JPH0514014B2 - - Google Patents

Info

Publication number
JPH0514014B2
JPH0514014B2 JP60002557A JP255785A JPH0514014B2 JP H0514014 B2 JPH0514014 B2 JP H0514014B2 JP 60002557 A JP60002557 A JP 60002557A JP 255785 A JP255785 A JP 255785A JP H0514014 B2 JPH0514014 B2 JP H0514014B2
Authority
JP
Japan
Prior art keywords
gold
wire
gold wire
bonding
neck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60002557A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61163226A (ja
Inventor
Yasuhiko Yoshinaga
Shigeo Takaishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP60002557A priority Critical patent/JPS61163226A/ja
Publication of JPS61163226A publication Critical patent/JPS61163226A/ja
Publication of JPH0514014B2 publication Critical patent/JPH0514014B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50
    • H10W72/536
    • H10W72/5522

Landscapes

  • Wire Bonding (AREA)
JP60002557A 1985-01-09 1985-01-09 半導体素子用ボンデイング金線 Granted JPS61163226A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60002557A JPS61163226A (ja) 1985-01-09 1985-01-09 半導体素子用ボンデイング金線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60002557A JPS61163226A (ja) 1985-01-09 1985-01-09 半導体素子用ボンデイング金線

Publications (2)

Publication Number Publication Date
JPS61163226A JPS61163226A (ja) 1986-07-23
JPH0514014B2 true JPH0514014B2 (enExample) 1993-02-24

Family

ID=11532676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60002557A Granted JPS61163226A (ja) 1985-01-09 1985-01-09 半導体素子用ボンデイング金線

Country Status (1)

Country Link
JP (1) JPS61163226A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2613224B2 (ja) * 1987-09-29 1997-05-21 田中貴金属工業株式会社 金極細線用材料

Also Published As

Publication number Publication date
JPS61163226A (ja) 1986-07-23

Similar Documents

Publication Publication Date Title
JPS63145729A (ja) 半導体素子ボンデイング用金線
US4752442A (en) Bonding wire
JPS62127438A (ja) 半導体素子用ボンディング線
JPS63211731A (ja) ボンデイング線
JPH0514014B2 (enExample)
JPH06112258A (ja) 半導体素子用ボンディング線
JP3090549B2 (ja) 半導体素子用ボンディング線
KR930001265B1 (ko) 반도체 소자용 접합 와이어
JPH06112253A (ja) 半導体素子用ボンディング線
JP2826169B2 (ja) バンプ電極用金線
JPH06112252A (ja) 半導体素子用Pt合金極細線
JPS59119752A (ja) 半導体素子用ボンデイング金線
JPS62127436A (ja) 半導体素子用ボンディング線
JPS62127437A (ja) 半導体素子用ボンデイング線
JP2766701B2 (ja) ボンデイングワイヤー
JPH104114A (ja) ボンディングワイヤ
JP2656237B2 (ja) 半導体装置
JPH059624A (ja) ボンデイングワイヤー
JP3092927B2 (ja) 半導体素子のボンディング用金線
KR930002807B1 (ko) 반도체 소자의 본딩(Bonding)용 금선(金線)
JPS6095949A (ja) 半導体素子のボンデイング用Al線
JPH0131691B2 (enExample)
JPS61110735A (ja) 耐熱性に優れた金合金
JPH0530891B2 (enExample)
JPH0347579B2 (enExample)