JP2560909Y2 - Composite semiconductor device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite semiconductor device having positioning means for determining a relative position between a heat sink and an insulating substrate on which a semiconductor chip or the like is mounted.

[0002]

2. Description of the Related Art A composite semiconductor device of this type is shown in FIGS. 9 is a perspective view of the composite semiconductor device after assembly is completed, FIG. 10 is a longitudinal sectional view showing a state before the main terminal is bent, and FIG. 11 is a cross-section of the composite semiconductor device being assembled and inserted into a jig. FIG. 12 is a perspective view showing a state in which main terminals are soldered on a heat sink using the jig. In these figures, an insulating substrate 2 is soldered on a heat sink 1. On the insulating substrate 2, a conductor pattern 3 is formed on the surface thereof. On the conductor pattern 3, together with a main terminal 4 whose lower end is bent in an L-shape, a semiconductor chip or the like (not shown) Of various electronic components are fixed. Further, a signal lead wire 9 is connected to a predetermined position of the conductor pattern 3, and one end of the signal lead wire 9 is fixed to a lower end of a signal terminal 8 described later.

[0003] An insulating case 5 is provided around the heat sink 1.
(See FIGS. 9 and 10) are fitted together and bonded to each other with an adhesive. The insulating case 5 is filled with a sealing resin, and the upper end opening of the insulating case 5 is closed by a lid 6. The main terminal 4 fixed on the conductor pattern 3 is inserted into a through hole 7 provided in the lid 6 and led out to the outside, and then bent at a substantially right angle on the lid 6 as shown in FIG. It is. A signal terminal 8 is inserted through a through hole 10 provided in the lid 6, and one end of the signal lead wire 9 is connected to a lower end of the signal terminal 8.

[0004] The composite semiconductor device having the above structure is assembled as follows. The insulating substrate 2 on which the semiconductor chip and the electronic component are mounted on the conductor pattern 3 is fixed by soldering on the heat sink 1. In this case, a jig as shown in FIG. 11 is used. That is, the heat sink 1 is placed in the concave portion 12 of the first jig 11, and the insulating substrate 2 is placed on the heat sink 1 with solder interposed. This insulating substrate 2 is a second jig 1
3 positions the heat sink 1 at a predetermined position. Next, after the main terminal 4 is inserted into the through hole 15 of the third jig 14, the third jig 14 is overlaid on the second jig 13 . The lower end of the main terminal 4 is positioned at a predetermined position on the conductor pattern 3 by the third jig 14 via solder.

After the above preparation, the first, second, and third jigs 11, 13, and 14 are placed on a hot plate (not shown), and the solder interposed between the components is melted to form an insulating substrate. 2 is soldered to the heat sink 1 and the main terminal 4 is soldered to a predetermined position of the conductor pattern 3. Next, as shown in FIG. 12, the signal lead wire 9 is bonded to a predetermined position on the conductor pattern 3. Next, as shown in FIG. 10, the insulating case 5 is fitted to the outer periphery of the heat sink 1, the sealing resin is injected into the insulating case 5, and the upper end opening of the lid 6 is closed with the lid 6. Close. In this case, first, after inserting the distal end of the main terminals 4 into the through-hole 7 of the lid 6 is bonded by an adhesive to the peripheral portion of the lid 206 and the upper end opening of the insulating case 5. Finally, the tip of the main terminal 4 led out from the lid 6 is bent at a substantially right angle along the upper surface of the lid 6 to complete the composite semiconductor device as shown in FIG.

[0006]

In the above-described composite semiconductor device, the insulating substrate 2 is located at a predetermined position on the heat sink 1.
When soldering the second jig 1 as shown in FIG.
Positioning is performed so as to surround the outer peripheral portion of the insulating substrate 2 by 3. In such a case, the flux at the time of soldering interposed between the heat sink 1 and the insulating substrate 2 adheres between the outer peripheral portion of the insulating substrate 2 and the inner peripheral portion of the second jig 13, In some cases, the second jig 13 did not come off smoothly after soldering, resulting in a decrease in work efficiency.

[0007]

The purpose of the present invention is to solve the above-mentioned problems. When positioning an insulating substrate on a heat sink and soldering the same, the solder flux is applied to a positioning jig. It is an object of the present invention to provide a composite semiconductor device which can perform assembly work smoothly without adhesion and can improve work efficiency.

[0008] compound semiconductor device of the present invention is absolutely heat dissipation board
An insulating substrate on which a conductor pattern is formed via an edge layer;
It is fixed together with the electronic component on the conductor pattern and
So that it comes into contact with the lead-out main terminal and the outer periphery of the heat sink.
An insulating case arranged and filled with a sealing resin inside,
Close the upper end opening of the insulating case, and connect one end of the main terminal.
And a lid formed with a through hole through which
The relative position between the insulating substrate and the heat sink.
In the erected composite semiconductor device, the insulating substrate
At least one pair of positioning protrusions provided on the conductor pattern
And a positioning projection provided on the lower surface of the lid.
And the relative position of the insulating substrate with respect to the heat sink.
Without the jig contacting the outer periphery of the insulating substrate.
And the lower surface of the lid and the upper surface of the insulating substrate
A position having a predetermined length so as to form a predetermined space
And a second support for determination .

[0009]

According to the composite semiconductor device of the present invention, the positioning member and the positioning support provided on the lower surface of the lid are fitted on the conductor pattern of the insulating substrate, so that the relative position between the lid and the insulating substrate is reduced. The position is determined. On the other hand, the lid and the insulating substrate
Since the relative position is determined by the combination of the first jig and the second jig used at the time of assembling, the relative position of the insulating substrate with respect to the heat sink is eventually determined. Therefore, it is possible to position the insulating substrate without surrounding the peripheral portion of the insulating substrate with the second jig, so that the adhesion of the flux at the time of soldering can be avoided, and the adhesion between the insulating substrate and the jig as in the related art can be avoided. A reduction in work efficiency can be prevented.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1 is an external view of a completed state of the composite semiconductor device of the present invention, FIG. 2 is an exploded view showing main components of the composite semiconductor device of the present invention, FIG. 3 is a plan view of a lid, and FIG. 4 is a front view of the lid. Figure,
5 is a left side view of the lid, FIG. 6 is a right side view of the lid, FIG. 7 is a cross-sectional view for explaining an assembling process, and FIG. 8 is a perspective view of a main part of a means for positioning the insulating substrate. FIGS. 1 to 8 are views related to the composite semiconductor device of the present invention. In FIG. 2 in which the features of each component are well shown, a heat sink 1
Above, an insulating substrate 2 is fixed by solder. The conductor pattern 3 is formed on the insulating substrate 2, and the semiconductor pellet 16 and various electronic components (not shown) are mounted and fixed on the conductor pattern 3. Further, positioning protrusions 17 are fixed at at least two places at predetermined positions of the conductor pattern 3, and engage with positioning pillars on the back side of the lid, which will be described later. Play a role in the invention of the present application to determine the relative position of.

Reference numeral 26 denotes a lid, which is 3
Block 27, 28, 29, each block 2
A nut storage groove 30 is formed at a substantially central portion of the upper surface of each of 7, 28 and 29. Each block 27, 28, 2
9 are connected to each other by connecting portions 31 and 32, and a gap 33 is formed between the blocks 27 and 28 and between the blocks 28 and 29, respectively. This gap 33 is closed later by filling with a sealing resin. A pair of overhangs 34 is provided on the side surface of the block 27.
Are formed with four square holes 35 into which the signal terminals 80 are inserted and temporarily fixed. At one end in the width direction of each of the blocks 27 and 28 and at the other end in the width direction of the block 29, a through hole 36 into which a plate-shaped main terminal 40 is inserted is provided. A groove 37 is formed.

Next, the configuration of the back side of the lid 26 will be described. On the back side of the lid 26, that is, on the back side of the projecting portions 34, 34 from the block 27 and on the back side of the block 29, first pillar portions 50 are formed, respectively. Placed on the heat sink 1 shown in FIG.
It plays a role in determining the height position of the lid 26. On the back side of the blocks 27 and 28, a second supporting portion 5 having a predetermined length is provided.
1 is formed. The second support portion 51 is formed shorter than the first support portion 50, and has a concave portion 51 a on an end surface thereof as shown in FIG. 8, and the concave portion 51 a is formed on the conductor pattern 3 of the insulating substrate 2. The insulating substrate 2 and the lid 2 are fitted to the positioning projections 17 fixed by soldering.
6 plays a role in determining a relative position with respect to.
As will be described later, the relative position between the insulating substrate 2 and the heat sink 1 is finally determined.

On the back side of the overhang portions 34, 34, a first
A signal terminal guide 52 is formed at a position close to the support 50. The signal terminal guide 52 is formed with a cut groove 53 whose central axis is aligned with the square hole 35 provided in the overhang portions 34, 34. Reference numeral 80 in FIG. 2 is a signal terminal. The signal terminal 80 is formed in a substantially L shape by a plate material, a bulging portion 82 is formed slightly closer to the upper end from the center of the upright portion 81, and a locking portion 83 is formed slightly closer to the lower end from the center. Have been. An insertion portion 8 which is bent substantially at right angles in the horizontal direction continuously to the upright portion 81 of the signal terminal 80.
4 are formed, and further, a leg portion 85 is formed from the insertion portion 84 so as to bend substantially horizontally at a right angle.

Next, the assembling sequence of the composite semiconductor device of the present invention using the lid 26, the main terminal 40 and the signal terminal 80 configured as described above will be described. In FIG. 2, the upper end of the main terminal 40 is inserted into the square hole 36 of the lid 26 from below and pulled up. When the main terminal 40 comes out above the upper surface of the lid 26, the main terminal 40 is moved horizontally to the square groove 37 side as shown by the arrow in FIG. Next, when the main terminal 40 is moved to the square groove 37 side, the main terminal 40 is released and locked in the square groove 37. Similarly, by dropping the other main terminals 40 into the square grooves 37, the three main terminals 40 are loosely fitted.

Next, the signal terminal 80 is mounted on the lid 26. That is, the upper end of the upright portion 81 of the signal terminal 80 is inserted from below the square hole 35 formed in the overhang portion 34. In this case, the bulging portion 82 comes into contact with the inner wall of the square hole 35 and is further forcibly inserted to the position of the locking portion 83, so that the signal terminal 80 is locked so as not to fall downward. on the other hand,
The insertion portion 84 is inserted into and supported by a cut groove 53 formed in the signal terminal guide portion 52 of the lid 26. After the above preparation is completed, the lid 26 is placed in a jig. That is, in FIG. 7, first, the heat radiating plate 1 is placed in the concave portion 12 of the first jig 11, and on the heat radiating plate 1, an electronic component or the like is mounted and fixed on the conductor pattern 3 in advance. The substrate 2 is placed via a plate-like solder (not shown).

Next, the second jig 13 is fitted to a predetermined position on the first jig 11. In this case, a notch 13 a is formed on the inner periphery of the lower end of the second jig 13 so that the notch 13 a does not come into contact with the outer periphery of the insulating substrate 2. Next, the lid 26 having been prepared and temporarily fixed with predetermined components is put into the second jig 13. A first support 50 and a second support 51 are formed on the back side of the lid 26, and the first support 5 is provided.
0 is in contact with the surface of the heat sink 1,
Height position is determined. Further, the concave portion 51 a provided on the end surface of the second support portion 51 is
By the fitting, as well as the relative position with respect to the lid 26 of the insulating substrate 2 is determined, under the lid 26
A predetermined space is formed between the surface and the upper surface of insulating substrate 2.
You. Here, since the position of the lid 26 relative to the radiator plate 1 is determined by the second jig 13, the relative position of the insulating substrate 2 to the radiator plate 1 is indirectly determined as a result. Become. Accordingly, there is no problem even if the outer peripheral portion of the insulating substrate 2 is not pressed and positioned by the second jig 13.

Next, each main terminal 40 is loosely fitted in the square groove 37, and the leg 43 provided at the lower end of the main terminal 40 holds the solder at a predetermined position of the conductor pattern 3 of the insulating substrate 2. Abut. The signal terminal 80 is temporarily fixed to the square hole 35 of the lid 26 by a bulging portion 82. After the lid 26 is set on the second jig 13, the upper end of the signal terminal 8 is pushed down. Accordingly, the insertion portion 84 moves downward, and the leg portion 85 at the lower end abuts on a predetermined position of the conductor pattern 3 of the insulating substrate 2 with the solder therebetween.

In the above state, the semiconductor device is placed on a hot plate and heated, so that the heat radiating plate 1 and the insulating substrate 2, the conductor pattern 3 on the insulating substrate 2, the main terminals 40 and the signal terminals 80 are respectively fixed by soldering. Next, the first jig 11 and the second jig 13 are removed,
After cleaning the solder fixing portion, the insulating case 60 shown in FIG. 1 is put on the outer periphery of the heat sink 11 and sealed from the gap 33 formed between the blocks 27, 28, 29 of the lid 26. A resin is filled in the insulating case 60 and cured. Next, after a nut (not shown) is stored in a nut storage hole 30 provided on the upper surface of each of the blocks 27, 28, 29 of the lid 26, the main terminal 40 is bent at a substantially right angle so as to cover the nut storage hole 30. The composite semiconductor device as shown in FIG. 1 is completed by bending. In the above embodiment, the positioning projection 17 is provided on the conductor pattern 3 of the insulating substrate 2 as a positioning member, and the concave portion 51a is provided on the side of the second support portion 51 of the lid 26. The concavo-convex relationship may be reversed, or another engaging means may be used. Further, the number of such positioning means may be at least two or more, and is not particularly limited to that number.

[0019]

As described above, according to the present invention, when the insulating substrate is positioned on the heat sink and soldered, the outer peripheral portion of the insulating substrate is not pressed by the peripheral portion of the second jig. Solder can be soldered while maintaining a fixed gap, so flux during soldering does not adhere to the second jig, and the second jig can be removed smoothly after product assembly, improving work efficiency. There are excellent effects such as doing.

[Brief description of the drawings]

FIG. 1 is an external view of a composite semiconductor device of the present invention.

FIG. 2 is an exploded view showing main components of the composite semiconductor device.

FIG. 3 is a plan view of a lid.

FIG. 4 is a front view of the lid.

FIG. 5 is a left side view of the lid.

FIG. 6 is a right side view of the lid.

FIG. 7 is a cross-sectional view for explaining an assembling step of the composite semiconductor device.

FIG. 8 is a perspective view of a main part of a positioning means in the composite semiconductor device.

FIG. 9 is a perspective view of a conventional composite semiconductor device.

FIG. 10 is a longitudinal sectional view of a conventional composite semiconductor device in a state before a main terminal is bent.

FIG. 11 is a cross-sectional view of a conventional composite semiconductor device during assembly inserted into a jig.

FIG. 12 is a perspective view of a conventional composite semiconductor device in a state where main terminals are soldered on a heat sink using the jig.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat sink 2 Insulating board 3 Conductor pattern 17 Positioning protrusion 26 Lid 34 Overhang part 35 Square hole 36 Through hole 37 Square groove 40 Main terminal 50 1st support part 51 2nd support part 51a Depression 52 Signal terminal guide part 53 Cut groove 60 Insulation case

Claims (1)

(57) [Scope of request for utility model registration] 1. A conductive pattern on a heat sink via an insulating layer.
And an electronic part on the conductive pattern.
Main terminal fixed together with the product and led out to the outside,
It is arranged so as to be in contact with the outer periphery of the heat sink, and the sealing resin
And an upper end opening of the insulating case.
To form a through hole from which one end of the main terminal is led out.
And an insulated substrate and a heat sink using a jig
Composite semiconductor device assembled with its relative position
A small portion provided on the conductor pattern of the insulating substrate.
At least one pair of positioning projections and
And is engaged with the positioning projection to form the insulating substrate.
Position the jig relative to the heat sink outside the insulating substrate.
Indirect regulation without touching the peripheral part
The lower surface of the body and the upper surface of the insulating substrate form a predetermined space.
And a positioning second support having a predetermined length.
A composite semiconductor device.