JPS61160957A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS61160957A JPS61160957A JP192385A JP192385A JPS61160957A JP S61160957 A JPS61160957 A JP S61160957A JP 192385 A JP192385 A JP 192385A JP 192385 A JP192385 A JP 192385A JP S61160957 A JPS61160957 A JP S61160957A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead
- soldering
- substrate
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Abstract
Description
【発明の詳細な説明】
〔産業上利用される分野〕
本発明は、ハイブリットＩＣ等に使用されるリードフレ
ームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Use] The present invention relates to a lead frame used in a hybrid IC or the like.
第５図は従来のリードフレームの構成を示す平面図であ
り、第６図は従来のリードフレームの取付は状態を示す
断面図。従来、ハイブリットＩＣ。FIG. 5 is a plan view showing the structure of a conventional lead frame, and FIG. 6 is a cross-sectional view showing how the conventional lead frame is mounted. Conventionally, hybrid IC.
等に使用されるリードフレームは、第５図に示すように
、接合材（１）と、それより略垂直に突出する複数本の
リード端子（２）からなり、使用する際は、第６図中、
リード端子（２）の空間（３）に基板（４）を挿入した
後、ペースト状の半田を乗せ加熱、あるいは、半田槽に
つけるなどを行い半田付を完了させ、その後に接合材（
１）を切り落として使用していた。As shown in Fig. 5, the lead frame used for the During,
After inserting the board (4) into the space (3) of the lead terminal (2), paste solder is placed on it and heated or placed in a solder bath to complete the soldering, and then the bonding material (
1) was cut off and used.
しかしながら、上記のように接合材（１）とリード端子
（２）だけでは、リードフレームそのものが薄いため、
基板挿入時までの取り扱いを慎重に行わなければ、リー
ド端子（２）が曲りを起してし・まい、基板挿入時の作
業能率が低下してしまう。また挿入後も半田付を完了す
るまでは慎重に取り扱わないと、基板上でのずれを起し
てしまい、半田付の作業能率が低下してしまう。また接
合材（１）を切り落とした際に、リード端子（２）の位
置がずれてしまったり、各リード端子（２）が各々平行
になっていない事も多い。However, as mentioned above, if only the bonding material (1) and lead terminal (2) are used, the lead frame itself is thin, so
If the lead terminals (2) are not handled carefully before inserting the board, the lead terminals (2) may become bent, reducing work efficiency when inserting the board. Furthermore, even after insertion, if the soldering is not completed, the soldering must be handled carefully, otherwise it may shift on the board, reducing the soldering efficiency. Furthermore, when the bonding material (1) is cut off, the positions of the lead terminals (2) often shift or the lead terminals (2) are not parallel to each other.
本発明は、リードフレームのリード端子（２）の曲りを
少なく抑え、挿入時、あるいは半田付時に出るリード端
子（２）の曲りを少なくしようとするものである。The present invention aims to suppress the bending of the lead terminal (2) of a lead frame, and to reduce the bending of the lead terminal (2) that occurs during insertion or soldering.
本発明は、上記の問題点を解決すべく、帯状の接合材か
ら略垂直に突出した、複数本のリード端子の先端に、接
合材と略平行に板状、もしくは棒状等の半田を付けた事
を特徴とするリードフレームである。In order to solve the above-mentioned problems, the present invention attaches solder in the form of a plate or rod to the tips of a plurality of lead terminals that protrude substantially perpendicularly from a band-shaped bonding material, approximately parallel to the bonding material. This lead frame is characterized by:
〔本発明の実施例］
第１図は、本発明の一実施例のリードフレームを示す平
面図である。（５）接合材であり、（６）はそれより垂
直に突出させた複数のリード端子、（７）は各リード端
子（６）の先端に、各リード端子（６）を接続すべく付
けられた板状の半田である。第２図は第１図に示すリー
ドフレームの断面図であり、半田（７）は、基板が挿入
されるべき空間（８）を避け、（７）又は（７゛）ある
いはその両方に付けられるものである。また第３図は上
記リードフレームに基板（９）の挿入を完了した際の断
面図である。[Embodiment of the present invention] FIG. 1 is a plan view showing a lead frame according to an embodiment of the present invention. (5) A bonding material, (6) a plurality of lead terminals protruding perpendicularly therefrom, and (7) a bonding material attached to the tip of each lead terminal (6) to connect each lead terminal (6). It is a plate-shaped solder. Figure 2 is a cross-sectional view of the lead frame shown in Figure 1, in which solder (7) is applied to (7) and/or (7'), avoiding the space (8) where the board is to be inserted. It is something. Moreover, FIG. 3 is a sectional view when the board (9) has been inserted into the lead frame.
本発明は、１う田（７）をリード端子（６）の先端に付
けた事により、基板挿入後半田付を完了するまでの、リ
ード端子（６）の曲りを極めて少なく抑える効果がある
。それにより、基板挿入時、あるいは半田付時の作業能
率をよく出来る。また各リード端子（６）を接続する材
料を半田（７）にした事により、基板挿入を行った後の
基板との半田付の際、半田を供給する事なく、熱を加え
るだけで半田付が完了する６またそれと同時にリード端
子（６）先端同士の接合を取り除く作業が省略できる。The present invention has the effect of extremely minimizing the bending of the lead terminal (6) until the soldering after board insertion is completed by attaching the pad (7) to the tip of the lead terminal (6). This improves work efficiency during board insertion or soldering. In addition, by using solder (7) as the material for connecting each lead terminal (6), when soldering to the board after inserting the board, it is possible to solder by simply applying heat without supplying solder. 6. At the same time, the work of removing the joints between the ends of the lead terminals (6) can be omitted.
第４図は本発明を応用した実施例の平面図である。第４
図のように、接合材（１０）とリード端子（１１）との
接合部が、リード端子（１１）先端において半田（１３
）によって位置が決っているために、（１２）のように
手で簡単に取りはずせるようなくさび状にする事ができ
る。これにより、接合材（１０）を取り除く作業がスム
ーズに行える。また本発明中のリード端子（６）の先端
の接合を得るための半田（７）の寸法を一定にしておく
事により、基板（９）との半田付部分の条件が一定とな
り、リード端子（６）と基板（９）との半田付部分の信
頼性が向上し。FIG. 4 is a plan view of an embodiment to which the present invention is applied. Fourth
As shown in the figure, the joint between the bonding material (10) and the lead terminal (11) is connected to the solder (13) at the tip of the lead terminal (11).
), it can be wedge-shaped so that it can be easily removed by hand, as shown in (12). Thereby, the work of removing the bonding material (10) can be performed smoothly. Furthermore, by keeping the dimensions of the solder (7) constant in order to bond the tip of the lead terminal (6) in the present invention, the conditions of the soldered part with the board (9) are constant, and the lead terminal ( The reliability of the soldered part between 6) and the board (9) is improved.
使用する半田も必要最低限にとどめる事も出来る。The amount of solder used can also be kept to the minimum necessary.
第１図は１本発明の一実施例のリードフレームを示す平
面図、第２図は、第１図に示すリードフレームの断面図
、第３図は１本発明のリードフレームに基板の挿入を完
了した際の断面図、第４図は本発明を応用した実施例の
平面図、第５図は従来のリードフレームの構成を示す平
面図、第６図は従来のリードフレームの取付は状態を示
す断面図。
（１）（５）（ｔｏ）・・・・・・接合材（２） （
６）（ｌ ｌ）・・・・・・リード端子（７）（１３）
・・・・・・・・・・・・・・・平田特許Ｗ願出願人
御代田精密株式会社
庭５０
５粂咬 −
靭1 is a plan view showing a lead frame according to an embodiment of the present invention, FIG. 2 is a sectional view of the lead frame shown in FIG. 1, and FIG. 4 is a plan view of an embodiment to which the present invention is applied, FIG. 5 is a plan view showing the configuration of a conventional lead frame, and FIG. 6 is a diagram showing the installation state of a conventional lead frame. A sectional view shown. (1) (5) (to)... Bonding material (2) (
6) (l l)...Lead terminal (7) (13)
・・・・・・・・・・・・・・・Hirata Patent W Applicant
Miyota Seimitsu Co., Ltd. Niwa 50 5 Kumaki - Toughness
Claims (1)
端子の先端に、接合材と略平行に板状、もしくは棒状等
の半田を付けた事を特徴とするリードフレーム。A lead frame characterized by plate-shaped or rod-shaped solder attached to the tips of a plurality of lead terminals that protrude substantially perpendicularly from a band-shaped bonding material, approximately parallel to the bonding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP192385A JPS61160957A (en) | 1985-01-09 | 1985-01-09 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP192385A JPS61160957A (en) | 1985-01-09 | 1985-01-09 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61160957A true JPS61160957A (en) | 1986-07-21 |
Family
ID=11515113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP192385A Pending JPS61160957A (en) | 1985-01-09 | 1985-01-09 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61160957A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5198883A (en) * | 1988-08-06 | 1993-03-30 | Kabushiki Kaisha Toshiba | Semiconductor device having an improved lead arrangement and method for manufacturing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5469762A (en) * | 1977-11-15 | 1979-06-05 | Nippon Musical Instruments Mfg | Method of connecting lead to substrate for ic |
-
1985
- 1985-01-09 JP JP192385A patent/JPS61160957A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5469762A (en) * | 1977-11-15 | 1979-06-05 | Nippon Musical Instruments Mfg | Method of connecting lead to substrate for ic |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5198883A (en) * | 1988-08-06 | 1993-03-30 | Kabushiki Kaisha Toshiba | Semiconductor device having an improved lead arrangement and method for manufacturing the same |
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