JP3460772B2 - Electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly, to an electronic component such as a chip-shaped aluminum electrolytic capacitor whose mounting strength on a circuit board is improved.

[0002]

2. Description of the Related Art In recent years, various electronic components mounted on a circuit board have been made into chips in order to improve the mounting density. 2A and 2B show an aluminum electrolytic capacitor 20 which is made into a chip. This aluminum electrolytic capacitor 20 has a bottomed cylindrical outer case 21 in which component elements are built in, a pair of lead terminals 23, 23 drawn from a sealing portion 22 of the outer case 21,
The external case 21 has a plate-shaped seat plate 24 attached to the end surface on the sealing portion 22 side, and each of the lead terminals 23, 2
3 is penetrated through the seat plate 24 and the bottom surface 25 of the seat plate 24
Are bent in directions away from each other. Such an aluminum electrolytic capacitor 20 is surface-mounted on the circuit board by soldering the lead terminals 23, 23 along the bottom surface 25 of the seat plate 24 to the land of the circuit board (not shown).

[0003] By the way, conventionally, various contrivances have been made for electronic components surface-mounted on a circuit board in order to improve stability during mounting. For example, the applicant
As shown in FIG. 2B, there has been proposed an electronic component 20A in which a leg portion 26 having a predetermined height is formed on a bottom surface 25 of a seat plate 24 (see Japanese Utility Model Application Laid-Open No. 64-35735: Prior Art Example 1). In this conventional example 1, since each leg portion 26 comes into contact with the circuit board, good placement stability on the circuit board can be obtained, but since each leg portion is not fixed to the circuit board, vibration resistance is not improved. Absent.

[0004]

[Problems to be Solved by the Invention] On the other hand, the actual Kai 61-1
Japanese Patent No. 71241 discloses an electrolytic capacitor in which a solderable dummy terminal is provided on the bottom surface of a seat plate (conventional example 2). In this conventional example 2, the dummy terminal corresponds to the leg portion 26 in the conventional example 1, and if the dummy terminal is soldered to a predetermined position of the circuit board, it is compared with the conventional electronic component in which only each lead terminal is soldered to the land. As a result, the surface mounting strength can be improved.

However, in the above-mentioned conventional example 2, when the electronic components are surface-mounted on the circuit board, the dummy terminals are hidden by the seat plate, so that there is a problem that the soldering failure of the dummy terminals cannot be visually recognized. This problem occurs not only in the chipped aluminum electrolytic capacitor but also in all electronic components surface-mounted on the circuit board. The present invention is
The present invention has been made in order to solve such a conventional problem, and an object thereof is to provide an electronic component in which a soldering failure of a dummy terminal can be visually recognized.

[0006]

In order to achieve the above object, the present invention provides a bottomed cylindrical outer case in which a component element is built in, and a pair of lead terminals drawn from a sealing portion of the outer case. And a plate-shaped seat plate attached to the end face of the outer case on the side of the sealing portion, in a direction in which the lead terminals penetrate the seat plate and separate from each other along the bottom surface of the seat plate. In the bent electronic component, on the bottom surface of the seat plate ,
Up to the end face of the seat along the direction orthogonal to the extending direction
The recessed part is symmetrical about the bottom center of the seat plate
And a flat dummy terminal is provided in each of the recesses, and an end portion of the dummy terminal projects outside the flat outline of the seat plate.

In this case, the material, number, shape, etc. of the dummy terminals can be arbitrarily selected as long as they can be soldered.
For example, solder-plated copper, nickel-white, 4-2 alloy, or CP wire (solder-plated copper-coated steel wire) pressed products can be used. It is sufficient that at least a part of this dummy terminal projects outside the planar contour shape of the seat plate, and the shape and size of the projecting portion may be arbitrary. Then, such a dummy terminal may be fixed to the bottom surface of the seat plate by using an adhesive or the like, or may be embedded along the bottom surface of the seat plate at the time of manufacturing the seat plate.

In the present invention as described above, since the end portion of the dummy terminal projects outside the plane contour of the seat plate,
If the protruding portion is soldered to the circuit board, it is possible to easily determine whether the soldering is good or bad, thereby achieving the above object.

Further, in the present invention , since a plurality of dummy terminals are provided at a point symmetrical position centering on the center of the bottom surface of the seat plate or at a line symmetrical position centering on a line along the lead terminal, surface mounting is performed. The strength is further improved, and good mounting stability on the circuit board can be obtained until soldering.

Further, according to the present invention, the dummy terminal may be fixed to the bottom surface of the seat plate through an adhesive, for example, an epoxy adhesive, an acrylic adhesive or an epoxy acrylate adhesive is adopted. it can. According to the present invention, since the dummy terminal can be fixed to the seat plate by a very simple procedure of applying an adhesive to at least one of the dummy terminal and the seat plate, the manufacturing process of the electronic component can be simplified.

On the other hand, according to the present invention, the dummy terminal may have a protrusion extending in a direction intersecting the plane direction of the dummy terminal, and the protrusion may be embedded in the seat plate. The dummy terminal may be provided with a protrusion at one end by bending it into a substantially V shape or a substantially V shape.
Alternatively, it may be formed into a substantially deformed T-shape by connecting the protrusions of another member. In the present invention, since the protrusion is embedded in the seat plate, it is possible to reduce the risk that the dummy terminal will fall off the seat plate.

Further, according to the present invention, the outer peripheral side of the sealing portion of the outer case and the seat plate may be fixed to each other by an adhesive agent, and the material of the adhesive agent and the application site may be appropriately selected. In the present invention, since the outer case and the seat plate are fixed to each other, vibration resistance is improved and good surface mounting strength is obtained.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the embodiments described below, the members already described with reference to FIG. 2 are denoted by the same reference numerals in the drawing, and the description thereof will be simplified or omitted. FIG. 1 shows an aluminum electrolytic capacitor 10 according to an embodiment of the present invention. As shown in FIG. 1 (A), the aluminum electrolytic capacitor 10 has an outer case 21, a lead terminal 23 and a seat plate 24, and is formed by pressing a CP wire (copper coated steel wire plated with solder). Each formed lead terminal 23, 2
3 pass through the seat plate 24 and are bent along the bottom surface 25 of the seat plate 24 away from each other.
By soldering the lead terminals 23, 23 along the bottom surface 25 to a land of a circuit board (not shown), surface mounting can be performed on the circuit board.

This aluminum electrolytic capacitor 10
The outer peripheral side of the sealing portion 22 of the outer case 21 and the seat plate 24 are fixed to each other with an adhesive 30 , and as shown in FIG. 1B, the surface mounting strength on the circuit board is improved. Therefore, flat plate-shaped dummy terminals 11, 11 are provided on the bottom surface 25 of the seat plate 24.

The dummy terminals 11, 11 are, for example, stamped products of solder-plated copper, nickel silver, 4-2 alloy or CP wire (solder-plated copper-coated steel wire). On the other hand, on the bottom surface 25 of the seat plate 24, the dummy terminals 1
Recesses 12, 12 having a predetermined depth capable of accommodating 1, 1 are formed. The recesses 12 and 12 are formed on the lead terminals 23 and 2 respectively.
It is formed at a line symmetry position orthogonal to 3 and centered on the longitudinal direction of each lead terminal 23. These recesses 12 and 12 are used as dummy terminals 11 and 11 respectively.
Is formed, the one longitudinal end portions 13, 13 of the dummy terminals 11, 11 are formed so as to project to the outside of the plane contour shape of the seat plate 24. The aluminum electrolytic capacitor 10 of the present embodiment is formed so that the end portions of the lead terminals 23, 23 also project outside the planar contour shape of the seat plate 24.

As shown in FIG. 1 (C), these dummy terminals 11 and 11 are bent and formed in a substantially V shape having projecting portions 14 and 14 extending in a direction intersecting the plane direction. . Then, the dummy terminals 11 and 11 are
When the seat plate 24 is manufactured, it is fixed to the seat plate 24 by embedding the respective projections 14, 14 in advance. In addition, these dummy terminals 11 and 11 are
The dummy terminals 11, 11 or the recesses 12, 12 may be fixed to the seat plate 24 by applying, for example, an epoxy adhesive, an acrylic adhesive, or an epoxy acrylate adhesive.

In the aluminum electrolytic capacitor 10 as described above, cream solder is applied in advance to the land of the circuit board corresponding to each lead terminal 23, 23 and the fixed portion corresponding to the dummy terminals 11, 11. Each lead terminal 23, 23 and dummy terminal 11,
By bringing 11 into contact, they are mounted on the circuit board.
Next, the circuit board is heated and cooled to melt and solidify the cream solder, whereby the aluminum electrolytic capacitor 10 is surface-mounted on the circuit board.

According to the aluminum electrolytic capacitor 10 of the present embodiment as described above, the dummy terminal 1 is attached to the seat plate 24.
Since the terminals 1 and 11 are provided, by soldering these dummy terminals 11 and 11 to the circuit board, good surface mounting strength on the circuit board can be obtained as in the conventional electronic component. Further, according to the aluminum electrolytic capacitor 10 of the present embodiment, since the longitudinal one end portions 13, 13 of the dummy terminals 11, 11 are projected to the outside of the planar contour shape of the seat plate 24, the projecting portions are soldered to the circuit board. With
The KES Rukoto, the quality of the soldering can be easily discriminated can be reliably improved surface mounting strength to the circuit board.

Further, in the aluminum electrolytic capacitor 10 of the present embodiment, since the dummy terminals 11, 11 are provided at symmetrical positions about the center of the bottom surface of the seat plate 24, the surface mounting strength is further improved and Good placement stability on the circuit board can be obtained until soldering is completed. Furthermore, since the dummy terminals 11 and 11 are fixed to the recesses 12 and 12 formed on the bottom surface 25 of the seat plate 24 through various adhesives or adhesive-attached metal foil tapes,
The manufacturing process of the aluminum electrolytic capacitor 10 can be simplified. Further, in the aluminum electrolytic capacitor 10 of the present embodiment, since the outer case 21 and the seat plate 24 are fixed to each other by the adhesive 30 , the vibration resistance is further improved,
Good surface mount strength can be obtained.

The present invention is not limited to the above-mentioned embodiment, and for example, the material, shape, size, etc. of the outer case, the sealing portion, the lead terminal, the seat plate, the dummy terminal, the adhesive, etc.
Improvements, modifications, etc. of the form, the number, the location, etc. are included in the present invention and are not limited.

[0021]

According to the present invention, since the end portions of the dummy terminals project outside the planar contour shape of the seat plate, the surface mounting strength can be reliably improved by soldering the projecting portions to the circuit board. Further, according to the present invention, a plurality provided in <br/> have order at symmetrical positions where the dummy terminal is centered on the center of the bottom of <br/> seat plate, together with the surface mounting strength is further improved, soldering Until then, good placement stability on the circuit board can be obtained.

Further, according to the present invention, the dummy terminal is fixed to the bottom surface of the seat plate through an adhesive, or the projection provided on the dummy terminal is embedded to fix the dummy terminal to the seat plate. The process can be simplified. Further, according to the present invention, if the outer case and the seat plate are fixed to each other with an adhesive, the vibration resistance is improved, and good surface mounting strength can be obtained.

[Brief description of drawings]

FIG. 1 is an overall perspective view, a bottom view, and a sectional view of an essential part showing an embodiment of the present invention.

FIG. 2 is an exploded perspective view and a perspective view of a main part showing a conventional electronic component.

[Explanation of reference numerals] 10 Aluminum electrolytic capacitor which is an electronic component 11 Dummy terminal 13 End portion 14 Projection portion 21 Outer case 22 Sealing portion 23 Lead terminal 24 Seat plate 25 Bottom surface 30 Adhesive

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01G 9/00-9/10 H01G 2/06

Claims (4)

(57) [Claims] 1. A bottomed cylindrical outer case having a built-in component element, a pair of lead terminals pulled out from a sealing portion of the outer case, and an end surface of the outer case on the side of the sealing portion. In the electronic component having a plate-shaped seat plate, each of the lead terminals is bent in a direction away from each other along the bottom surface of the seat plate while penetrating the seat plate, the bottom surface of the seat plate , Directly align with the extension direction of each lead terminal.
The recess reaching the end face of the seat plate along the intersecting direction is the front
Formed symmetrically about the center of the bottom of the seat plate
The electronic component is characterized in that a flat plate-shaped dummy terminal is provided in each of the recesses, and an end portion of the dummy terminal projects to the outside of the planar contour shape of the seat plate. 2. The dummy terminal has an adhesive in the recess.
The electronic component according to claim 1, which is fixed via the electronic component. 3. The dummy terminals are intersected in the plane direction.
Has a protrusion extending in the inserting direction, and the protrusion is the concave
The electronic component according to claim 1 , wherein the electronic component is embedded in the seat plate inside the portion . 4. The outer peripheral side of the sealing portion of the outer case and the seat
The electronic component according to claim 1, wherein the plate and the plate are fixed to each other with an adhesive .