JPH04243190A - Terminal for wiring and wiring method - Google Patents

Abstract

PURPOSE:To bond the end point of a wire with high reliability at a terminal for wiring when modifying a printed circuit board. CONSTITUTION:A lead 21 for bonding a lead to be bonded to an end point, and a lead 22 for bonding a wire to be bonded with a wire are aligned in a straight line. The lead 22 has eaves 27, 28 at both sides directed toward the center, and has a window 34 for installing a heater chip at the center. The wire is bonded at the position of the window 34.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire wiring terminal used for wiring wires in order to modify a printed wiring board, and a wire wiring method using this wire wiring terminal.

[0002] Printed wiring boards are sometimes modified after they are manufactured. Modifications are made by running wires between starting and ending points on the printed wiring board.

Wire wiring is accomplished by bonding one end of the wire to a starting point on the printed wiring board and bonding the other end to a terminal point on the printed wiring board using a heater chip.

[0004] In recent years, printed wiring boards have become more dense, and as a result, the area where wire bonding is performed has become narrower, making it more difficult to bond wires, especially at the end points.

[0005] Therefore, there is a need for a bonding method that can be applied to higher density printed wiring boards.

[0006]

2. Description of the Related Art In FIGS. 10 and 11, reference numeral 1 denotes a printed wiring board, on the surface of which IC components 2 and 3 are surface mounted. It is assumed that this printed wiring board 1 requires modification to wire a wire between one lead 4 of one IC component 2 and one lead 5 of another IC component 3.

Conventionally, without using a special terminal for wire wiring, one end 6a of the wire 6 is directly bonded to the lead 4, which is the starting point 8, using the heater chip 7, and then the other end of the wire 6 is bonded to the lead 4, which is the starting point 8. The end 6b was directly bonded to the lead 5, which is the end point 9, using the heater chip 7 as well. Thereafter, the wire 6 is cut at a point 10. As shown in FIG. 12, the wire 6 has a diameter d of 0.16, for example.
mm copper wire 11 is covered with a polyurethane film 12,
Furthermore, this structure is covered with a 6.6 nylon film 13. Polyurethane and 6.6 nylon are approximately 3
It is sublimated at 90° C., and the wire 6 is a thermally sublimable wire.

[0008]

[Problems to be Solved by the Invention] Particularly, bonding on the end point 9 side is performed with the wire 6 running along the lead 5 as shown by the two-dot chain line in FIG. It is necessary to shift the heater chip 7 toward the tip of the lead 5 by an amount L1 approximately equivalent to (approximately 0.2 mm).

Therefore, on the end point 9 side, the wire 6
Length L2 of the portion 14 to which the lead 5 and the lead 5 are soldered
becomes short, and the bonding strength tends to be insufficient.

SUMMARY OF THE INVENTION An object of the present invention is to provide a wire wiring terminal and a wire wiring method that enable end point bonding to be performed with high reliability.

[0011]

[Means for Solving the Problems] The invention of claim 1 provides a lead bonding lead portion that is bonded onto one lead of a semiconductor component surface-mounted on a printed wiring board, and an extension line of the lead portion. and a wire bonding lead part to which the wire for modifying the printed wiring board is bonded, and the lead part for wire bonding is wider than the lead part, and the wire for modifying the printed wiring board is bonded. a lead main body, a rib portion formed oppositely to each other along the longitudinal direction of the lead main body, and a solder film or solder paste formed by solder plating on the upper surface of the lead main body; A gap is provided between the flange portions, through which the wire is inserted, and a window for entering the heater chip is provided approximately in the center of the gap.

[0012] The invention according to claim 2 is a terminal bonding method for wire wiring, in which the wire wiring terminal according to claim 1 is provided by bonding its lead portion to a lead which is the end point of the wiring among the leads of the semiconductor component. and a wire bonding step of bonding a wire to the wire bonding lead portion of the bonded wire wiring terminal. The invention of claim 3 is:
The wire wiring terminal bonding process of claim 2 includes the steps of: applying an adhesive to a portion of the surface of the printed wiring board that faces the tip of the lead, which is the end point of the wiring; and A step of adhering the lead part for wire bonding with the adhesive, positioning the lead part for lead bonding on the lead and temporarily fixing it, and fixing the lead part for lead bonding of the temporarily fixed wire wiring terminal. , and a process of bonding to the leads using a heater chip.

According to a fourth aspect of the invention, the terminal bonding step of the second aspect includes inserting the wire into the wire bonding lead portion through a gap between opposing edges of the wire bonding lead portion; A step of temporarily fixing the wire by bringing the wire closer to the lower side of one of the edges and hooking it, and then a step of temporarily fixing the wire by pulling the wire further extending from the wire bonding lead part near the hooked part. The structure consists of a step of cutting, and then a step of bonding the wire to a wire bonding lead part using a heat chip.

[0014]

According to the first aspect of the present invention, the lead bonding lead portion does not face the rising portion of the lead of the semiconductor component, and does not limit the pressure bonding position of the heater chip. Thereby, the soldering length between the lead bonding lead part and the lead of the semiconductor component can be increased.

[0015] The arrangement in which the window for entering the heater chip is disposed approximately in the center of the lead portion for wire bonding makes it possible to solder the wire to the lead portion over the entire width of the tip of the heater chip.

[0016] The rim allows the wire to be hooked, making it easier to hook the wire into the gap.

In the wire wiring terminal bonding step, the wire wiring terminal and the lead of the semiconductor component are bonded with sufficient strength.

In the wire bonding step, the wire is bonded to the wire wiring terminal with sufficient strength.

In the third aspect of the invention, the adhesive application step, the temporary fixing step, and the bonding step facilitate bonding of the wire wiring terminal.

In the invention of claim 4, the wire temporary fixing step, the wire cutting step, and the bonding step eliminate the need for positioning the wire using tweezers, and facilitate bonding of the wire to the lead portion for wire bonding. do.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1A, 1B, and 1C show a wire wiring terminal 20 according to an embodiment of the present invention.

The wire wiring terminal 20 has a lead bonding lead portion 21 and a wire bonding lead portion 2.
2 and 1 are aligned on the same straight line 23, and the thickness t1
It is made of 42 alloy with a diameter of approximately 0.1mm, and the length is L3.
is 3 mm, and the width W1 is 1.5 mm.

The lead portion 21 for lead bonding is made of a lead-shaped plate, and has a length L4 of 1.0 mm and a width W2 of 0.16 mm.

The wire bonding lead portion 22 has a length L5 of 2 mm, a width W1 of 1.5 mm, and a height H1.
is 0.8 mm in size.

This wire bonding lead part 22 has a width W1 of 1.5 mm, and includes a lead body part 24 which is wider than the lead part 21, and a lead body part 24 which is wider than the lead part 21.
wall portions 25 and 26 that stand up above both sides along the longitudinal direction of 4 and face each other and have a height H1 of 0.8 mm;
It consists of rib portions 27 and 28 extending from the upper end of each wall portion 25 and 26 toward the center of the lead body portion 24.

The lead main body portion 24 functions as a place for wire bonding as will be described later.

The walls 25 and 26 function to prevent solder from flowing out. In FIG. 1(C), the parts near both sides of the lead body 24, the walls 25 and 26, and the ribs 27 and 28
form U-shaped wire hooking portions 29 and 30.

A gap 31 having a width W2 of 0.25 mm and wider than the diameter of the wire 6 is formed over the entire length between the ribs 27 and 28. The wire 6 enters into the lead portion 22 through this gap 31.

Furthermore, notches 32 and 33 are formed at opposing edges of the rib portions 27 and 28.

A heater chip entry window 34 is provided at the portion where the notches 32 and 33 face each other, that is, at the center of the gap 31.
is formed.

A solder film 35 is formed on the inner peripheral surface of the lead portion 22 by solder plating. Further, instead of the solder film 35, a solder paste 36 may be applied as shown by the two-dot chain line in FIG. 1(C). Solder paste 36 is dispensed through the window 34 by a dispenser.

Next, a wire wiring method using the terminal 20 having the above structure will be explained. FIG. 4 is a diagram schematically explaining the wire wiring method. 5 is a diagram illustrating in detail the wire wiring terminal bonding process in FIG. 4, and FIG. 6 is a diagram illustrating in detail the end point bonding process in FIG. 4.

FIGS. 2 and 3 each show the state in which the wires have been wired. In FIGS. 2 and 3, parts corresponding to those shown in FIGS. 10 and 11 are given the same reference numerals.

First, in FIG. 4, a wire wiring terminal bonding step 40 is performed. This step 40 is specifically shown in FIG.
This is done as shown in .

First, in step 50, as shown in FIG. 6, an adhesive 70 is applied to a portion of the printed wiring board 1 facing the end point 9 of the lead 5.

Next, in step 51, the wire wiring terminal 20 and its wire bonding lead portion 22 are adhered to the adhesive 70, and the lead bonding lead portion 21 is positioned on the lead 5 and temporarily fixed. do.

Next, step 52 is performed, and the heater chip 7 is pressed and heated at the position P1, and the terminal 20 is heated.
The lead portion 21 is soldered and bonded onto the lead 5.

Here, the lead portion 21 rests on the flat portion 5a at the tip of the lead 5 over its entire length L6 (approximately 0.8 mm).

Furthermore, nothing exists in the lead 5 facing the rising portion 5b following the flat portion 5a.

For this reason, the heater chip 7 can be placed in a state where the heater chip 7 is maximally moved toward the rising portion 5b of the leads 5, as shown by the dashed line in FIG.

By determining the positional relationship between the heater chip 7 and the leads 5 as described above and performing bonding, the lead portion 21 has a length L7 corresponding to the total length L6 of the flat portion 5a of the lead 5. The leads 5 and solder 71 are soldered and bonded.

Therefore, the length L7 of the soldered portion between the lead portion 21 and the lead 5 is longer than the conventional length L2.
The terminal 20 is bonded to the lead 5 with sufficient strength and reliability.

Next, in FIG. 4, the starting point bonding step 41
I do. This starting point bonding is performed by directly bonding the tip of the wire 6 onto the lead 4, as in the prior art.

Next, in FIG. 4, the end point bonding step 42
I do. This step 42 is specifically performed as shown in FIG.

First, a wire temporary fixing step 61 is performed. In this step 61, the wire 6 which has been bonded at the starting point and wired along the surface of the printed wiring board 1 is brought onto the wire bonding lead part 22, and is led through the gap 31 as shown by the arrow 72 in FIG. 8. Then, as shown in FIG. 8 by reference numeral 73, the lead portion 2
Bend it in the direction perpendicular to the longitudinal direction of 2.

As a result, the wire 6 is brought together as shown by the arrow 74 in FIG. In FIG. 8, the portion 6b of the wire 6 that is bent just before is caught on the end of the wire hooking portion 29, and the wire 6 is temporarily fixed onto the lead portion 22.

After this, a wire cutting step 62 in FIG. 6 is performed. In this process, tools such as cutters are used to
In the middle, the wire 6 is cut near the portion 6b indicated by reference numeral 75.

Next, a bonding step 63 in FIG. 6 is performed. In this step, as shown in FIG. 2, the heater chip 7 is inserted into the lead part 22 through the tip window 34 at position P2, and is pressed against the wire 6 exposed through the notch 32 in FIG. 8 to heat it. .

As a result, the coating of the wire 6 is removed as shown in FIG. 9, and the wire 6 is soldered to the lead portion 22 with the solder 76 melted from the solder film 35.

Here, the heater chip 7 is crimped to the middle of the wire 6, the wire 6 extends to both sides of the tip of the heater chip 7, and a portion of the wire 6 corresponding to the entire width of the tip of the heater chip 7 is soldered. , the length L8 of the soldered portion of the wire 6 to the lead portion 22 is sufficiently long and has sufficient connection strength.

As can be seen from the above, FIGS. 2, 3, and 9
Since the wire wiring terminal 20 is reliably bonded to the lead 5 and the wire 6 is reliably bonded to the terminal 20, the terminal end bonding of the wire 6 can be performed with high reliability.

[0052] Since the wire wiring terminal 20 has wire hooking portions 29 and 30 on both sides, the wire will be caught even if the wire is bent in either the left or right direction. That is, there is no limit to the direction in which the wire can be bent, and the wire can be bent in a direction that is easy to bend depending on the situation, making it easy to use.

The wire used in the present invention is shown in FIG.
The structure of the wire 6 is not limited to that shown in the figure, but other types of wires may be used.

[0054]

[Effects of the Invention] As explained above, according to the invention of claim 1, it is possible to bond to the leads of a semiconductor component while using a heater chip and avoiding interference with the leads of the semiconductor component. The wire can be bonded to the wire bonding lead part.

According to the second aspect of the invention, the wire can be connected to the lead of the semiconductor component through the wire wiring terminal with good reliability in terms of connection strength, and the reliability of the wire wiring can be improved. .

According to the third aspect of the invention, it is possible to reliably bond the wire wiring terminal to the lead of the semiconductor component.

According to the fourth aspect of the present invention, end point bonding of the wire to the wire bonding lead portion can be performed with good workability.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a wiring terminal according to an embodiment of the present invention.

FIG. 2 is an elevational view showing a state in which wires are wired using the wire wiring terminal of FIG. 1;

FIG. 3 is a plan view showing a state in which wires are wired using the wire wiring terminal of FIG. 1;

FIG. 4 is a diagram illustrating a wire wiring method.

FIG. 5 is a diagram illustrating a wire wiring terminal bonding process in FIG. 4;

FIG. 6 is a diagram illustrating the end point bonding process in FIG. 4;

FIG. 7 is a diagram illustrating temporary wire fixing.

FIG. 8 is a diagram illustrating temporary wire fixing.

FIG. 9 is a diagram illustrating a wire end point bonding state.

FIG. 10 is a plan view showing a conventional wire wiring state.

FIG. 11 is an elevational view showing a conventional wire wiring state.

FIG. 12 is a cross-sectional view of the wire.

[Explanation of symbols]

1 Printed wiring board 2, 3 IC parts 4, 5 Lead 5a Flat part 5b Rising part 6 Wire 6b Right angle bent part 7 Heater chip 8 Starting point 9 Ending point 11 Copper wire 12 Polyurethane film 13 6.6 Nylon film 20 Wire cloth Wire terminal 21 Lead portion for lead bonding 22 Lead portion for wire bonding 23 Straight line 24 Lead body portions 25, 26 Wall portions 27, 28 Rim portions 29, 30 Wire hook portion 31 Gap 32, 33 Notch 34 Window for heater chip entry 35 Solder film 36 Solder paste 40 Terminal bonding process for wire wiring 41 Starting point bonding process 42 End point bonding process 50 Adhesive application process 51 Temporary fixing process of terminal for wire wiring 52 Process of bonding the lead part for lead bonding 60 Temporary wire fixing Process 61 Wire cutting process 62 Wire bonding process 70 Adhesives 71, 76 Solder 72 Arrow 73 indicating the entry of the wire into the lead part
Arrow 74 indicating bending Arrow 75 indicating movement of the wire into the hook portion
Wire cutting position

Claims (4)

[Claims] [Claim 1] A lead part (21) for lead bonding that is bonded onto one lead (5) of a semiconductor component (3) surface-mounted on a printed wiring board (1).
and a wire bonding lead part (22) arranged on an extension line of the lead (21) part and to which a wire (6) for modifying a printed wiring board is bonded. However, the above lead part (
21) Wider and formed opposite to the lead body part (24) to which the wire (6) for modifying the printed wiring board is bonded along the longitudinal direction of the lead body part (24). The flange portions (27, 28) and a solder film (35) or solder paste (36) formed by solder plating on the upper surface of the lead main body portion (24) are formed between the opposing flange portions (27, 28). , the gap through which the above wire is inserted (
31) and a heater chip entry window (34) approximately in the center of the gap (31). 2. A wire wiring terminal bonding step (40) in which the wire wiring terminal according to claim 1 is provided by bonding its lead portion to a lead that is the end point of the wiring among the leads of the semiconductor component; , a wire bonding step (42) of bonding a wire to the wire bonding lead portion of the bonded wire wiring terminal;
) A wire wiring method characterized by: 3. The wire wiring terminal bonding step (40) of claim 2 includes applying an adhesive (
70), and a step (50) of bonding the wire bonding lead portion of the wire wiring terminal with the adhesive, positioning and temporarily fixing the lead bonding lead portion on the lead. 51); and a step (52) of bonding the lead portion for lead bonding of the temporarily fixed wire wiring terminal to the lead using a heater chip. [Claim 4] The terminal bonding step of Claim 2 (4)
In 2), the wire is inserted into the wire bonding lead part (22) through the gap (31) between the opposite sides of the wire bonding lead part, and the wire is inserted into the wire bonding lead part (22). A step of temporarily fixing the wire by hooking it to the lower side (60), and then a step of cutting the wire extending further from the wire bonding lead part near the hooked part (61) ), and then a step (62) of bonding the wire to the wire bonding lead part (22) using a heat chip.
A wire wiring method characterized by: