1 (ja) * 2023-07-31 2025-02-06 田中電子工業株式会社 アルミニウム配線材及びその製造方法

Also Published As

Publication number Publication date
JPH0347578B2 (enExample) 1991-07-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees