JPS58145101A - Electronic part - Google Patents

Electronic part

Info

Publication number
JPS58145101A
JPS58145101A JP2729382A JP2729382A JPS58145101A JP S58145101 A JPS58145101 A JP S58145101A JP 2729382 A JP2729382 A JP 2729382A JP 2729382 A JP2729382 A JP 2729382A JP S58145101 A JPS58145101 A JP S58145101A
Authority
JP
Japan
Prior art keywords
electronic
external connection
insulating coating
electronic element
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2729382A
Other languages
Japanese (ja)
Inventor
眞之 大槻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2729382A priority Critical patent/JPS58145101A/en
Publication of JPS58145101A publication Critical patent/JPS58145101A/en
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は、電子部品に関し、特に多様な形状及び機能を
有する電子素子の外部接続部材を基板上にスポット溶接
して接続することができるようにした技術を開示する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to electronic components, and particularly discloses a technique that enables external connection members of electronic elements having various shapes and functions to be connected to a substrate by spot welding.

通常の抵抗素子等の電子部品は、その両端に長いリード
を有しており、このリードを基板のプリント配線にハン
ダ付けして接続しているが、このようなリードは、接続
作業を自動化、機械化する上で好ましくないため、近時
リードを不要にするり=ドレス技術が種々提案されてい
る。
Electronic components such as ordinary resistive elements have long leads at both ends, and these leads are connected to the printed wiring on the board by soldering, but such leads can be used to automate the connection work. Since this is not desirable for mechanization, various dressing techniques have recently been proposed that eliminate the need for leads.

その−例として、第1図AからDiでに示すように、柱
状をした抵抗素子1の中心部分に絶縁塗装2を施こし、
また残余の両端部分にメッキ3を施こした後キャップ4
を被せて電子部品としたものがある。
As an example, as shown in FIG. 1A to Di, an insulating coating 2 is applied to the center part of a columnar resistance element 1,
In addition, after plating 3 on the remaining end portions, the cap 4
There are some that are used as electronic parts by covering them.

そしてこの電子部品は、第2図に示すように、絶縁塗装
2を施こした中心部分を接着剤5によって基板6に接着
、固定され、この後両端部分のギャップ4を所定のプリ
ント配線7にハンダ伺けして、電気的接続作業が行なわ
れる。
As shown in FIG. 2, the central part of this electronic component coated with insulating coating 2 is adhered and fixed to a board 6 with adhesive 5, and then gaps 4 at both ends are connected to predetermined printed wiring 7. After soldering, electrical connections are made.

しかしながら上記した従来技術にあっては、電子素子を
基板に固定するために接着剤を使用しておシ、このため
配線時の作業が面倒で、自動化に不便である。また、電
子部品として完成した形姿においてその全体に外面塗装
かできないため、キャップの外れや変形等の事故か生じ
、性能が不安定で接続信頼性に劣る。
However, in the above-mentioned conventional technology, an adhesive is used to fix the electronic element to the substrate, which makes wiring work cumbersome and inconvenient for automation. Furthermore, since it is not possible to paint the entire external surface of the completed electronic component, accidents such as caps coming off or deformation occur, resulting in unstable performance and poor connection reliability.

史に製造工程が複雑で、しかも基板のプリント配線間を
ジャンプすることができない。
Historically, the manufacturing process has been complicated, and it is not possible to jump between the printed wiring on the board.

本発明は、上記した問題を解決し、リードレス化に最適
な電子部品を提供するもので、接着剤を使用せずスポッ
ト溶接によってプリント基板への固定、接続を一時に行
なって接続作業の能率を飛躍的に高め、また製品として
完成した形姿においてその全外面に絶縁塗装を有して外
れや変形等を防止し品質の安定化及び信頼性の向上を実
現し、更に多種多様な形状及び機能の部品に適用可能で
、しかも製作及び接続作業の自動化に適した電子部品を
得ることを目的とする。
The present invention solves the above-mentioned problems and provides an electronic component that is most suitable for leadless design.It is possible to fix and connect to a printed circuit board at the same time by spot welding without using adhesives, thereby increasing the efficiency of connection work. In addition, in the completed product form, the entire outer surface is coated with an insulating coating to prevent peeling and deformation, resulting in stable quality and improved reliability. The purpose of the present invention is to obtain an electronic component that can be applied to functional components and is suitable for automation of manufacturing and connection work.

そして、これらの目的を達成するため、本発明は、配線
時にスポット溶接される固定部を有する一組の外部接続
部材を電子素子の両端にかしめ伺け、この後前記脚部を
除く全外面を絶縁塗装したものである。
In order to achieve these objects, the present invention provides a set of external connection members having fixing parts that are spot welded during wiring, which are caulked to both ends of the electronic element, and then the entire outer surface except the legs is crimped. It is coated with insulation.

以下、図面を参照して本発明の実施例を飲明する。Embodiments of the present invention will be explained below with reference to the drawings.

(3) 第3図AからC′!では、本発明に係る電子部品の製造
過程を示す側面図、第4図は、完成した電子部品をプリ
ント基板に接続した状態の側面図であシ、8は電子素子
を示し、この電子素子8としては、抵抗、コンデンサ、
ダイオード等が使用され、またその形状も、円柱状、角
柱状、直方体状等多種多様である。
(3) Figure 3 A to C'! Now, FIG. 4 is a side view showing the manufacturing process of the electronic component according to the present invention, and FIG. 4 is a side view of the completed electronic component connected to a printed circuit board. Examples include resistors, capacitors,
Diodes and the like are used, and their shapes are diverse, such as cylindrical, prismatic, rectangular, etc.

9は一対の外部接続部材を示し、この外部接続部材9は
、導電性の金属板をプレス打抜した稜、成形される。こ
の外部接続部材9の形状は、第5図の平面図及びこの第
5図の矢印10方向の矢視図である。第6図に示したよ
うに、一端に前記電子素子8の端部にかしめ付けられる
取付部11を有する。
Reference numeral 9 denotes a pair of external connection members, and the external connection members 9 are formed by press punching a conductive metal plate. The shape of this external connection member 9 is shown in a plan view in FIG. 5 and a view taken in the direction of arrow 10 in FIG. As shown in FIG. 6, it has a mounting part 11 at one end which is caulked to the end of the electronic element 8.

このように取付部11を電子素子8にかしめイτ」ける
こととしたのは、多種多様な形状の電子素子8に適合可
能であることと、キャップを使用する従来技術に比して
電気的接続が確夾であるからである。
The reason why we decided to caulk the mounting part 11 to the electronic element 8 in this way is that it can be adapted to electronic elements 8 of a wide variety of shapes, and that it is more electrically efficient than the conventional technology that uses a cap. This is because the connection is certain.

この取付部11の下面は折)下けられて連結部(4) 12となっており、この連結部12は平面状の固定部1
3に続いている。この固定部13は、第5図に最も良く
示されているように幅広となっておシ、基板14のプリ
ント配線15にスポット溶接されるようになっている。
The lower surface of this mounting portion 11 is folded down to form a connecting portion (4) 12, and this connecting portion 12 is connected to a flat fixed portion 1.
It follows 3. As best shown in FIG. 5, the fixing portion 13 is wide and is spot-welded to the printed wiring 15 of the board 14.

このスポット溶接は、一点に限らず多数の点に行なって
も勿論良い。
Of course, this spot welding may be performed not only at one point but also at many points.

16は、位(脂等による絶縁塗装を示し、この絶縁塗装
置6は、電子素子8及びこの電子素子8の両端にかしめ
付けられた外部接続部材9の少なくとも取付部11を完
全に被膜している。この絶縁塗装置6により、電子素子
8及びこの電子素子8と外部接続部材9とのかしめ部分
が保賎、固定されている。
Reference numeral 16 indicates an insulating coating using oil or the like, and this insulating coating device 6 completely coats at least the mounting portion 11 of the electronic element 8 and the external connection member 9 caulked to both ends of the electronic element 8. The insulating coating device 6 protects and fixes the electronic element 8 and the caulked portion between the electronic element 8 and the external connection member 9.

ここで注意すべきことは、第4図に示すように外部接続
部材9の固定部13の下面が絶縁塗装置6の下面よシも
低く形成され、両者の間に段差が存在することであり、
これによシ基板14のプリント配線15を適宜数ジャン
プして接続することが1」能になる。
What should be noted here is that, as shown in FIG. 4, the lower surface of the fixing part 13 of the external connection member 9 is formed lower than the lower surface of the insulating coating 6, and there is a step between the two. ,
This makes it possible to connect the printed wiring 15 on the board 14 by jumping an appropriate number of times.

以上述べたように、本発明に係る電子部品は、基本的に
は電子素子と、この電子素子にかしめ付けられる取付部
を一端に、また他端に幅広でスポット溶接を行なう固定
部を有する外部接続部材と、前記電子素子及び少々くと
も前記外部接続部材の取付部を被覆する絶縁塗装とを有
するものであム捷た外部接続部材の固定部の下面と絶縁
塗装の下面との間に段差を設けたものである。
As described above, the electronic component according to the present invention basically includes an electronic element and an external part having a mounting part caulked to the electronic element at one end and a wide fixing part to be spot welded at the other end. A connecting member, and an insulating coating that covers the electronic element and at least the mounting portion of the external connecting member, and there is a step between the lower surface of the fixing portion of the broken external connecting member and the lower surface of the insulating coating. It has been established.

そして、このことによシ配線接続時に接着剤が不要とな
るため、接続作業が簡素化できる。また、外部接続部を
スポット溶接によってプリント基板に一時に固定、接続
することができるため、接続作業の能率を飛躍的に高め
ることができる。
This eliminates the need for adhesive when connecting the wires, thereby simplifying the connection work. Further, since the external connection portion can be fixed and connected to the printed circuit board at once by spot welding, the efficiency of the connection work can be dramatically increased.

更に、製品として完成した形姿においてその全外面に絶
縁塗装を施こすことができるため、製品品質の安定化及
び信頼性の向上が可能である。
Furthermore, since insulation coating can be applied to the entire outer surface of the completed product, product quality can be stabilized and reliability can be improved.

しかも、外部接続部材を電子素子にかしめ付けることと
しているので、電子素子の形状や機能にかかわシなく、
多種多様のものに適用することができる。
Moreover, since the external connection member is caulked to the electronic element, it can be used regardless of the shape or function of the electronic element.
It can be applied to a wide variety of things.

この結果、製作及び接続作業の自動化に適したリードレ
スの電子部品を得ることができるという効果がある。
As a result, a leadless electronic component suitable for automation of manufacturing and connection work can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図AからDまでは、従来のリードレス市、子部品の
製作過程を示す側面図、第2図は、第1図のり一ドレス
電子部品の配#接続時の側面図、第3図AからCまでは
、本発明に係るリードレスの電子部品の製造過程を示す
側面図、第4図は、完成した電子部品をプリント基板に
接続した状態の側面図、第5図は、完成した電子部品の
平面図、第6図は、第5図の矢印10方向の矢視図であ
る。 8  ・・・ 電子素子 9  ・・・ 外部接続部材 11 ・・・ 取付部 13 ・・・ 固定部 16 ・・・ 絶縁塗装 第1図 第2図 ’/    !:)    ’/    b第3図 第4図 第5図 第8図
Figures 1A to D are side views showing the manufacturing process of conventional leadless parts and sub-components; Figure 2 is a side view of the leadless electronic components shown in Figure 1 during wiring and connection; Figure 3 A to C are side views showing the manufacturing process of the leadless electronic component according to the present invention, FIG. 4 is a side view of the completed electronic component connected to a printed circuit board, and FIG. 5 is a side view of the completed electronic component. A plan view of the electronic component, FIG. 6, is a view taken in the direction of arrow 10 in FIG. 5. 8...Electronic element 9...External connection member 11...Mounting part 13...Fixing part 16...Insulating coating Figure 1 Figure 2'/! :) '/bFigure 3Figure 4Figure 5Figure 8

Claims (1)

【特許請求の範囲】 1、電子素子と、この電子素子にかしめ付けられる取付
部を一端に、また他端に幅広でスポット溶接を行なう固
定部を有する外部接続部材と、前記電子素子及び少なく
とも前記外部接続部材の取付部を被覆する絶縁塗装とを
有することを特徴とする電子部品。 2、外部接続部材の固定部の下面と絶縁塗装の下面との
間に段差を設けたことを特徴とする特許請求の範囲第1
項記載の電子部品。
[Scope of Claims] 1. An external connection member having an electronic element, a mounting part caulked to the electronic element at one end, and a wide fixing part to be spot welded at the other end; An electronic component characterized by having an insulating coating that covers a mounting portion of an external connection member. 2. Claim 1, characterized in that a step is provided between the lower surface of the fixed portion of the external connection member and the lower surface of the insulating coating.
Electronic components listed in section.
JP2729382A 1982-02-24 1982-02-24 Electronic part Pending JPS58145101A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2729382A JPS58145101A (en) 1982-02-24 1982-02-24 Electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2729382A JPS58145101A (en) 1982-02-24 1982-02-24 Electronic part

Publications (1)

Publication Number Publication Date
JPS58145101A true JPS58145101A (en) 1983-08-29

Family

ID=12217034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2729382A Pending JPS58145101A (en) 1982-02-24 1982-02-24 Electronic part

Country Status (1)

Country Link
JP (1) JPS58145101A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0295202U (en) * 1989-01-14 1990-07-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0295202U (en) * 1989-01-14 1990-07-30

Similar Documents

Publication Publication Date Title
EP0337400A2 (en) Apparatus for connecting sets of electric wires to lead wires
US4945192A (en) Connector terminal
US6259348B1 (en) Surface mounting type electronic component incorporating safety fuse
US5668702A (en) Combination axial and surface mount cylindrical package containing one or more electronic components
JPS58145101A (en) Electronic part
JP2528326B2 (en) How to attach a capacitor to a circuit board
JPH0312446B2 (en)
JPH0447949Y2 (en)
JPS5910768Y2 (en) Printed board
JPS6314447Y2 (en)
JPH0448124Y2 (en)
JPS6041702Y2 (en) small inductor
JPH0331085Y2 (en)
JPH046212Y2 (en)
JPH0214194Y2 (en)
JPH0134291Y2 (en)
JPH0249701Y2 (en)
JPH0445251Y2 (en)
JPH0632669Y2 (en) Chip type electrolytic capacitor
JPH1064756A (en) Electronic component
JPH0576029U (en) Electronic parts
JPS58158401U (en) Chip parts with lead terminals
JPS6123641B2 (en)
JPS6123391A (en) Device for mounting chip circuit part
JPS62162304A (en) Terminal fixing method of electronic parts