CN213244456U - Circuit board assembly - Google Patents
Circuit board assembly Download PDFInfo
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- CN213244456U CN213244456U CN202022050340.9U CN202022050340U CN213244456U CN 213244456 U CN213244456 U CN 213244456U CN 202022050340 U CN202022050340 U CN 202022050340U CN 213244456 U CN213244456 U CN 213244456U
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- circuit board
- substrate
- board assembly
- plastic part
- assembly according
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Abstract
A circuit board assembly is disclosed. The circuit board assembly comprises a substrate, a circuit board, a plastic part and an adhesion block, wherein the substrate and the circuit board are connected through the plastic part and are separated by a preset distance, and the adhesion block is arranged on one side of the plastic part and is used for adhering and fixing the substrate and the circuit board. The utility model discloses a circuit board subassembly has realized structural support to the circuit board in built on stilts region through setting up the bonding piece for the circuit board can not produce the deformation because one side is built on stilts and the pressurized when welding, has improved the stability of circuit board subassembly structure.
Description
Technical Field
The utility model relates to an electronic components field, concretely relates to circuit board subassembly.
Background
In the assembly of the electronic industry, the circuit board is connected with the substrate through a plastic part. Because the size of the plastic part is smaller than that of the circuit board and the substrate, an overhead area is arranged between the circuit board and the substrate. When the portion of the circuit board located above the overhead portion is soldered, the circuit board cannot withstand pressure without being supported, and is likely to be deformed (for example, the circuit board is bent toward the overhead portion side), which causes a failure. And because the overhead area between the circuit board and the substrate is small (typically on the order of 1 mm), it is difficult to achieve support by adding mechanical structure to the overhead area.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a circuit board assembly, which has a simple structure, and when the circuit board is welded, the circuit board is not deformed due to pressure, so as to improve the stability of the structure of the circuit board assembly.
An embodiment of the utility model provides a circuit board assembly, include:
a substrate;
the circuit board is separated from the base material by a preset distance;
the plastic part is connected with the circuit board and the substrate; and
and the bonding block is arranged on one side of the plastic part and is used for bonding and fixing the substrate and the circuit board.
Furthermore, the base material is provided with a through slot hole, and the plastic part partially extends into the slot hole and is in interference fit with the base material.
Further, the plastic part includes:
the connecting part is fixedly connected with the circuit board; and
and the buckling part is buckled in the slotted hole and is in interference fit with the slotted hole.
Further, the substrate is a straight plate.
Further, the substrate is a curved plate.
Further, the slot is formed in the middle of the substrate.
Further, the bonding block is an ultraviolet curing glue block.
Further, the bonding block is a hot melt adhesive block or an epoxy adhesive block.
Further, the bonding block is provided in plurality.
Further, the distance between the base material and the circuit board is 1 mm.
The utility model discloses circuit board subassembly sets up the bonding piece between circuit board and substrate, and the bonding piece not only is used for being connected of circuit board and substrate with the plastic part together to the circuit board has realized the structural support at built on stilts region, makes the circuit board can not produce the deformation because one side is built on stilts and the pressurized when welding, has improved the stability of circuit board subassembly structure.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
fig. 1 is a perspective view of a circuit board assembly according to an embodiment of the present invention;
fig. 2 is an exploded view of a circuit board assembly according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a plastic part according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a deformed conventional circuit board assembly.
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in detail. It will be apparent to those skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Meanwhile, it should be understood that, in the following description, a "circuit" refers to a conductive loop constituted by at least one element or sub-circuit through electrical or electromagnetic connection. When an element or circuit is referred to as being "connected to" another element or element/circuit is referred to as being "connected between" two nodes, it may be directly coupled or connected to the other element or intervening elements may be present, and the connection between the elements may be physical, logical, or a combination thereof. In contrast, when an element is referred to as being "directly coupled" or "directly connected" to another element, it is intended that there are no intervening elements present.
Unless the context clearly requires otherwise, throughout the description, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the assembly of the electronic industry, the circuit board is connected with the substrate through a plastic part. When the substrate is made of conductive material, such as nano-crystal, the plastic piece is arranged to insulate the circuit board and the substrate from each other, so as to avoid the influence on the circuit function or the damage to the circuit structure caused by electric conduction. After the circuit board and the substrate are connected by the plastic member, the circuit board needs to be soldered to other devices (such as other circuit boards or electrical devices) to further form an electrical structure. In order to facilitate processing and assembly, the size of the plastic part is usually small, and after the circuit board and the substrate are connected through the plastic part, the plastic part is arranged between the circuit board and the substrate, and an overhead area L is formed. If the circuit board is soldered, the circuit board may be pressed to the overhead region L to be bent or deformed, which may damage the circuit board structure and further cause a failure of the circuit board assembly. Because the overall size of the circuit board assembly is small, the distance between the circuit board and the substrate is usually about 1mm, and it is difficult to add a mechanical structure to support the circuit board in such a narrow space. Therefore, the embodiment of the utility model provides an utilize bonding block to realize circuit board assembly of support, concrete scheme is as follows.
Fig. 1-4 are schematic diagrams of a circuit board assembly according to an embodiment of the present invention. As shown in fig. 1-2, the circuit board assembly includes a substrate 1, a circuit board 2, a plastic part 21, and an adhesive block 3. The substrate 1 and the circuit board 2 are separated by a predetermined distance and fixedly connected through a plastic part 21, the size of the plastic part 21 is smaller than that of the substrate 1 and the circuit board 2, and the bonding block 3 is arranged on one side of the plastic part 21. As shown in fig. 4, fig. 4 shows the relative positions and size relationships of the substrate 1, the circuit board 2, the plastic part 21 and the adhesive block 3 by simple lines, and since the size of the plastic part 21 is smaller than that of the substrate 1 and the circuit board 2, an overhead area L is provided between the substrate 1 and the circuit board 2. The adhesive block 3 is disposed in the overhead region L and fills at least a part of the overhead region L to form a support while adhesively fixing the substrate 1 and the wiring board 2. When the soldering operation is performed on the a position on the wiring board 2, if the adhesive block 3 is not provided in the overhead area L as shown in fig. 5, the wiring board 2 is easily pressed to be deformed by being overhead, resulting in a failure. The provision of the adhesive block 3 allows the wiring board 2 to have a support during soldering so that it is not easily deformed by pressure.
In the present embodiment, the position a is a portion of the circuit board 2 that is not directly connected to the plastic part 21, or a portion that may be bent into the overhead area L when subjected to a force.
In various embodiments, the number of the adhesive blocks 3 may be one or more. For example, the number of the adhesive blocks 3 may be plural, so that the plural adhesive blocks 3 substantially fill the overhead area L between the substrate 1 and the circuit board 2, and further almost cover the surface of the circuit board 2 on the side facing the overhead area L to achieve overall support for the circuit board 2. For another example, the number of the adhesive blocks 3 may be one, and the dosage and the forming manner of the adhesive blocks 3 are controlled so that the single adhesive block 3 substantially fills the overhead area L between the substrate 1 and the circuit board 2, and further almost covers the surface of the circuit board 2 on the side facing the overhead area L. Therefore, the surface of the circuit board 2 facing the side of the overhead area L is almost supported by the bonding block 3 or the plastic part 21, so that the circuit board 2 cannot be easily deformed when different positions on the circuit board 2 are welded, and the structure is more stable.
The adhesive block 3 is preferably an ultraviolet curing glue block, i.e., UV glue (UV glue), which is an adhesive that is fluid in a conventional state and is cured and formed into an adhesive block after being irradiated with Ultraviolet (UV) rays. In addition, the ultraviolet curing glue also has certain viscosity, and can play a role in fixed connection after being cured and molded. In this embodiment, before the substrate 1 and the circuit board 2 are assembled, the ultraviolet curing glue may be dispensed on the surface of the circuit board 2, then the substrate 1 is assembled, and then the ultraviolet curing glue is subjected to ultraviolet irradiation treatment, so that the substrate 1 and the circuit board 2 are fixedly connected after the ultraviolet curing glue is cured. The ultraviolet irradiation operation is simple, efficient and convenient, and no influence is caused on other structures of the circuit board.
In some other alternative implementations, the adhesive block 3 may also be a hot melt adhesive block or an epoxy block, and correspondingly, the adhesive block 3 is formed in the overhead area L between the substrate 1 and the circuit board 2 by a cold-setting or hot-setting adhesive such as a hot melt adhesive or an epoxy adhesive. Thereby, the support and connection of the wiring board 2 and the substrate 1 can be realized as well.
It will be appreciated that when a plurality of adhesive blocks 3 are provided, it may be a combination of a plurality of different types of adhesive blocks.
In the embodiment, the substrate 1 may be a nanocrystal substrate, and the nanocrystal material is a substrate material commonly used in the electronic industry, has excellent comprehensive magnetic properties, and can be applied to a circuit structure of an electronic product as a soft magnet. The Circuit Board 2 may be a Printed Circuit Board Assembly (PCBA), which is a finished Circuit Board obtained by passing an empty PCB (Printed Circuit Board or Printed Circuit Board) through an upper component, and is widely applied to a Circuit structure in the electronic industry. In some other embodiments, the substrate 1 may also be a PCBA, a ground plate, or the like. For example, for two boards that need to be connected, both substrate 1 and board 2 can be PCBA.
In the present embodiment, as shown in fig. 3, the plastic part 21 includes a connecting portion 211 and a fastening portion 212. The connecting portion 211 is fixedly connected to the circuit board 2, and the fastening portion 212 is fixedly connected to the substrate 1. As shown in fig. 2, the base material 1 has a through slot 11, and the fastening portion 212 extends into the slot 11 and is in interference fit with the base material 1 to be fixedly connected with the base material 1. It will be understood that the size of the snap-fit portion 212 is larger than the size of the slot 11. Because the plastic has a certain elasticity and plasticity, the buckling part 212 can deform and extend into the slot 11 with a size smaller than that of the slot 11, and then the external force is removed to restore the deformation of the buckling part 212, and the buckling part 212 is fixed in the slot 11 because the size is larger than that of the slot 11. The connection portion 211 may be attached to the bottom surface of the circuit board 2 by means of gluing.
As shown in fig. 3, the size of the connecting portion 211 is larger than that of the fastening portion 212, so that when the fastening portion 212 is fastened in the slot 11, the plastic part 21 does not move in the longitudinal direction and the connecting portion 211 also enters the slot 11. When the connecting portion 211 is completely inserted into the slot 11, the substrate 1 and the circuit board 2 may be brought into contact with each other, and electrical conduction may be formed therebetween or thermal conduction may affect the function of the circuit board assembly.
The distance between the wiring board 2 and the base material 1 is usually about 1mm, that is, the height of the connecting portion 211 is also about 1 mm.
As shown in fig. 2, in the present embodiment, the slot 11 is formed in the middle of the substrate 1. Therefore, the circuit board 2 is connected to the middle part of the substrate 1 through the plastic part 21, the circuit board 2 cannot exceed the edge of the substrate 1, and the circuit board assembly saves more space. In some other alternative implementations, the slot 11 can be formed at any position of the substrate 1. In addition, the substrate 1 can be a straight plate or a curved plate, and the substrate 1 with a plate-shaped structure also makes the circuit board assembly more space-saving.
The utility model discloses circuit board subassembly sets up the bonding piece between circuit board and substrate, and the bonding piece not only is used for being connected of circuit board and substrate with the plastic part together to the circuit board has realized structural support at built on stilts regional L, makes the circuit board can not produce the deformation because one side is built on stilts and the pressurized when welding, has improved the stability of circuit board subassembly structure.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A circuit board assembly, comprising:
a substrate (1);
a circuit board (2) spaced from the base material (1) by a predetermined distance;
a plastic part (21) connecting the circuit board (2) and the substrate (1); and
and the bonding block (3) is arranged on one side of the plastic part (21) and is used for bonding and fixing the substrate (1) and the circuit board (2).
2. A wiring board assembly according to claim 1, wherein the substrate (1) has a through slot (11), and the plastic part (21) partially extends into the slot (11) and is in interference fit with the substrate (1).
3. A wiring board assembly according to claim 2, wherein the plastic part (21) comprises:
a connecting part (211) fixedly connected with the circuit board (2); and
the buckling part (212) is buckled in the slotted hole (11) and is in interference fit with the slotted hole (11).
4. A circuit board assembly according to claim 2 or 3, characterised in that the base material (1) is a straight plate.
5. A circuit board assembly according to claim 2 or 3, characterised in that the base material (1) is a bent board.
6. A wiring board assembly according to claim 2 or 3, characterized in that the slot (11) is formed in the middle of the base material (1).
7. A wiring board assembly according to claim 1, wherein the adhesive block (3) is an ultraviolet curing glue block.
8. A wiring board assembly according to claim 1, wherein the adhesive block (3) is a hot melt adhesive block or an epoxy block.
9. A circuit board assembly according to claim 7 or 8, characterised in that the adhesive block (3) is provided in plurality.
10. A wiring board assembly according to claim 1, wherein the spacing between the substrate (1) and the wiring board (2) is 1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022050340.9U CN213244456U (en) | 2020-09-17 | 2020-09-17 | Circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022050340.9U CN213244456U (en) | 2020-09-17 | 2020-09-17 | Circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213244456U true CN213244456U (en) | 2021-05-18 |
Family
ID=75876211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022050340.9U Active CN213244456U (en) | 2020-09-17 | 2020-09-17 | Circuit board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213244456U (en) |
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2020
- 2020-09-17 CN CN202022050340.9U patent/CN213244456U/en active Active
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