JP3344462B2 - Electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly, to an electronic component such as a chip type aluminum electrolytic capacitor which can be surface-mounted on a circuit board.

[0002]

2. Description of the Related Art In recent years, various electronic components mounted on a circuit board can be handled by an automatic mounting machine, and chipping is being promoted to improve the mounting density.
As an example, FIG. 3 shows a vertical aluminum electrolytic capacitor 20 formed into a chip.

[0003] That is, as shown in FIG. 3 (A), this aluminum electrolytic capacitor 20 comprises a bottomed cylindrical metal container 21 containing component elements and a metal container 2 having the same shape.
A pair of lead terminals 23, 23 pulled out from the first sealing portion 22 in the same direction;
And a seat plate 24 made of a heat-resistant synthetic resin attached to an end surface on the side. Each of the lead terminals 23, 23 penetrates the seat plate 24, and each end thereof extends along the bottom surface 25 of the seat plate 24. Folds away from each other.

According to this, each of the lead terminals 23, 23 along the bottom surface 25 of the seat plate 24 is soldered to a solder land of a circuit board (not shown), whereby the circuit board is surface-mounted on the circuit board. In order to improve the stability at the time of mounting, as one example, as shown in FIG. 3 (B), legs 26 having a predetermined height are formed at four corners of the bottom surface 25 of the seat plate 24. ing.

[0005]

By the way, the seat plate 24 is held in the metal container 21 by bending the lead terminals 23, 23, but is not sufficiently fixed as it is, and is susceptible to, for example, in-vehicle components and other vibrations. When used in a location, an undesired situation may occur in which the soldering of the lead terminals 23, 23 of the seat plate 24 to the circuit board is peeled off by the impact of rattling of the metal container 21.

Therefore, the metal container 21 and the seat plate 24 are fixed with an adhesive. Conventionally, however, in order to improve the efficiency of the process (reduce the time), a quick-curing adhesive typified by an ultraviolet curing type is used exclusively. Wood is used.

[0007] The ultraviolet-curing adhesive is certainly cured only by irradiating ultraviolet rays for a short time, and has good heat resistance. However, the ultraviolet-curing adhesive enters the gap between the metal container 21 and the seat plate 24 and is not irradiated with ultraviolet rays. Because the part is left uncured,
Problems such as uneven bonding strength and insufficient bonding strength occur.
It is not enough in terms of reliability.

[0008] In addition, a cyanoacrylate-based adhesive which is instantly cured by contact with air is also known as a quick-setting adhesive. However, even with this adhesive, a metal container 21 and a seat plate 24 are required. Since the portion which enters the gap and is hardly exposed to air is left uncured, a problem similar to that of the ultraviolet curable adhesive occurs.

That is, a quick-setting adhesive is suitable for use as a temporary fixing, but is not suitable for permanent fixing which requires durability and durability. On the other hand, a slow-hardening adhesive represented by thermosetting hardens almost completely to the inside with the passage of time, so that there is no problem such as uneven bonding strength or insufficient bonding strength. Because it takes
There is a difficulty in improving the efficiency of the process.

A problem of this kind is that not only the conventional aluminum electrolytic capacitor shown in FIG. 3 which is a vertical aluminum electrolytic capacitor in which a seat plate is attached to a component body but is chipped, for example, the component body is formed into a rectangular cylindrical shape for surface mounting. This also occurs in the case of a horizontal aluminum electrolytic capacitor in which a chip is formed by inserting and fitting the main body of the component and the external case together with an adhesive, and inserting the component into the external case.

SUMMARY OF THE INVENTION The present invention has been made to solve such a conventional problem, and an object thereof is to provide a component body and a seat plate (or an outer case) for surface mounting without hindering the efficiency of the process. Is to provide an electronic component integrally joined with sufficient strength.

[0012]

In order to achieve the above-mentioned object, the present invention is directed to a method for manufacturing a semiconductor device, comprising: a component element housed in a cylindrical metal container having a bottom; and a pair of leads of the component element from a sealing portion of the metal container. It has a component main body from which terminals are drawn out in the same direction, and a seat plate for surface mounting attached to the sealing portion side of the metal container, wherein each of the lead terminals passes through the seat plate and the seat plate. An electronic component bent in a direction away from each other along a bottom surface of the electronic component, wherein the metal container and the seat plate are joined at least at two different positions with a quick-setting adhesive and a slow-setting adhesive. And

In the electronic component to which the present invention is applied, the component element is housed in a cylindrical metal container having a bottom, and a pair of lead terminals of the component element are pulled out from a sealing portion of the metal container in the same direction. Component body, and an outer case in the form of a rectangular tube for surface mounting into which the metal container is inserted, and the tip of each of the lead terminals is provided on one end surface side of the outer case. The electronic component may be bent substantially in parallel along a plane including the predetermined outer surface. Even in this case, at least two places where the metal container and the outer case are different from each other, a quick-setting adhesive And a slow-hardening adhesive.

In any case, the application positions of the quick-setting adhesive and the slow-setting adhesive are preferably symmetrical with respect to the axis of the metal container.
According to this, the metal container of the component body and the seat plate or the outer case are joined in a well-balanced manner.

As the above-mentioned quick-setting adhesive, an ultraviolet-curable adhesive is preferable from the viewpoint of heat resistance, but a cyanoacrylate-based adhesive may be used in some cases. On the other hand, the slow-hardening adhesive may be a cold-setting adhesive, but is preferably a thermosetting adhesive from the viewpoint of curing reliability.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, in order to better understand the technical idea of the present invention, embodiments (first and second embodiments) will be described with reference to the drawings. In each of these embodiments, the same reference numerals as those in the conventional example shown in FIG.

FIG. 1 shows a first embodiment in which a component body to be formed into a chip is an aluminum electrolytic capacitor 10. That is, as shown in FIG.
The aluminum electrolytic capacitor 10 includes a bottomed cylindrical metal container 21, a pair of lead terminals 23, 23 (see FIG. 3) pulled out from a sealing portion 22 of the metal container 21 in the same direction, and the metal container 21. And a seat plate 24 made of a heat-resistant synthetic resin attached to the sealing portion 22 side.

Each of the lead terminals 23, 23 is formed in a strip shape by pressing a solder-plated CP wire (copper-coated steel wire), penetrates the seat plate 24, and each end thereof is seated. It is bent along the bottom surface 25 of the plate 24 in a direction away from each other, and can be surface-mounted on a circuit board (not shown).

The outer peripheral side of the sealing portion 22 of the metal container 21 and the seat plate 24 are joined by an adhesive. In the present invention, two adhesives of the quick-setting adhesive 27 and the slow-setting adhesive 28 are used as the adhesive. Type is used.

In the first embodiment, the quick-setting adhesive 2
7 is applied to two locations located on the diameter line of the metal container 21 passing through the lead terminals 23, 23,
Numeral 8 is applied to two places located on a diameter line orthogonal to the diameter line.

That is, FIG. 1 (A) shows a fast-curing adhesive 2
7, only one applied portion is shown for both the slow-hardening adhesive 28 and the quick-hardening adhesive 27 and the slow-hardening adhesive 28 are alternately applied at intervals of 90 degrees.

Examples of the quick-curing adhesive 27 include an ultraviolet-curable adhesive and a cyanoacrylate-based adhesive that cures instantaneously upon contact with air, but from the viewpoint of heat resistance, the ultraviolet-curable adhesive is used. Is preferably used. On the other hand, a cyanoacrylate-based adhesive is adopted if it is evaluated that no equipment such as an ultraviolet lamp is required.

Examples of the slow-hardening adhesive 28 include an acrylic adhesive, an epoxy adhesive, a nitrile adhesive, and a synthetic rubber adhesive. There are a thermosetting type and a room temperature setting type for the slow-hardening adhesive 28, and the thermosetting type is preferably adopted from the viewpoint of the reliability of the setting.

The slow-hardening adhesive 28 cures slowly after its application, but in order to increase the curing speed, a thermosetting adhesive is used.
It is preferable to provide a heating step of, for example, about 10 seconds for both the room temperature curing type. This heating step is preferably performed immediately after the application of the slow-hardening adhesive 28 from the viewpoint of the production efficiency of the entire step, while preventing dripping, but in the case of the cold-setting adhesive, It may be cured in a state of being stored in an embossed taping used when shipped as a product.

As described above, by using the fast-setting adhesive material 27 and the slow-setting adhesive material 28 together, a so-called temporary fixing action is performed by the quick-setting adhesive material 27, and then the slow-setting adhesive material 28 is gradually cured. The book is fixed. Therefore, the metal container 21 and the seat plate 24 are surely integrated, and the reliability of fixing is dramatically improved.

In the first embodiment, FIG.
As shown in FIG. 1B and its sectional view, FIG. 1C, in order to improve the surface mounting strength on the circuit board, the flat dummy terminal 1 is provided on the bottom surface 25 of the seat plate 24.
1 and 11 are provided.

For the dummy terminals 11, 11, for example, a stamped copper, nickel silver, 4-2 alloy or a solder-plated CP wire (copper-coated steel wire) is used. On the other hand, on the bottom surface 25 of the seat plate 24, recesses 12, 12 having a predetermined depth capable of accommodating the dummy terminals 11, 11 are formed. The recesses 12, 12 are provided in the respective lead terminals 2.
3, 23, and each lead terminal 23, 2
3 are formed at line-symmetric positions centered on the longitudinal direction.

These recesses 12, 12 accommodate the dummy terminals 11, 11, respectively.
Of the seat plate 24 are formed so as to protrude outside the planar contour shape of the seat plate 24. In addition, this first
In the embodiment, the ends of the lead terminals 23, 23 are also
4 is formed so as to protrude outside the planar contour shape.

As shown in FIG. 1 (C), these dummy terminals 11, 11 are formed in a substantially rectangular shape having projections 14, 14 extending in a direction intersecting the plane direction thereof. . Each of the dummy terminals 11 is
In manufacturing the seat plate 24, the projections 14 are buried in advance and fixed to the seat plate 24. In this embodiment, the dummy terminal 1
1 and 11 are housed in the recesses 12 and 12, respectively.
The dummy terminals 11 and 11 may be formed on the flat bottom surface of the seat plate 24 without providing the terminals 2 and 12.

The dummy terminals 11, 11 are
The dummy terminals 11 and 11 or the recesses 12 and 12 may be fixed to the seat plate 24 by applying, for example, an epoxy adhesive, an acrylic adhesive, or an epoxy acrylate adhesive.

The aluminum electrolytic capacitor 10 chipped in this manner is connected to each lead terminal 2 in advance.
A cream solder is applied to the lands of the circuit board corresponding to the third and third terminals and the fixing portions corresponding to the dummy terminals 11 and 11, and the respective lead terminals 23 and 2 are placed on the cream solder.
After placing the dummy terminals 3 and the dummy terminals 11, 11, the cream solder is melted and solidified by heating and cooling the circuit board, whereby the surface is mounted on the circuit board.

As described above, by soldering the dummy terminals 11, 11 together with the respective lead terminals 23, 23 to the circuit board, better surface mounting strength on the circuit board can be obtained as compared with the conventional example. In addition, each dummy terminal 11, 1
Since the one end portions 13 in the longitudinal direction protrude outside the planar contour shape of the seat plate 24, by soldering the protruding portion to the circuit board, it is possible to easily determine the quality of the soldering, and Surface mounting strength can be reliably improved.

In the first embodiment, the quick-setting adhesive 27 and the slow-setting adhesive 28 are applied at two locations, respectively. However, in the present invention, the quick-setting adhesive 27 and the slow-setting adhesive 28 are applied. Should be applied to at least one place each.
In that case, considering the balance of the adhesive strength, it is preferable that the application positions are 180 ° opposed positions.

Next, a second embodiment of FIG. 2 will be described. In the second embodiment, an aluminum electrolytic capacitor 30 having the same direction of leads can be surface-mounted on a circuit board by an automatic machine.

That is, as shown in FIG. 2A, the aluminum electrolytic capacitor 30 is mounted around a cylindrical metal container 31 containing a capacitor element therein and the metal container 31. An outer case 41 made of a heat-resistant synthetic resin is provided.

In the second embodiment, the outer case 41
Is a square tube having a square cross section having an insertion hole 42 substantially matching the metal container 31, and an outer surface 43 parallel to the axis of the insertion hole 42 is a flat surface for a circuit board (not shown). The one end 42 </ b> A side of the insertion hole 42 is closed in a semicircular shape by a stopper wall 44.

The metal container 31 is inserted into the insertion hole 42 of the outer case 41 from the other end 42B side in a state where the pair of lead terminals 33, 33 drawn out of the sealing portion 32 are straightened. , Lead terminal 33,
33 is bent so as to sandwich the stopper wall 44 with the metal container 31, and each end thereof is bent at a substantially right angle along a plane including the outer side surface 43 of the outer case 41.

After the outer case 41 is mounted around the metal container 31 in this way, the two are fixed to each other with an adhesive to prevent rattling.
In the embodiment, two types of the quick-setting adhesive 27 and the slow-setting adhesive 28 are used as in the first embodiment.

The adhesive is applied at one end 42 of the insertion hole 42.
Either the A side or the other end 42B side may be used, but in the second embodiment, as shown in FIG. 2B, the other end 42B side of the insertion hole 42 is used. That is, with the other end 42 </ b> B side of the outer case 41 facing upward, the quick-hardening adhesive 27 and the slow-hardening adhesive 28 are applied between the insertion hole 42 and the metal case 31 by a dispenser (not shown). I have.

In this case, it is preferable that the respective application positions are positions facing each other on the diameter line of the metal case 31. It is needless to say that, as in the first embodiment, the quick-setting adhesive 27 and the slow-setting adhesive 28 may be applied at two locations each.

As shown in FIG. 2C,
A liquid pool 47 may be formed at the opening edge of the insertion hole 42, and an adhesive may be applied to the liquid pool 47. According to this, it is possible to prevent the adhesive from dripping.

In the second embodiment as well, a pair of dummy terminals 45, 45 are provided on the outer surface 43 of the outer case 41 at a position away from the stopper wall 44 in order to increase the mounting strength on the circuit board. I have.

The dummy terminal 45 is formed of an L-shaped metal plate that can be fixed to a circuit board via solder, and has a claw portion 46 formed at one end in the longitudinal direction by bending. It is preferable that the claw portion 46 is sometimes attached so as to bite into the outer case 41.

[0044]

As described above, according to the present invention,
In joining together the body of the component such as the aluminum electrolytic capacitor and the seat plate or the outer case with the adhesive, the fast-setting adhesive and the slow-setting adhesive are used together, so that both are reliably integrated, The reliability of fixing is dramatically improved.

Further, since the quick-curing adhesive performs a so-called temporary fixing action, it is possible to proceed to the next step without waiting for the slow-curing adhesive to harden. Is not hindered.

[Brief description of the drawings]

FIG. 1 is an overall perspective view, a bottom view, and a main part sectional view showing a first embodiment of the present invention.

FIG. 2 is an overall perspective view, a main part perspective view, and an enlarged perspective view of the main part showing a second embodiment of the present invention.

FIG. 3 is an exploded perspective view and a main part perspective view showing a conventional electronic component.

[Explanation of symbols]

10, 30 Aluminum electrolytic capacitor as an electronic component 11, 45 Dummy terminal 13 End 14 Protrusion 21, 31 Metal container 22, 32 Sealing part 23, 33 Lead terminal 24 Seat plate 25 Bottom surface 27 Quick-setting adhesive 28 Slow-setting adhesive Material 41 Outer case 42 Insertion hole

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01G 9/10 H01G 9/004 H01G 2/06 H01G 13/00 331

Claims (5)

(57) [Claims] 1. A component body in which a component element is housed in a bottomed cylindrical metal container, and a pair of lead terminals of the component element are drawn out of a sealing portion of the metal container in the same direction, and the metal container. And a seat plate for surface mounting attached to the sealing portion side of the electronic component, wherein each of the lead terminals is bent in a direction away from each other along the bottom surface of the seat plate through the seat plate. An electronic component, wherein the metal container and the seat plate are joined at least in two different places with a quick-setting adhesive and a slow-setting adhesive. 2. A component body in which a component element is housed in a bottomed cylindrical metal container, and a pair of lead terminals of the component element are pulled out from a sealing portion of the metal container in the same direction. An outer case having a rectangular cylindrical shape for surface mounting into which a metal container is inserted, and a tip portion of each of the lead terminals extends along a plane including a predetermined outer surface of the outer case on one end surface side of the outer case. An electronic component, wherein the metal container and the outer case are joined at least at two different places by a fast-setting adhesive and a slow-setting adhesive. 3. The electronic component according to claim 1, wherein the application positions of the quick-setting adhesive and the slow-setting adhesive are symmetrical with respect to the axis of the metal container. . 4. The electronic component according to claim 1, wherein said fast-curing adhesive is an ultraviolet-curable adhesive. 5. The electronic component according to claim 1, wherein the slow-hardening adhesive is a thermosetting adhesive.