JPS6094517A - Manufacture of electronic component with terminal - Google Patents
Manufacture of electronic component with terminalInfo
- Publication number
- JPS6094517A JPS6094517A JP20352483A JP20352483A JPS6094517A JP S6094517 A JPS6094517 A JP S6094517A JP 20352483 A JP20352483 A JP 20352483A JP 20352483 A JP20352483 A JP 20352483A JP S6094517 A JPS6094517 A JP S6094517A
- Authority
- JP
- Japan
- Prior art keywords
- holding part
- solder
- lead
- electronic component
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0528—Holders; Supports for bulk acoustic wave devices consisting of clips
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 この発明は、端子付電子部品の製造方法に関する。[Detailed description of the invention] The present invention relates to a method of manufacturing an electronic component with a terminal.
電子部品素体として、第１図、第２図に示すように、短
冊状の圧電セラミック基板１の表面の一端側から長手方
向の一定位置まで全幅にわたって電極膜２を設けるとと
もに、裏面の他端側から長手方向の一定位置まで全幅に
わたって電極膜３を設けてそれぞれのＮ極膜２．３の一
部が圧電セラミック基板１を介して対向するようにして
エネルギー閉じ込め形として動作させる厚みすべり振動
モードを用いた圧電共振エレメント４がある。As shown in FIGS. 1 and 2, as an electronic component element body, an electrode film 2 is provided over the entire width from one end of the front surface of a strip-shaped piezoelectric ceramic substrate 1 to a certain position in the longitudinal direction, and the other end of the back surface is provided with an electrode film 2. A thickness shear vibration mode in which an electrode film 3 is provided over the entire width from the side to a certain position in the longitudinal direction, and a part of each N electrode film 2.3 is opposed to each other with the piezoelectric ceramic substrate 1 in between to operate as an energy trapping type. There is a piezoelectric resonant element 4 using.
この発明は、このような電子部品素体を端子へ確実に接
続する方法を提供することを主な目的とする。The main object of the present invention is to provide a method for reliably connecting such an electronic component element to a terminal.
以下にこの発明の一実施例について説明Ｊる。An embodiment of the present invention will be described below.
第３図、第４図において、１０はフープ、１１はリード
部分で、ツー１１０から一定間隔をおいて一体形成され
ている。リード部分１１の先端にはリード部分１１より
幅広に（２倍以上）形成された部分がありこの部分は折
曲げ１３ｉ１１３がリード部分１１の長さ方向に沿うに
うに折＋ｌｌ＋げられ（一実施例では断面Ｕ字状）で保
持部分１４どなっている。保持部分１４の間口同士が対
向し又いる。第５図により明確に示したように、保持部
分１４とリード部分１１の境部がクランク状に折曲げら
れてストッパ部分１５となっている。圧電共振エレメン
ト４を保持部分１４゜１４で保持するとともに電極膜２
，３と保持部分１４゜１４どを電気的に導通さＵるのは
以下の手順で行なう。ずなわら、圧電共振ニレメンｌ−
４は上下左右の方向性を問われることなく、その長さ方
向がリード部分１１と直交Ｊる向きにのみ整えらせてパ
ーツノイーダ４ｒとで１噴送さ４して来る。エレメント
４を保持部分１４．１４に第３．４図へ方向から挿入
する直前に、保持部分１４．１４をわずかに万いにはな
れる方向に拡げ、その状態を保ったままニレメン１〜４
を保持部分１４．１４に入れストッパ部分１５にニレメ
ンｌ−４があたつｌζら拡げることをやめる。するとリ
ード部分 １１．’１１がイｊりるバネ性でニレメンｌ
−４にはその長さ方向に圧接力を保持８１１分１４．１
４から受けて保持がなされる。あるいは、保持部分１４
．１４を拡げることなく、ニレメン１〜４の両端を保持
部分１４．１４におさめる。この状態で電極膜２．３の
端部分と保持部分１４．１４とをはんだやその他はんだ
に準する接続材（この明細書ではこれらを総称してはん
だ等を呼ぶ）で電気的に接続する。はんだづけの場合、
第３，４のへ方向からはんだゴテ１６．１６を保持部分
１４．１４に近づける。この行程中にはんだ１７．．１
７が８方向に送り出される。したがってはんだゴテ１６
，１６によってはｌυだ１７．１７が溶解され保持部分
１４．１４内空間に落下する。落下したはんだは保持部
分１４．１４内部で拡散し硬化する。In FIGS. 3 and 4, 10 is a hoop, and 11 is a lead portion, which are integrally formed at a constant distance from the tool 110. At the tip of the lead part 11, there is a part that is formed wider than the lead part 11 (more than twice as wide), and in this part, the bends 13i113 are bent along the length direction of the lead part 11 (one example). The holding portion 14 has a U-shaped cross section. The openings of the holding portions 14 are opposite to each other. As clearly shown in FIG. 5, the boundary between the holding portion 14 and the lead portion 11 is bent into a crank shape to form a stopper portion 15. The piezoelectric resonant element 4 is held by the holding portion 14°14, and the electrode film 2
, 3 and the holding portions 14, 14, etc. are electrically connected by the following procedure. Zunawara, piezoelectric resonance Niremen l-
4 is oriented so that its length direction is orthogonal to the lead portion 11, regardless of its vertical and horizontal direction, and is sprayed once with the parts noier 4r. Immediately before inserting the element 4 into the holding part 14.14 from the direction shown in Fig. 3.4, expand the holding part 14.14 slightly in the direction of bending, and while maintaining that state, insert the elements 1 to 4 into the holding part 14.14.
into the holding parts 14 and 14, and stop spreading the elm l-4 from the hot lζ to the stopper part 15. Then the lead part 11. '11 has great springiness
-4 maintains pressure contact force in its length direction 811 minutes 14.1
4 is received and held. Alternatively, the holding portion 14
．． Both ends of Elm Men 1 to 4 are placed in the holding part 14.14 without expanding 14. In this state, the end portion of the electrode film 2.3 and the holding portion 14.14 are electrically connected using solder or other connecting material similar to solder (in this specification, these are collectively referred to as solder or the like). In the case of soldering,
The soldering iron 16.16 is brought closer to the holding portion 14.14 from the third and fourth directions. During this process, solder 17. ．． 1
7 is sent out in 8 directions. Therefore, the soldering iron 16
, 16, lυ 17.17 is melted and falls into the space inside the holding part 14.14. The fallen solder spreads and hardens inside the holding portion 14.14.
保１４部分１４．１４はエレメント ４の大きざに対し
大きめに形成しておくと種々の大きさのエレメント４に
対し兼用できて好ましい。曲面をもつ保持部分１４．１
４の代りに、第７図に示すように、角度づけした保持部
分１４−１１４−を用いてもよい。It is preferable that the retaining portion 14.14 is formed to be larger than the size of the element 4 so that it can be used for elements 4 of various sizes. Retaining part with curved surface 14.1
4, an angled retaining portion 14-114- may be used, as shown in FIG.
電子部品素体は圧電共襟ニレメン１〜に限らず、本発明
は二端子型のいかなる電子部品素体にも適用できる。The electronic component element body is not limited to the piezoelectric double-breasted element 1~, but the present invention can be applied to any two-terminal type electronic component element body.
以上の実施例からしあきらかなように、この発明による
と、リード部分とこのリード部分の一端側にあってリー
ド部分と一体にかつリード部分より幅尋に形成され１１
７曲げ線がリード部分の長さ方向に沿うにうに折曲げて
なる保持部分と、電子部品素体がリード部分方向へ移動
しないようにするストッパ８１１分とを右りる二本の端
子と、両端においてたがいに異なる面に引出電極が設け
である電子部品素体とをイｊしノ、二本の端子はたがい
にその保持部分間Ｌ’ｌが対向１ノでおり、電子部品素
体の両端がこの保持部分内にあり、引出電極と保持部分
とが、はｌυだ等で電気的に接続されている端子付電子
部品の％ｊ Ｆｌｊ法において、リード部分Ｊ、り保持
部分を上方に４スｌ置さＵ゛保持部分上方にはんだ等を
近づ（）、液状のはｌυだ等を保持部分内空間に落下さ
け、はｌυだ等が保持部分内部で拡散し硬化することで
引出電極ど保持部分との接続をしたことを特徴とするか
ら、■電子部品素体と端子との接続が確実になる、■電
子部品の量産化が容易になる、■特に基板の表裏面に引
出電極が設【ノである電子部品素体と端子との接続が一
度にできて能率がよい。As is clear from the above embodiments, according to the present invention, the lead portion and the lead portion are formed integrally with the lead portion at one end side and have a width wider than the lead portion.
7. Two terminals that hold a holding portion formed by bending the bending line along the length direction of the lead portion, and a stopper 811 that prevents the electronic component element from moving toward the lead portion; The electronic component element body has lead-out electrodes on different surfaces at both ends, and the two terminals have a distance L'l facing each other between their holding parts, and the electronic component element body has %j of an electronic component with a terminal whose both ends are within this holding part, and where the lead electrode and the holding part are electrically connected by lυ etc. In the Flj method, the lead part J and the holding part are placed upwards. Place the solder etc. close to the upper part of the holding part (), and avoid dropping the liquid solder etc. into the space inside the holding part.The solder etc. will diffuse inside the holding part and harden, causing it to be pulled out. The feature is that the connection is made with the holding part of the electrode, etc., ■ The connection between the electronic component body and the terminal is ensured, ■ Mass production of electronic components is facilitated, and ■ Particularly, it is possible to draw out the front and back sides of the board. The connection between the electronic component body, where the electrode is installed, and the terminal can be made at the same time, which is efficient.
第１図は平面図、第２図は側面図、第３図は平面図、第
４図は側面図、第５図は斜視図、第６図と第７図は正面
図。
２．３は電極膜、４は圧電共振ニレメン］−１１１はリ
ード部分、１４は保持部分、１５はストッパ部分。
特 許 出 願 人
株式会社杓山製作所
第１図 第２図
第、。 第４図
第５図
第６図
０
第７図
７４′Fig. 1 is a plan view, Fig. 2 is a side view, Fig. 3 is a plan view, Fig. 4 is a side view, Fig. 5 is a perspective view, and Figs. 6 and 7 are front views. 2.3 is an electrode film, 4 is a piezoelectric resonant membrane]-111 is a lead portion, 14 is a holding portion, and 15 is a stopper portion. Patent application Hikiyama Seisakusho Co., Ltd. Figure 1 Figure 2. Figure 4 Figure 5 Figure 6 Figure 0 Figure 7 74'
Claims (1)
分と一体にかつリード部分より幅広に形成され折曲げ線
がリード部分の長さ方向に沿うように折曲げてなる保持
部分と、電子部品素体がリード部分り向へ移動しないよ
うに覆るストッパ部分とを右Ｊ゛る２本の端子と、両端
においてたがいに異なる面に引出電極が設けである電子
部品素体とを有し、二本の端子はたがいにその保持部分
開口が対向してｉｌＵす、電子部品素体の両端がこの保
持部分内にあり、引出電極と保持部分とかはＩυだ等で
電気的に１８続されている端子付電子部品の製造方法に
おいで、リード部分にり保持部分を上方に位置さ′ｌ保
持部分上方にはんだ等を近づけ、液状のはんだ等を保持
部分内空間に落下させ、はんだ等が保持部分内部で拡散
し硬化することで引出電極と保持部分との接続をしたこ
とを特徴とする、端子付電子部品の製造方法。A holding part that is located at one end of the lead part, is formed integrally with the lead part and is wider than the lead part, and is bent so that the bending line runs along the length direction of the lead part, and an electronic component element. It has two terminals with a stopper part that covers the lead so that the body does not move in the direction of the lead, and an electronic component body with extraction electrodes on different surfaces at both ends. The terminals are terminals whose holding part openings face each other, both ends of the electronic component body are inside this holding part, and the extraction electrode and the holding part are electrically connected by Iυ. In a method for manufacturing electronic components with attached parts, the holding part is placed above the lead part, the solder, etc. is brought close to the top of the holding part, liquid solder, etc. is dropped into the space inside the holding part, and the solder, etc. is placed inside the holding part. A method for manufacturing an electronic component with a terminal, characterized in that an extraction electrode and a holding part are connected by diffusion and curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20352483A JPS6094517A (en) | 1983-10-28 | 1983-10-28 | Manufacture of electronic component with terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20352483A JPS6094517A (en) | 1983-10-28 | 1983-10-28 | Manufacture of electronic component with terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6094517A true JPS6094517A (en) | 1985-05-27 |
| JPH0326567B2 JPH0326567B2 (en) | 1991-04-11 |
Family
ID=16475572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20352483A Granted JPS6094517A (en) | 1983-10-28 | 1983-10-28 | Manufacture of electronic component with terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6094517A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5982076A (en) * | 1997-05-28 | 1999-11-09 | Samsung Electro-Mechanics Co., Ltd. | Electronic component involving 2-terminal type piezo-electric device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5574028U (en) * | 1978-11-15 | 1980-05-21 |
-
1983
- 1983-10-28 JP JP20352483A patent/JPS6094517A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5574028U (en) * | 1978-11-15 | 1980-05-21 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5982076A (en) * | 1997-05-28 | 1999-11-09 | Samsung Electro-Mechanics Co., Ltd. | Electronic component involving 2-terminal type piezo-electric device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0326567B2 (en) | 1991-04-11 |
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