JP2009290094A - Electronic component and its mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component difficult to generate a peeling between the electronic component and a substrate for a mounting, and to provide a method for mounting the electronic component having a simple mounting process and an excellent vibration resistance. <P>SOLUTION: In the electronic component 1 to be mounted on the substrate, the electronic component includes an insulating member 6. In the electronic component, the partial region of a surface opposed to the substrate in the insulating member 6 is coated with an adhesive 7 melted by a reflow. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component and a method for mounting the electronic component, and more particularly to an electronic component and a method for mounting the electronic component, in which separation between the electronic component and a substrate is less likely to occur.

Generally, as a method of mounting an electronic component on a substrate, after applying cream solder to the electrode of the substrate, the terminal of the electronic component is mounted on the electrode of the substrate, the cream solder is melted by reflow, A method of mounting an electronic component by electrically connecting it to a substrate is used. (For example, see Patent Document 1)
However, according to this conventional mounting method, after mounting, loads such as stress concentrate on the cream solder connection part or electrode part between the electronic component and the substrate, so when using it under strong vibration or stress conditions, There was a problem that the cream solder connection part and the electrode part were damaged.

  Thus, in recent years, electronic component mounting methods have been developed that are less likely to cause separation between the electronic component and the substrate and have high vibration resistance.

For example, when an electronic component is mounted on a substrate to form an electronic circuit (substrate module), a method of applying the adhesive on the substrate and mounting the electronic component (for example, see Patent Document 2) has been proposed.
However, according to the prior art disclosed in Patent Document 2, a step of applying an adhesive to the substrate, a step of irradiating ultraviolet rays to impart viscosity to the adhesive, and a step of curing are required. Since it is necessary to accurately apply the adhesive to the substrate, there is a problem that the mounting process becomes complicated and takes time.

For example, a method for mounting an electronic component (see, for example, Patent Document 3) in which an adhesion improver is applied to either one of the electronic component and the substrate has been proposed.
However, according to the prior art disclosed in Patent Document 3, it is necessary to apply an adhesive to the electronic component or the substrate, and it is necessary to accurately apply the adhesive on the electronic component or the substrate. As a result, the mounting process becomes complicated and time-consuming.
Japanese Patent Application Laid-Open No. 2004-247639 JP-A-6-25611 JP 2004-312051 A

  An object of the present invention is to provide an electronic component that is less likely to be peeled off from a mounting substrate. Another object of the present invention is to provide a method of mounting an electronic component that has a simple mounting process and has excellent vibration resistance.

In order to achieve the above object, the present invention provides an electronic component mounted on a substrate, the electronic component comprising an electronic component main body and an insulating member on a surface of the electronic component main body facing the substrate, An electronic component is provided, wherein an adhesive that melts by reflow is applied to at least a partial region of a surface of the member that faces the substrate.
According to this configuration, the adhesive applied to the insulating member is melted by reflow so that the insulating member and the substrate can be joined, and at the same time, the electronic component body and the substrate are electrically connected. The mounting process on the substrate can be made simpler than before. In addition, when the adhesive is applied to at least a part of the surface of the insulating member facing the substrate, and particularly when applied to the entire region, the contact area between the electronic component and the substrate increases, so that the electronic component is mounted on the substrate. Even when strong vibration is applied in a state of being mounted on the electronic component, it is possible to provide an electronic component that hardly peels off from the substrate.

The said structure WHEREIN: It is preferable that the adhesive agent fuse | melted by reflow is apply | coated to the at least one part area | region of the surface facing the said electronic component main body in the said insulating member.
According to this configuration, since the electronic component main body and the substrate are firmly bonded via the insulating member by the adhesive applied to the insulating member, even if strong vibration is applied while the electronic component is mounted on the substrate. It is possible to provide an electronic component that does not easily peel off from the substrate.

  Further, the insulating member is preferably an insulating exterior member that covers the entire electronic component main body, and an adhesive that melts by reflow is applied to at least a part of the outer surface of the exterior member. .

In order to achieve the above object, the present invention is also a method for mounting an electronic component on a substrate, comprising: (a) an electronic component body; and an insulating member interposed on a surface of the electronic component body facing the substrate. And (b) applying an adhesive that melts by reflow to at least a partial region of the surface of the insulating member that faces the substrate; and (c) by reflow. And a step of melting the adhesive and electrically connecting the electronic component main body to the substrate.
According to this method, the adhesive applied to the insulating member can be melted by reflow, and the insulating member and the substrate can be joined together. At the same time, the electronic component body and the substrate can be electrically connected. The mounting method can be made simpler than before.
In addition, when an adhesive is applied to at least a part of the surface of the insulating member facing the substrate, and particularly when applied to the entire region, the contact area between the electronic component and the substrate increases. Even when strong vibration is applied in the mounted state, it is possible to provide a method for mounting an electronic component that surely has excellent vibration resistance.

In the above method, in the step (b), it is preferable that an adhesive that melts by reflow is applied to at least a part of the surface of the insulating member that faces the electronic component main body.
According to this method, since the electronic component main body and the substrate are firmly bonded via the insulating member by the adhesive applied to the insulating member, even if strong vibration is applied while the electronic component is mounted on the substrate. It is possible to provide a method for mounting an electronic component having excellent vibration resistance.

  In this case, it is preferable that the insulating member is an insulating member having an insulating property for holding the electronic component main body or an insulating member having an insulating property for covering the entire electronic component main body. Moreover, it is preferable that the material used as the adhesive is any one of an acrylic adhesive, a polyurethane adhesive, and a polyolefin adhesive, or a combination thereof.

  According to the present invention, in the electronic component to be mounted on the substrate, the adhesive that melts by reflow is applied to the insulating member, so that it is possible to provide an electronic component that does not easily peel off from the substrate. In addition, the adhesive applied to the insulating member is melted by reflow to join the insulating member and the substrate or the electronic component main body, and at the same time, the electronic component main body and the substrate are electrically connected, and the substrate and the electronic device are connected via the insulating member. Since the components are configured to be firmly joined, an electronic component mounting method having a simple mounting process and excellent vibration resistance can be provided.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a partially cutaway sectional view showing the structure of an electronic component according to a first embodiment of the present invention, FIG. 2 is a perspective view of the electronic component of FIG. 1, and FIG. FIG. In the illustrated embodiment, the electronic component is configured as a chip-type aluminum electrolytic capacitor.
As shown in FIG. 1, a chip-type aluminum electrolytic capacitor (electronic component) 1 to be mounted on a substrate (not shown) includes a chip-type aluminum electrolytic capacitor main body (electronic component main body) and an insulating member 6. .
The chip-type aluminum electrolytic capacitor body includes a metal case 2, an aluminum electrolytic capacitor element 3 housed in the metal case 2, and a positive terminal 4a and a negative terminal 4b drawn out from the aluminum electrolytic capacitor element 3 as potential extraction terminals. And the sealing member 5. The insulating member 6 is interposed between the chip type aluminum electrolytic capacitor main body and the substrate in order to hold the lower part of the chip type aluminum electrolytic capacitor main body.
An adhesive 7 that melts by reflow is applied to at least a part of the surface of the insulating member 6 that faces the substrate. An adhesive 7 that melts by reflow is applied to at least a part of the surface of the insulating member 6 that faces the chip-type aluminum electrolytic capacitor main body.

Although not shown, the aluminum electrolytic capacitor element 3 includes an anode foil, a cathode foil, a separator, and a driving electrolyte or a conductive material. The anode foil and the cathode foil are each formed by forming an oxide film layer serving as a dielectric on the surface of a roughened aluminum foil, and are connected to the + terminal 4a and the −terminal 4b, respectively. The aluminum electrolytic capacitor element 3 is formed of a winding of an anode foil and a cathode foil with a separator interposed therebetween, and a driving electrolyte or a conductive material. Stored.
And the sealing member 5 provided with the through-hole which each penetrates the + terminal 4a and-terminal 4b is provided in the opening part of the metal case 2, and the peripheral surface of the open end vicinity of this metal case 2 is drawn in an annular shape By doing so, a chip-type aluminum electrolytic capacitor main body is configured.

Next, an electronic component mounting method according to the present invention will be described using the above-described chip-type aluminum electrolytic capacitor 1 as an example.
First, as step (a), the chip-type aluminum electrolytic capacitor 1 (electronic) including a chip-type aluminum electrolytic capacitor main body (electronic component main body) and an insulating member 6 interposed between the chip-type aluminum electrolytic capacitor main body and the substrate. Parts).
Next, as step (b), as described above, the adhesive 7 is applied to at least a partial region of the surface of the insulating member 6 facing the substrate. In the step (b), when the adhesive 7 is applied to at least a part of the surface of the insulating member 6 facing the chip-type aluminum electrolytic capacitor body, the step (b) is included in the step (a). carry out. That is, a chip-type aluminum electrolytic capacitor main body and an insulating member 6 are prepared, and as a step (b), the adhesive 7 is applied to both surfaces of the insulating member 6 and then the insulating member 6 is attached to the chip-type aluminum electrolytic capacitor main body. The adhesive 7 is made of a suitable known adhesive that melts by reflow. In this embodiment, an acrylic adhesive is used.
In this case, in the step (b), the adhesive 7 may be applied only to one surface of the insulating member 6 facing the substrate or the chip-type aluminum electrolytic capacitor main body.

  Further, as step (c), the adhesive 7 is melted by reflow, and the chip-type aluminum electrolytic capacitor main body is electrically connected to the substrate.

  According to the present invention, the adhesive 7 is applied to at least a part of the surface of the insulating member 6 facing the chip-type aluminum electrolytic capacitor main body and the substrate, and the adhesive 7 is melted simultaneously with the reflow. Both the aluminum electrolytic capacitor main body and the substrate are strongly bonded via the insulating member 6. Thereby, even when strong vibration is applied from any direction to the + terminal 4a or the-terminal 4b in a state where the chip-type aluminum electrolytic capacitor 1 is mounted on the substrate, the generation of excessive vibration is suppressed, and excellent resistance is achieved. An electronic component having vibration and a mounting method thereof can be realized.

  In the step (b), the electronic component mounted by the method of applying the adhesive 7 only to the surface of the insulating member 6 facing the substrate of the chip type aluminum electrolytic capacitor is the chip type aluminum electrolytic capacitor main body of the insulating member 6. The vibration resistance is slightly inferior to that of the electronic component mounted by the method of applying the adhesive 7 on both surfaces facing the substrate, but the vibration resistance is superior to the electronic component mounted by the conventional method. Needless to say.

  4A and 4B are diagrams showing another modification of the insulating member 6 according to the first embodiment of the present invention, in which FIG. 4A is a plan view and FIG. 4B is a side sectional view. As shown in FIG. 4, an adhesive 7 is applied to the concave portion of the insulating member 6 in which the concave portion is provided on the outer surface in the direction perpendicular to the direction in which the lead wire is bent. This modification is particularly effective when a large electronic component main body or the like that is susceptible to vibration is mounted on a substrate, and the same effect as described above can be obtained.

  FIG. 5 is a view showing still another modification of the insulating member 6 according to the first embodiment of the present invention, in which (a) is a plan view and (b) is a side sectional view. Needless to say, this configuration further increases the effect.

(performance test)
Using the mounting method according to the first embodiment of the present invention, the chip type aluminum electrolytic capacitor 1 was actually mounted on the substrate, and the performance was compared with the chip type aluminum electrolytic capacitor mounted on the substrate using the conventional method.

  For each of the example and the conventional example, 20 samples (φ10 × 13 mm) were prepared and mounted on a substrate, and a vibration resistance test was performed. The vibration resistance test was performed under the conditions in which vibration acceleration 30G and a frequency of 10 to 2000 Hz were applied for 2 hours in the X, Y, and Z directions (the lead wire bending direction was the X direction) of each sample. The test results are shown in Table 1.

As can be seen from Table 1, in the example, the chip-type aluminum electrolytic capacitor 1 is not detached from the substrate.
As described above, in the chip type aluminum electrolytic capacitor 1 of the embodiment, the adhesive 7 is applied to the insulating member 6 and the bonding with the adhesive 7 is performed simultaneously with the reflow. Therefore, the chip type aluminum electrolytic capacitor 1 is mounted on the substrate. Even if strong vibration is applied in the applied state, excellent vibration resistance can be obtained.

Moreover, the method of apply | coating the adhesive agent 7 to the said insulating member 6 is not limited to these. As long as the insulating member 6 can be bonded to either one or both of the chip-type aluminum electrolytic capacitor 1 and the substrate, the position, shape, size, amount applied, etc. of the adhesive 7 are not limited. .
Furthermore, in 1st Example, after apply | coating the adhesive agent 7 of the insulating member 6, the insulating member 6 was attached to the chip-type aluminum electrolytic capacitor main body, but after attaching the insulating member 6 to the chip-type aluminum electrolytic capacitor main body, It goes without saying that the same effect can be obtained even if the adhesive 7 is applied to the surface of the insulating member 6 facing the substrate.

(Second embodiment)
In this embodiment, the electronic component is made of a tantalum electrolytic capacitor, and the structure of the electronic component main body and the insulating member is different from that of the first embodiment.
FIG. 6 is a cross-sectional view showing the structure of the tantalum electrolytic capacitor, and FIG. 7 is a perspective view of the tantalum electrolytic capacitor of FIG.
As shown in FIGS. 6 and 7, a tantalum electrolytic capacitor (electronic component) 10 to be mounted on a substrate (not shown) includes a tantalum electrolytic capacitor element (corresponding to an electronic component body) 11 and an exterior member (insulating member). 8 and.
The exterior member 8 is made of an insulative exterior resin mold that covers the entire tantalum electrolytic capacitor element 11, and an adhesive 7 that melts by reflow is applied to at least a part of the outer surface of the exterior member 8. The tantalum electrolytic capacitor element 11 includes a positive terminal 9a and a negative terminal 9b that are led out from the tantalum electrolytic capacitor element 11 as potential extraction terminals.

Next, a mounting method of the above tantalum electrolytic capacitor 10 will be described.
First, as step (a), as described above, the tantalum electrolytic capacitor 10 including the tantalum electrolytic capacitor element 11 and the exterior member 8 formed on the outer periphery of the tantalum electrolytic capacitor element 11 is prepared.
Next, as step (b), as described above, the adhesive 7 is applied to at least a partial region of the surface of the exterior member 8 that faces the substrate. The adhesive 7 is made of a suitable known adhesive that melts by reflow. Then, the lead terminals 9 a and 9 b are bent along the exterior member 8.

  Further, as step (c), the adhesive 7 is melted by reflow, and the tantalum electrolytic capacitor 10 is electrically connected to the substrate.

  In this case, the tantalum electrolytic capacitor element 11 and the substrate are strongly bonded via the exterior member 8 by the adhesive 7 made of a material that melts by reflow. As a result, even if strong vibration is applied to the + terminal 4a or -terminal 4b from all directions after mounting, the generation of excessive vibration is suppressed, and it has excellent vibration resistance and reliability. An excellent electronic component and its mounting method can be realized.

FIG. 8 is a view showing a modification of the exterior member according to the second embodiment of the present invention, in which (a) is a side view and (b) is a bottom view.
8 differs from FIG. 6 in that the adhesive 7 applied to the exterior member 8 is applied only to a part of the bottom surface and side surface of the exterior member 8. Thereby, while the usage-amount of the adhesive agent 7 can be reduced, the arrangement space in the mounting to the board | substrate of the tantalum electrolytic capacitor 10 can be reduced. Further, in the same manner as described above, it is possible to realize an electronic component having excellent vibration resistance and a mounting method thereof.

  Needless to say, the effect is further increased by combining the techniques shown in FIGS. 6 and 8.

  Moreover, the method of apply | coating the adhesive agent 7 to the said exterior member 8 is not limited to these. As long as the exterior member 8 and the substrate can be bonded via an adhesive, the position, shape, size, amount applied, and the like of the adhesive 7 are not limited.

  In the above-described embodiments, the aluminum electrolytic capacitor and the tantalum electrolytic capacitor have been described as examples of the electronic component main body. However, the insulating member or the exterior member having an insulating property provided between the electronic component main body and the substrate is used. This is effective for electronic components. Various modifications and improvements can be made within the scope of the configurations described in the claims of the present application.

1 is a partially cutaway sectional view showing a structure of an electronic component according to a first embodiment of the present invention. It is a perspective view of the electronic component of FIG. It is the figure which showed the insulating member by 1st Example of this invention, (a) is a top view, (b) is side sectional drawing. It is the figure which showed another modification of the insulating member by 1st Example of this invention, (a) is a top view, (b) is side sectional drawing. It is the figure which showed another modification of the insulating member by 1st Example of this invention, (a) is a top view, (b) is side sectional drawing. It is sectional drawing which showed the structure of the tantalum electrolytic capacitor. It is a perspective view of the tantalum electrolytic capacitor of FIG. It is the figure which showed one modification of the exterior member by 2nd Example of this invention, (a) is a side view, (b) is a bottom view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip type aluminum electrolytic capacitor 2 Metal case 3 Aluminum electrolytic capacitor element 4a + terminal 4b-terminal 5 Sealing member 6 Insulating member 7 Adhesive 8 Exterior member 9a + Terminal 9b-Terminal 10 Tantalum electrolytic capacitor 11 Tantalum electrolytic capacitor element

Claims (6)

An electronic component mounted on a substrate,
The electronic component includes an electronic component main body and an insulating member interposed on a surface of the electronic component main body facing the substrate,
An electronic component, wherein an adhesive that melts by reflow is applied to at least a partial region of a surface of the insulating member that faces the substrate.   The electronic component according to claim 1, wherein an adhesive that melts by reflow is applied to at least a partial region of the surface of the insulating member that faces the electronic component main body.   The insulating member is made of an insulating exterior member that covers the entire electronic component body, and an adhesive that melts by reflow is applied to at least a partial region of the outer surface of the exterior member. The electronic component according to claim 1 or claim 2. A method of mounting electronic components on a board,
(A) preparing an electronic component comprising an electronic component body and an insulating member interposed on a surface of the electronic component body facing the substrate;
(B) applying an adhesive that melts by reflowing to at least a partial region of the surface of the insulating member facing the substrate;
And (c) melting the adhesive by reflow and electrically connecting the electronic component body to the substrate.   5. The electronic component according to claim 4, wherein in the step (b), an adhesive that melts by reflow is further applied to at least a partial region of the surface of the insulating member that faces the electronic component main body. How to implement   6. The insulating member according to claim 4, wherein the insulating member is an insulating member having an insulating property for holding the electronic component main body, or an insulating member having an insulating property for covering the entire electronic component main body. The electronic component mounting method described.

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