JP5170699B2 - Chip-type solid electrolytic capacitor and manufacturing method thereof - Google Patents

Description

  The present invention relates to a chip-type solid electrolytic capacitor and a method for manufacturing the same.

  A conventional solid electrolytic capacitor uses a metal such as tantalum or niobium as a valve action metal, is small, has a large capacitance, is excellent in frequency characteristics, and is widely used in a power supply circuit of a CPU.

  In recent years, with the widespread use of portable electronic devices, electronic devices are becoming smaller and thinner. There is a demand for downsizing and thinning of electronic components mounted on electronic devices, particularly solid electrolytic capacitors.

  In general, a solid electrolytic capacitor is formed by joining a lead frame anode terminal and a cathode terminal to a capacitor element provided with a dielectric oxide film on the surface of an anode valve metal body, then a solid electrolyte layer, and a cathode current collector. After that, the anode terminal and the cathode terminal are often exposed so that the whole is sealed with an insulating resin.

  In response to recent demands for miniaturization and thinning of solid electrolytic capacitors, the internal structure of the exterior resin part of the chip-type solid electrolytic capacitor has been simplified, the structural members embedded in the exterior resin part have been miniaturized, and the number of structural members The technology for reducing the size and thickness of chip-type solid electrolytic capacitors, reducing the size of the components embedded in the exterior resin portion, and reducing the number of components in the exterior resin portion A technology has been proposed in which the volume of the capacitor element is increased with respect to the space to increase the capacity of the chip-type solid electrolytic capacitor.

  For example, Patent Document 1 discloses a solid electrolytic capacitor to which the above technique is applied.

  In Patent Document 1, (1) an anode connection land and a cathode connection land etched in a lattice shape are provided on the upper surface of an insulating plate, and an anode terminal and a cathode terminal respectively connected to the land are provided on the lower surface. PWB with through-holes for fixing at the position of the insulating plate that does not overlap with, (2) Conductive material planted by laser welding on the surface of the anode connection land, and (3) Anode lead wire on one side And a cathode layer is formed on the other surface, the anode lead wire is connected to a conductive material, the cathode layer is connected to a cathode connection land via a conductive adhesive, and is mounted on the upper surface of the PWB. And (4) a chip-type solid electrolytic capacitor composed of an exterior resin that covers the entire upper surface of the PWB including the capacitor element.

Japanese Patent Laid-Open No. 2004-104048

  Hereinafter, a conventional chip-type solid electrolytic capacitor in which external mounting terminals are arranged on the lower surface of the capacitor body will be described with reference to FIG.

  FIG. 4 is a cross-sectional view illustrating a conventional chip-type solid electrolytic capacitor in which external mounting terminals are arranged on the lower surface of the capacitor body. The chip-type solid electrolytic capacitor 417 includes a capacitor element 401, an anode lead wire 402, a support member 403, an exterior resin part 409, a conductive adhesive 411, and a terminal substrate 413.

  Similar to the capacitor element according to the prior art, the capacitor element 401 forms a sintered body by sintering powder of valve action metal such as tantalum, aluminum, niobium or the like into a square shape or a cylindrical shape, and at the same time, An anode lead wire 402 is embedded in the side surface. Further, a manganese dioxide layer, a graphite layer, a silver layer, and the like are formed on the outer periphery of the sintered body, and a cathode portion (not shown) is formed on the bottom surface of the sintered body.

  The terminal board 413 includes an anode connection terminal 404 and a cathode connection terminal 406 on one surface of an insulating member 412 made of a single-layer plate made of an insulating resin, and the other surface of the insulating member 412. The anode external mounting terminal 405 is provided at a position facing the anode connection terminal 404, and the cathode external mounting terminal 407 is further provided at a position facing the cathode connection terminal 406.

  Further, the terminal substrate 413 is a hole having openings in the anode connection terminal 404 and the anode external mounting terminal 405 and penetrating the insulating member 412, and the anode connection terminal 404, the anode external mounting terminal 405, and the like. The through hole 408a for conduction formed on the inner surface of the hole, and the cathode connection terminal 406 and the cathode external mounting terminal 407 have openings and penetrate the insulating member 412. And a conduction through hole 408b in which an etching process for electrically connecting the cathode connection terminal 406 and the cathode external mounting terminal 407 is performed on the inner surface of the hole.

  Further, the terminal substrate 413 is a through hole for fixing which is a hole penetrating the insulating member 412 in a region excluding the anode connection terminal 404, the cathode connection terminal 406, the anode external mounting terminal 405, and the cathode external mounting terminal 407. 415a and a fixing through hole 415b.

  The chip-type solid electrolytic capacitor 417 is planted by welding the support member 403 to the surface of the anode connection terminal 404 of the terminal substrate 413 and then electrically connecting the anode lead wire 402 of the capacitor element 401 to the support member 403. Further, a cathode portion (not shown) provided on the bottom surface of the capacitor element 401 is electrically connected to the surface of the cathode connection terminal 406 via a conductive adhesive 411.

  Thereafter, an exterior resin portion 409 is provided on one surface of the terminal substrate 413 on which the capacitor element 401 is disposed, and the capacitor element 401, the anode lead wire 402, the support member 403, the anode connection terminal 404, the cathode connection terminal 406, and It is created by embedding a conductive adhesive 411.

  In the chip-type solid electrolytic capacitor 417, the exterior resin portion 409 provided on the terminal substrate 413 enters the fixing through hole 415 a and the fixing through hole 415 b provided on the terminal substrate 413, and fixes the terminal substrate 413 and the exterior resin portion 409. It can serve as a wrinkle and can increase the bonding strength between the terminal substrate 413 and the exterior resin portion 409.

  Generally, as a means for providing the exterior resin portion 409 on the terminal board 413, a means for filling and thermosetting a liquid thermosetting resin, or a liquid by heating a solid thermosetting resin and injecting it into a mold and molding. There are means such as transfer molding. In both of these means, the thermosetting resin forming the exterior resin portion 409 becomes liquid during the molding process, and the capacitor element 401 of the fixing through hole 415a and the fixing through hole 415b provided in the terminal substrate 413 is disposed. In order to flow out from the opening on the other surface, it is necessary to close the opening with a heat-resistant tape or the like. Furthermore, after molding the exterior resin part 409, there is a problem that the heat-resistant tape must be removed and burrs of the exterior resin part 409 protruding from the opening must be removed.

  Hereinafter, a conventional chip-type solid electrolytic capacitor in which an exterior resin portion can be provided on a terminal substrate without using a heat-resistant tape will be described with reference to FIG.

  FIG. 5 is a cross-sectional view for explaining another example of a chip-type solid electrolytic capacitor in the prior art. The chip-type solid electrolytic capacitor 517 includes a capacitor element 501, an anode lead wire 502, a support member 503, an exterior resin part 509, a conductive adhesive 511, and a terminal substrate 513.

  Similar to the capacitor element according to the prior art, the capacitor element 501 forms a sintered body by sintering a powder of valve action metal such as tantalum, aluminum, niobium or the like into a square shape or a cylindrical shape. An anode lead wire 502 is embedded in the side surface. Further, a manganese dioxide layer, a graphite layer, a silver layer, and the like are formed on the outer periphery of the sintered body, and a cathode portion (not shown) is formed on the bottom surface of the sintered body.

  The terminal substrate 513 is provided with an anode connection terminal 504 and a cathode connection terminal 506 on one surface of an insulating member 512 made of a laminated plate obtained by laminating a plurality of insulating resin plates, and the insulating member 512 On the other side, an anode external mounting terminal 505 is provided at a position facing the anode connection terminal 504, and a cathode external mounting terminal 507 is further provided at a position facing the cathode connection terminal 506.

  Further, the terminal substrate 513 is a hole having openings in the anode connection terminal 504 and the anode external mounting terminal 505 and penetrating through the insulating member 512, and the anode connection terminal 504 and the anode external mounting terminal 505. In order to make the electrical connection, the through hole 508a for conduction formed in the inner surface of the hole, the connection terminal 506 for the cathode and the external mounting terminal 507 for the cathode have openings, and the insulating member 512 is provided. This is a through-hole, and is provided with a through-hole for conduction 508b in which etching processing is performed on the inner surface of the hole for electrical connection between the cathode connection terminal 506 and the cathode external mounting terminal 507.

  Further, the terminal substrate 513 is formed in a region excluding the anode connection terminal 504, the cathode connection terminal 506, the anode external mounting terminal 505, and the cathode external mounting terminal 507, and a fixing via hole 514a and a fixing via hole. 514b.

  The fixing via hole 514a and the fixing via hole 514b are formed in a laminated plate in which a plurality of insulating resin plates constituting the insulating member 512 are laminated, and a hole penetrating in advance in the resin plate material forming the surface layer is provided. By laminating together with a resin plate material that does not have a through-hole, a resin plate material having an opening in the surface layer of the insulating member 512 and having an insulating property of the insulating member 512 is used as a bottom surface, and a cross-sectional shape A hole having a concave shape is formed in the insulating member 512.

  The chip-type solid electrolytic capacitor 517 is planted by welding a support member 503 to the surface of the anode connection terminal 504 of the terminal substrate 513 and then electrically connecting the anode lead wire 502 of the capacitor element 501 to the support member 503. Further, a cathode portion (not shown) provided on the bottom surface of the capacitor element 501 is electrically connected to the surface of the cathode connection terminal 506 via a conductive adhesive 511.

  Thereafter, an exterior resin portion 509 is provided on one surface of the terminal substrate 513 on which the capacitor element 501 is arranged, and the capacitor element 501, the anode lead wire 502, the support member 503, the anode connection terminal 504, the cathode connection terminal 506, and It is created by embedding a conductive adhesive 511.

  In the chip-type solid electrolytic capacitor 517, the exterior resin portion 509 provided on the terminal substrate 513 enters the fixing via hole 514a and the fixing via hole 514b provided on the terminal substrate 513, and fixes the terminal substrate 513 and the exterior resin portion 509. The joint strength between the terminal board 513 and the exterior resin portion 509 can be increased.

  The fixing via hole 514a and the fixing via hole 514b do not penetrate the insulating member 512, and the exterior resin portion is formed on the surface of the insulating member 512 on the side where the external mounting terminal for anode 505 and the external mounting terminal for cathode 507 are provided. Since 509 does not leak out, it is not necessary to use a heat-resistant tape, and since no burrs are generated in the exterior resin portion 509, the deburring operation is also unnecessary.

  However, the thickness of an insulating resin single-layer plate used as an insulating member is often about 0.1 mm, and it is not possible to create a hole having a concave cross-sectional shape using a cutting machine or the like. In general, as described with reference to FIG. 5, the cross-sectional shape is concave by laminating a resin plate having a through hole and a resin plate having no through hole, as described in FIG. 5. In many cases, a fixing via hole is obtained in an insulating member by creating a hole, and the insulating member provided with the fixing via hole is a laminated plate formed by laminating a plurality of resin plate materials. There is a problem that it becomes thick and hinders miniaturization of the chip-type solid electrolytic capacitor.

  The object of the present invention is to solve the above-mentioned problems, to ensure that the terminal substrate and the exterior resin part are joined without damaging the insulating member, to eliminate the need for heat-resistant tape pasting work and deburring work, and to reduce costs. It is another object of the present invention to provide a chip-type solid electrolytic capacitor capable of reducing the thickness of an insulating member and reducing the size or increasing the capacity, and a method for manufacturing the same.

  According to the present invention, a capacitor element having an anode body made of a valve action metal from which an anode lead wire is led out on one side surface, a support member made of metal and electrically connected to the anode lead wire, and an insulating property A plate-like insulating member, and an anode connecting terminal electrically connected to the support member on one surface of the insulating member, and a cathode portion provided on the bottom surface of the capacitor element. The cathode connection terminal is provided, and the anode external mounting terminal electrically connected to the anode connection terminal and the cathode external mounting terminal electrically connected to the cathode connection terminal are provided on the other surface. A terminal board, on the surface of the terminal board on the side provided with the anode connection terminal and the cathode connection terminal, the capacitor element, the anode lead wire, the support member, the anode connection terminal, and the Cathode connection end A chip-type solid electrolytic capacitor having an exterior resin portion embedded therein, the anode external mounting terminal and the cathode external mounting terminal being a bottom surface on one surface of the terminal substrate on which the capacitor element is disposed. A chip-type solid electrolytic capacitor characterized in that a fixing via hole having a concave cross-sectional shape is provided.

  According to the present invention, there is obtained a chip-type solid electrolytic capacitor in which the fixing via hole is provided with openings on the terminal surfaces of the anode connection terminal and the cathode connection terminal.

  According to the present invention, there is obtained a chip-type solid electrolytic capacitor in which the fixing via hole has a circular opening or a long hole opening.

  Further, according to the present invention, the step of electrically connecting the anode lead wire and the support member, and the anode connection terminal and the cathode connection terminal having a region where a part of the insulating member is exposed are provided. A step of forming on the terminal substrate; a step of irradiating a region where the part of the insulating member is exposed with a laser beam; removing a part of the exposed insulating member; creating a hole having a concave cross-sectional shape; A step of performing copper plating on the inner surface of the hole, a step of electrically connecting the support member to the anode connection terminal via high-temperature solder, and a conductive adhesive to the cathode connection terminal Electrically connecting the cathode portion, forming the exterior resin portion on the surface of the terminal substrate on which the capacitor element is disposed, and cutting the terminal substrate together with the formed exterior resin portion to a predetermined size Having a process of Method for manufacturing a chip type solid electrolytic capacitor characterized the door is obtained.

  In the laser processing technology using laser light, the present invention pays attention to the fact that metals such as gold, silver, and copper have high reflectivity of laser light and are difficult to process. An external mounting terminal made of a metal such as gold, silver, or copper is provided on one surface, laser light is irradiated from the other surface of the insulating member toward the external mounting terminal, and a predetermined region of the insulating member is irradiated with the irradiated laser light. In this case, the insulating resin constituting the insulating member is burned off, and the resin is removed until the external mounting terminal provided on one surface is exposed, so that the external mounting terminal is the bottom surface and the cross-sectional shape is concave. It is possible to provide a fixing via hole, which is a hole, in the terminal substrate of the chip-type solid electrolytic capacitor.

  Furthermore, in the present invention, when creating a connection terminal made of a metal such as gold, silver, copper, etc. on a plate made of an insulating resin or the like that constitutes an insulating member constituting the terminal board, in advance in the area of the connection terminal In addition, by providing a region where there is no metal such as gold, silver, copper, etc. in the region corresponding to the opening of the fixing via hole, it is possible to remove the resin of the exposed plate material by laser light irradiation, The laser beam can be blocked against a resin of a plate material covered with a metal such as gold, silver, or copper, particularly a resin near the opening of the fixing via hole.

  Furthermore, in the present invention, a fixing via hole is provided in the terminal substrate, and the shape of the fixing via hole opening is circular or oblong, thereby increasing the bonding area between the terminal substrate and the exterior resin portion. Can do.

  According to the present invention, by using processing of a terminal board using laser light, it becomes possible to provide a fixing via hole in the terminal board having a bottom surface as an external mounting terminal and a hole having a concave cross-sectional shape. As described above, it is not necessary to use a laminated board in which a plurality of insulating resin boards are laminated as a terminal board, and it is possible to use a single-layer resin board, and the exterior provided on the terminal board. The resin part enters the fixing via hole, and it is possible to prevent the exterior resin part from leaking to the surface of the terminal board on the side where the external mounting terminal is provided, while ensuring the bonding between the terminal board and the exterior resin part, Since the thickness of the terminal substrate of the chip-type solid electrolytic capacitor can be reduced, there is no need for heat-resistant tape application and deburring, cost reduction, and further reduction in size and increase in capacity The solid electrolytic capacitor and its manufacturing method are obtained.

  Furthermore, according to the present invention, the resin plate material constituting the insulating member of the terminal board is shielded against the laser beam in the region covered with the metal such as gold, silver, copper, etc. constituting the connection terminal, and the plate material is exposed. Because the laser beam can be irradiated only to the part that has been fixed, the insulating member near the opening of the fixing via hole can be prevented from being damaged by the laser beam, and the external mounting terminal is used as the bottom and the cross-sectional shape is a concave hole. A chip-type solid electrolytic capacitor in which a via hole can be provided in a terminal substrate and a manufacturing method thereof are obtained.

  Furthermore, according to the present invention, since the bonding area between the terminal substrate and the exterior resin portion can be increased, the chip-type solid electrolytic capacitor capable of making the bonding between the terminal substrate and the exterior resin portion more reliable and its manufacture A method is obtained.

BRIEF DESCRIPTION OF THE DRAWINGS Sectional drawing explaining 1st Embodiment of the chip-type solid electrolytic capacitor of this invention. It is a figure explaining the 2nd form of the terminal board concerning a chip type solid electrolytic capacitor of the present invention, and Drawing 2 (a) is a top view of a terminal board, and Drawing 2 (b) is AA of Drawing 2 (a). FIG. FIGS. 3A and 3B are views for explaining a third embodiment of a terminal substrate according to the chip-type solid electrolytic capacitor of the present invention, FIG. 3A is a plan view of the terminal substrate, and FIG. FIG. Sectional drawing explaining the chip-type solid electrolytic capacitor of a prior art. Sectional drawing explaining the chip-type solid electrolytic capacitor of the other example of a prior art.

  The form of the chip-type solid electrolytic capacitor of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a cross-sectional view illustrating a first embodiment of a chip-type solid electrolytic capacitor of the present invention. A chip-type solid electrolytic capacitor 17 includes a capacitor element 1, an anode lead wire 2, a support member 3, and an exterior resin. Part 9, high-temperature solder 10, conductive adhesive 11, and terminal board 13.

  Capacitor element 1 may be the same as capacitor element 401 and capacitor element 501 according to the prior art described with reference to FIGS. 4 and 5 and can be selected as appropriate.

  The anode lead wire 2 may be a metal wire material such as a tantalum wire, tin-plated copper wire, or nickel wire, and can be selected as appropriate.

  The supporting member 3 can use metals, such as copper, a copper alloy, or an iron nickel alloy, and can select it suitably.

  The exterior resin portion 9 can be made of a thermosetting resin such as a liquid or solid epoxy resin or phenol resin, and can be appropriately selected.

  The high-temperature solder 10 includes Sn (tin), Ag (silver), Cu (copper), etc., and can use a high-temperature solder having a melting point of about 270 ° C. Curing of the thermosetting resin selected as the exterior resin portion 9 It is better to select it considering the temperature.

  As the conductive adhesive 11, an adhesive mixed with a material having good conductivity such as silver powder, copper powder, or carbon fiber can be used and can be appropriately selected. In particular, a silver paste is preferable in consideration of conductivity.

  The terminal board 13 has an anode connection terminal 4 and a cathode connection terminal 6 on one surface of the insulating member 12, and an anode at a position facing the anode connection terminal 4 on the other surface of the insulating member 12. And external cathode mounting terminals 7 at positions facing the cathode connection terminals 6.

Further, the terminal board 13 has an opening in the anode connection terminal 4 and the anode external mounting terminal 5.
The fixing via hole 14a and the conduction via hole 8a having the bottom surface as a bottom, the opening for the cathode connection terminal 6 and the fixing via hole 14b and the conduction via hole 8b having the cathode external mounting terminal 7 as the bottom surface are provided. Prepare.

  For the insulating member 12, for example, a plate material of about 0.1 mm such as glass epoxy resin, polyimide resin, or fluororesin can be used and can be selected as appropriate.

  The anode connection terminal 4, the cathode connection terminal 6, the anode external mounting terminal 5, and the cathode external mounting terminal 7 are made of gold, silver, copper in a predetermined region on the insulating member 12 using existing printed wiring technology. Create a metal layer such as

  The fixing via hole 14a, the conduction via hole 8a, the fixation via hole 14b, and the conduction via hole 8b are formed when the anode connection terminal 4 and the cathode connection terminal 6 are formed using the existing printed wiring technology. In addition, a metal layer such as gold, silver, or copper is preliminarily formed in regions of the anode connection terminal 4 and the cathode connection terminal 6 corresponding to the openings of the conduction via hole 8a, the fixing via hole 14b, and the conduction via hole 8b. A region not provided is provided, and a region not provided with a metal layer such as gold, silver, copper, etc. is irradiated with a laser beam, and the portion where the resin constituting the insulating member 12 is exposed is burned off, and the anode connection terminal 4 and the cathode connection terminal 6 have openings, the anode external mounting terminal 5 and the cathode external mounting terminal 7 are bottom surfaces, and a hole having a concave cross section is formed, and the fixing via hole 14a and Create a titration, a via hole 14b, further, subjected to copper plating on the inner surface of the hole corresponding to the conductive via hole 8a and conductive via holes 8b, to create a conductive via hole 8a and conductive via holes 8b.

  The chip-type solid electrolytic capacitor 17 electrically connects the support member 3 to the anode lead wire 2 led out from the capacitor element 1 by resistance welding. Next, the high temperature solder 10 is applied to the anode connection terminal 4 of the terminal substrate 13, and the support member 3 is mounted on the high temperature solder 10, and then the support member 3 is irradiated with laser light to attach the support member 3. The high temperature solder 10 is melted by the heat of the heated support member 3 and the support member 3 and the anode connection terminal 4 are electrically connected.

  Next, after applying the conductive adhesive 11 to the cathode connection terminal 6 of the terminal substrate 13 and mounting the capacitor element 1 by bringing the cathode part of the capacitor element 1 (not shown) into contact with the conductive adhesive 11. The conductive adhesive 11 is heated, dried and cured, and the capacitor element 1 and the cathode connection terminal 6 are electrically connected.

  After that, the exterior resin 9 is provided so as to cover the capacitor element 1 on the terminal substrate 13, heated, cured, and molded, and then the terminal substrate 13 and the exterior resin 9 are cut into predetermined dimensions to be created.

  By setting it as the above-mentioned structure, the exterior resin part provided in the terminal board | substrate enters the via hole for fixation, and can join the terminal board | substrate and an exterior resin part reliably. Furthermore, since there is no through hole in the terminal board as in the prior art, there is no leakage of the exterior resin part to the surface of the terminal board on the side where the external mounting terminal is provided, and heat tape attaching work and deburring work become unnecessary, Cost reduction can be achieved. Furthermore, unlike the conventional case, it is not necessary to use a laminated board in which a plurality of insulating resin board materials are laminated as a terminal board, and a single-layer resin board material can be used. The thickness of the terminal substrate can be reduced, and the chip-type solid electrolytic capacitor can be reduced in size and capacity.

  Furthermore, by adopting the above-mentioned configuration, the laser beam can be blocked in the region covered with a metal such as gold, silver, or copper that constitutes the connection terminal with respect to the resin-made plate material that constitutes the insulating member of the terminal board. Since only the exposed portion can be irradiated with laser light, it is possible to prevent the insulating member near the opening of the fixing via hole from being damaged by the laser light.

(Second Embodiment)
FIG. 2 is a diagram for explaining a second embodiment of the terminal substrate according to the chip-type solid electrolytic capacitor of the present invention, which is used in the first embodiment of the chip-type solid electrolytic capacitor of the present invention described in FIG. One form of the terminal board which can be performed is shown.

  FIG. 2A is a plan view of the terminal board, and the terminal board 13 uses the method for creating the conductive via hole and the fixing via hole described in the first embodiment, and the insulating member 12 described in FIG. The anode connection terminal 4 provided above is provided with a conductive via hole 8a having a circular opening and a fixing via hole 14a having an elongated opening, and further on the insulating member 12 described in FIG. The connecting terminal 6 for cathode provided in FIG. 5 is formed by providing a conduction via hole 8b having a circular opening and a fixing via hole 14b having a long opening.

  FIG. 2B is a cross-sectional view taken along line AA in FIG. 2A, and is a cross-sectional view illustrating a configuration of a fixing via hole according to the chip-type solid electrolytic capacitor of the present invention. The fixing via hole 14 a provided in the terminal substrate 13 has an opening in the anode connection terminal 4, penetrates a part of the insulating member 12, and has a concave sectional shape with the anode external mounting terminal 5 as a bottom surface. Create a hole.

  By using the terminal substrate of the second embodiment in the first embodiment of the chip-type solid electrolytic capacitor of the present invention, the bonding area between the terminal substrate and the exterior resin portion can be increased, and the chip-type solid It is possible to more reliably bond the terminal substrate constituting the electrolytic capacitor and the exterior resin portion.

(Third embodiment)
FIG. 3 is a diagram for explaining a third embodiment of the terminal substrate according to the chip-type solid electrolytic capacitor of the present invention, which is used in the first embodiment of the chip-type solid electrolytic capacitor of the present invention described in FIG. Another form of the terminal board that can be produced is shown.

  FIG. 3A is a plan view of the terminal board, and the terminal board 13 uses the method for creating the conductive via hole and the fixing via hole described in the first embodiment, and the insulating member 12 described in FIG. A conductive via hole 8a having a circular opening, a fixing via hole 14c having a circular opening, a fixing via hole 14d, and a fixing via hole 14e are provided on the anode connection terminal 4 provided above. In the cathode connection terminal 6 provided on the insulating member 12 described in FIG. 1, a conductive via hole 8b having a circular opening, a fixing via hole 14f having a circular opening, a fixing via hole 14g, and a fixing A via hole 14h is provided and created.

  FIG. 3B is a cross-sectional view taken along the line BB in FIG. 3A, and is a cross-sectional view illustrating the configuration of the fixing via hole according to the chip-type solid electrolytic capacitor of the present invention. The fixing via hole 14c, the fixing via hole 14d, and the fixing via hole 14e provided in the terminal substrate 13 have an opening in the anode connection terminal 4 and penetrate through a part of the insulating member 12 to provide an external mounting terminal for the anode. It is created by providing a hole having a concave cross section with 5 as the bottom.

  By using the terminal substrate of the third embodiment in the first embodiment of the chip-type solid electrolytic capacitor of the present invention, the bonding area between the terminal substrate and the exterior resin portion can be increased, and the chip-type solid It is possible to more reliably bond the terminal substrate constituting the electrolytic capacitor and the exterior resin portion.

  Examples of the present invention will be specifically described below.

Example 1
First, since the production of the capacitor element 1 is a known technique, the case of using tantalum as a valve metal will be described in a simplified manner. Around the tantalum wire, tantalum powder is formed into a size of 1.10 mm × 0.90 mm × 1.40 mm with a press machine and sintered at high vacuum and high temperature. Next, an oxide film of Ta ₂ O ₅ is formed on the surface of the tantalum metal powder. Furthermore, after being immersed in manganese nitrate, it was thermally decomposed to form MnO ₂ , and subsequently a cathode layer made of graphite and Ag was formed to obtain a capacitor element 1.

In Example 1, MnO ₂ was used. However, for the purpose of obtaining a low ESR as a capacitor element, the same effect can be obtained by using a conductive polymer such as polythiophene or polypyrrole for the cathode layer.

  In the first embodiment, tantalum is used as the valve metal, but the same effect can be obtained by using niobium, aluminum, titanium, or the like. However, when an aluminum plate or foil is used as the valve metal, it is necessary to form a dielectric layer by electrolysis or the like without sintering.

  As the terminal board 13 of the first embodiment, the terminal board having the elongated hole-shaped opening described in FIG. 2 was used. Below, the terminal board | substrate 13 is demonstrated.

  The terminal board 13 uses a glass epoxy resin plate material having a thickness of 0.06 mm, a length dimension of 2.5 mm, and a width dimension of 1.5 mm as the insulating member 12. Then, after pasting a copper foil having a thickness of 0.02 mm, the copper foil on one surface provided on the insulating member 12 is processed using an existing printed wiring technique, and the diameter corresponding to the via hole 8a for conduction is A circular opening of 0.09 mm, and a slot-shaped opening corresponding to the fixing via hole 14a and having a radius of a circular arc of 0.1 mm and a length of 0.7 mm; An anode connection terminal 4 having a length dimension of 0.50 mm and a width dimension of 1.00 mm is provided, and a circular opening having a diameter of 0.09 mm corresponding to the conduction via hole 8b and a fixing Radius of the arc corresponding to the via hole 14b A cathode connection terminal 6 having a radius of 0.1 mm, a long hole-shaped opening having a length of 0.7 mm, a length of 1.25 mm, and a width of 1.00 mm is provided. . In this embodiment, one anode connection terminal and one cathode connection terminal are provided on the terminal board. However, even if a plurality of anode connection terminals and a plurality of cathode connection terminals are provided on the terminal board, the same applies. The effect is obtained.

  Next, the copper foil on the other surface provided on the insulating member 12 is processed, the anode external mounting terminal 5 is provided at a position facing the anode connection terminal 4, and further at a position facing the cathode connection terminal 6. A cathode external mounting terminal 7 was provided.

Next, a CO ₂ laser having a wavelength of 10.6 μm is exposed in the exposed portion of the glass epoxy resin plate corresponding to the conductive via hole 8 a and the fixing via hole 14 a in the region of the anode connection terminal 4. The glass epoxy resin of the plate material is removed, a hole having a concave cross-section with the external mounting terminal 5 for the anode as a bottom is formed, a fixing via hole 14a is provided, and a conduction via hole 8a is further provided. A copper via was plated on the inner surface of the hole corresponding to the above to provide a conduction via hole 8a.

Further, a CO ₂ laser having a wavelength of 10.6 μm is exposed to the exposed portion of the glass epoxy resin plate corresponding to the conduction via hole 8b and the fixing via hole 14b in the region of the cathode connection terminal 6. By irradiating the laser beam, the glass epoxy resin of the plate material is removed, a hole having a concave cross section with the external mounting terminal for cathode 7 as the bottom is formed, a fixing via hole 14b is provided, and further, the conduction via hole 8b is provided. Copper plating was applied to the inner surface of the corresponding hole to provide a via hole 8b for conduction, and the terminal substrate 13 used in Example 1 was provided.

  Next, resistance welding was performed on the support member 3 using an alloy piece containing 42% Fe (iron) and 42% Ni (nickel), and electrically connected to the anode lead wire 2.

  Next, on the anode connection terminal 4, a high-temperature solder 10 containing Sn (tin), Ag (silver), and Cu (copper) and having a melting point of 270 ° C. is applied, and the support member 3 is placed thereon. The support member 3 was irradiated with a laser beam of a semiconductor laser having a wavelength of 940 nm, the support member 3 was heated with the laser beam, the high-temperature solder 10 was melted, and the support member 3 and the anode connection terminal 4 were electrically connected.

  Next, after applying the conductive adhesive 11 containing Ag (silver) on the cathode connection terminal 6, the capacitor element 1 is mounted thereon, and cured by heating at 150 ° C. for 30 minutes, to thereby form the capacitor element. 1 and the cathode connection terminal 6 were electrically connected.

  Next, the capacitor element 1 is covered on the surface of the terminal board 13 on which the capacitor element 1 is mounted, and after applying a liquid thermosetting epoxy resin so that the resin thickness after molding becomes 1.10 mm, The epoxy resin was cured by heating at a temperature of 150 ° C. for 3 minutes, and the exterior resin portion 9 was provided on the terminal board 13.

  Next, by using a dicing saw, the exterior resin portion 9 provided on the terminal substrate 13 together with the insulating member 12 is cut into a length dimension of 2.00 mm and a width dimension of 1.25 mm. Type solid electrolytic capacitor was made.

(Example 2)
Next, the present Example 2 is a chip-type solid electrolytic capacitor of Example 1, in which the terminal substrate constituting the chip-type solid electrolytic capacitor has a fixing via hole having the circular opening described in FIG. This is an example of a substrate, and the configuration other than the terminal substrate is the same as that of the first embodiment, and the manufacturing method for the chip-type solid electrolytic capacitor is also the same. Accordingly, only the terminal board used in Example 2 will be described below.

  The terminal board 13 having the circular opening described in FIG. 3 is used as the terminal board 13 of the second embodiment. The insulating member 12 has a thickness of 0.06 mm and a length dimension of 2. A glass epoxy resin plate having a width of 1.5 mm and a width of 1.5 mm is used. After a 0.02 mm thick copper foil is pasted on both sides of the insulating member 12, insulation is performed using existing printed wiring technology. A copper foil on one surface provided on the member 12 is processed, and a circular opening having a diameter of 0.09 mm corresponding to the conduction via hole 8a, a fixing via hole 14c, a fixing via hole 14d, and a fixing via hole The anode connection terminal 4 having a circular opening with a diameter of 0.20 mm corresponding to 14e, a length dimension of 0.50 mm, and a width dimension of 1.00 mm is provided. Directly corresponding to via hole 8b And a circular opening having a diameter of 0.20 mm corresponding to the fixing via hole 14f, the fixing via hole 14g, and the fixing via hole 14h. The cathode connection terminal 6 having a width of 1.25 mm and a width dimension of 1.00 mm was provided. In this embodiment, one anode connection terminal and one cathode connection terminal are provided on the terminal board. However, even if a plurality of anode connection terminals and a plurality of cathode connection terminals are provided on the terminal board, the same applies. The effect is obtained.

  Next, the copper foil on the other surface provided on the insulating member 12 is processed, the anode external mounting terminal 5 is provided at a position facing the anode connection terminal 4, and further at a position facing the cathode connection terminal 6. A cathode external mounting terminal 7 was provided.

Next, in the region of the anode connection terminal 4, the glass epoxy resin plate material corresponding to the conduction via hole 8 a, the fixing via hole 14 c, the fixing via hole 14 d, and the fixing via hole 14 e is exposed. Irradiate laser light of CO ₂ laser with a wavelength of 10.6 μm, remove the glass epoxy resin of the plate material, form a hole with a concave cross-sectional shape with the external mounting terminal 5 for the bottom as a bottom, and a fixing via hole 14c, the fixing via hole 14d, and the fixing via hole 14e were provided, and the inner surface of the hole corresponding to the conductive via hole 8a was plated with copper to provide the conductive via hole 8a.

Further, in the region of the cathode connection terminal 6, in the portion where the glass epoxy resin plate material corresponding to the conduction via hole 8 b, the fixing via hole 14 f, the fixing via hole 14 g, and the fixing via hole 14 h is exposed, By irradiating laser light of a CO ₂ laser having a wavelength of 10.6 μm, the glass epoxy resin of the plate material is removed, a hole having a concave cross section with the external mounting terminal for cathode 7 as a bottom surface is formed, and a conductive via hole 8b The fixing via hole 14f, the fixing via hole 14g, and the fixing via hole 14h are provided, and the inner surface of the hole corresponding to the conductive via hole 8b is plated with copper to provide the conductive via hole 8b, which is used in the second embodiment. A terminal board 13 was prepared.

  Subsequently, the chip-type solid electrolytic capacitor of Example 2 was produced through the same manufacturing process as that of the production of the chip-type solid electrolytic capacitor of Example 1 using the produced terminal substrate.

(Comparative example)
Next, in this comparative example, in the chip-type solid electrolytic capacitor of Example 1, the terminal substrate constituting the chip-type solid electrolytic capacitor is a cross-sectional shape with the resin plate material of the insulating member described in FIG. This is an example of a terminal board having a fixing via hole made of a hole having a concave shape, and the configuration other than the terminal board is the same as that of the first embodiment, and the manufacturing method for the chip-type solid electrolytic capacitor is also the same. . Therefore, only the terminal board used in this comparative example will be described below.

  The terminal substrate 513 is an insulating plate 512 made of a glass epoxy resin plate having a thickness of 0.06 mm, a length of 2.5 mm, and a width of 1.5 mm. After pasting a 0.02 mm thick copper foil on one side of the member 12, the existing printed wiring technology is used to process the copper foil of the insulating member 512, the length dimension is 0.50 mm, the width After providing the anode connection terminal 504 having a dimension of 1.00 mm and the cathode connection terminal 506 having a length dimension of 1.25 mm and a width dimension of 1.00 mm, the anode connection terminal 504 and the cathode are further provided. In the region of the connection terminal 506 for use, a through hole having an elongated hole-shaped opening portion with a radius of the arc portion of 0.1 mm and a length dimension of 0.7 mm was provided by punching.

  Next, using another glass epoxy resin plate having a thickness of 0.06 mm, a length dimension of 2.5 mm, and a width dimension of 1.5 mm, a thickness of 0.02 mm is provided on one side thereof. After attaching the copper foil on one side, using the existing printed wiring technology, the copper foil of the plate material is processed, and the anode connection terminal 504 having a length dimension of 0.50 mm and a width dimension of 1.00 mm, A cathode connection terminal 506 having a length dimension of 1.25 mm and a width dimension of 1.00 mm was produced.

  Next, the plate material provided with the anode connection terminal 504 and the cathode connection terminal 506 and the plate material provided with the anode external mounting terminal 505 and the cathode external mounting terminal 507 are placed at positions facing the anode connection terminal 504. The anode external mounting terminal 505 is disposed, and further, the cathode external mounting terminal 507 is disposed at a position facing the cathode connection terminal 506, the surfaces of the plate members not provided with the terminals are bonded together, and then heated. While pressing and laminating, the insulating member 512 used in this comparative example was created, and a hole having a concave cross-sectional shape was created in the insulating member 512 with a plate material made of glass epoxy resin as the bottom surface.

  Next, a plate having a glass epoxy resin plate provided on the insulating member 512 was used as a bottom surface, and copper plating was applied to a hole having a concave cross-sectional shape to form a fixing via hole 514a and a fixing via hole 514b.

  Next, a hole having a circular opening having a diameter of 0.09 mm that penetrates from the anode connection terminal 504 to the anode external mounting terminal 505 is punched and provided, and then copper plating is performed to provide a through hole for conduction. 508a is provided, and a hole having a circular opening with a diameter of 0.09 mm is formed by penetrating from the cathode connection terminal 506 to the cathode external mounting terminal 507, and then subjected to copper plating to introduce a lead. A common through hole 508b was provided, and a terminal board 513 used in this comparative example was produced.

  Subsequently, a chip-type solid electrolytic capacitor of a comparative example was produced through the same manufacturing process as that of the production of the chip-type solid electrolytic capacitor of Example 1 using the produced terminal substrate.

  The total thickness (thickness from the terminal substrate to the exterior resin part) of the chip-type solid electrolytic capacitors of Examples 1 and 2 could be 1.18 mm. Furthermore, the exterior resin and the terminal substrate could not be easily peeled by hand, and the joint between the exterior resin and the terminal substrate could be strengthened. Furthermore, the exterior resin part did not leak to the surface of the terminal board on which the external mounting terminals were provided. Further, no damage occurred in the glass epoxy resin constituting the terminal substrate near the opening of the fixing via hole.

  The chip type solid electrolytic capacitor of the comparative example has no damage in the insulating member, and the exterior resin and the terminal board cannot be easily peeled by hand, and the joint between the exterior resin and the terminal board is strong. In addition, the exterior resin part did not leak to the surface of the terminal board on which the external mounting terminals were provided, but the total thickness of the chip-type solid electrolytic capacitor (the thickness from the terminal board to the exterior resin part) was 1.23 mm. Thus, it was 0.05 mm thicker than Examples 1 and 2.

  In the chip type solid electrolytic capacitor of the comparative example, the insulating member is not damaged, the terminal substrate and the exterior resin portion are securely joined, and the heat-resistant tape attaching operation and the deburring operation are not required. The total thickness (thickness from the terminal board to the exterior resin part) could not be reduced.

  From the above comparison, in the chip-type solid electrolytic capacitor in which a plurality of plate materials of the prior art are laminated and provided with a fixed via hole, and the manufacturing method thereof, the total thickness of the chip-type solid electrolytic capacitor (the thickness from the terminal substrate to the exterior resin part) However, according to the chip-type solid electrolytic capacitor and the method of manufacturing the same of the present invention, the insulating member is not damaged, the terminal substrate and the exterior resin portion are securely bonded, and the heat-resistant tape attaching operation and the deburring operation are performed. Thus, the cost can be reduced, and the thickness of the insulating member can be reduced to reduce the size or increase the capacity.

  As mentioned above, although embodiment and Example of this invention were described using drawing, this invention is not limited to this embodiment and Example, In the range which does not deviate from the meaning of this invention Any change in configuration is also included in the present invention. That is, it goes without saying that the present invention also includes various modifications and corrections that would be obvious to those skilled in the art.

1, 401, 501 Capacitor element 2, 402, 502 Anode lead wire 3, 403, 503 Support member 4, 404, 504 Anode connection terminal 5, 405, 505 Anode external mounting terminal 6, 406, 506 Cathode connection terminal 7, 407, 507 Cathode external mounting terminals 8a, 8b Conductive via hole 9, 409, 509 Exterior resin part 10 High temperature solder 11, 411, 511 Conductive adhesive 12, 412, 512 Insulating member 13, 413, 513 Terminal board 14a, 14b, 14c, 14d, 14e, 14f, 14g, 14h, 514a, 514b Fixing via holes 17, 417, 517 Chip-type solid electrolytic capacitors 408a, 408b, 508a, 508b Conducting through holes 415a, 415b Fixing through holes

Claims (4)

  A capacitor element having an anode body made of a valve action metal from which an anode lead wire is led out on one side, a support member made of metal and electrically connected to the anode lead wire, and a plate-like insulating member having insulation properties An anode connection terminal electrically connected to the support member, and a cathode connection terminal electrically connected to the cathode portion provided on the bottom surface of the capacitor element on one surface of the insulating member. An anode external mounting terminal electrically connected to the anode connection terminal, and a terminal substrate provided with a cathode external mounting terminal electrically connected to the cathode connection terminal on the other surface, The capacitor element, the anode lead wire, the support member, the anode connection terminal, and the cathode connection terminal are embedded in the surface of the terminal substrate on the side where the anode connection terminal and the cathode connection terminal are provided. Exterior A chip-type solid electrolytic capacitor provided with a fat portion, wherein one of the terminal substrates on which the capacitor element is arranged is formed on the bottom surface of the external mounting terminal for anode and the external mounting terminal for cathode, and the cross-sectional shape is A chip-type solid electrolytic capacitor, characterized in that a fixing via hole including a concave hole is provided.   The chip-type solid electrolytic capacitor according to claim 1, wherein the fixing via hole has an opening provided on a terminal surface of the anode connection terminal and the cathode connection terminal.   3. The chip-type solid electrolytic capacitor according to claim 1, wherein the fixing via hole has a circular opening or an elongated opening. 4.   Electrically connecting the anode lead wire and the support member; forming the anode connection terminal and the cathode connection terminal on a terminal substrate, each having a region where a part of the insulating member is exposed; A step of irradiating laser light to a region where a part of the insulating member is exposed, removing a part of the exposed insulating member, and creating a hole having a concave cross-sectional shape, and copper plating on the inner surface of the hole A step of processing, a step of electrically connecting the support member to the anode connection terminal via high-temperature solder, and an electrical connection of the cathode portion to the cathode connection terminal via a conductive adhesive A step of forming the exterior resin portion on a surface of the terminal substrate on which the capacitor element is disposed, and a step of cutting the terminal substrate into a predetermined dimension together with the formed exterior resin portion. And claim Method for manufacturing a chip type solid electrolytic capacitor according to any one 1 to 3.

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