CN106255017A - Speaker module - Google Patents
Speaker module Download PDFInfo
- Publication number
- CN106255017A CN106255017A CN201610854707.8A CN201610854707A CN106255017A CN 106255017 A CN106255017 A CN 106255017A CN 201610854707 A CN201610854707 A CN 201610854707A CN 106255017 A CN106255017 A CN 106255017A
- Authority
- CN
- China
- Prior art keywords
- electrical connector
- module
- speaker module
- adhesive film
- loudspeaker monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
The invention discloses speaker module, including module casing and the loudspeaker monomer being arranged in described module casing, described loudspeaker monomer is provided with the first electrical connector, described module casing is provided with the second electrical connector, also include the conductive adhesive film of the banding being made up of conducting resinl coating, one end of described conductive adhesive film connects described first electrical connector, and the other end connects described second electrical connector.The speaker module of the present invention utilizes conducting resinl to turn on module internal circuit, it is possible to avoid some harmful effects caused due to welding.
Description
Technical field
The present invention relates to electroacoustic switch technology, more particularly, to a kind of speaker module.
Background technology
In prior art, between speaker module internal, loudspeaker monomer and other soft copy by the way of welding
Connecting conducting, such as, include flexible circuit board and loudspeaker monomer in speaker module, wherein loudspeaker monomer is by welding
Mode and flexible circuit board connect conducting, are drawn by module circuit by flexible circuit board cabling the most again.This it is welded to connect
Conduction mode, except in tin-lead solder, heavy metal flue dust can cause environmental pollution and health hazards, other problems arise: (1)
Welding process can produce high temperature, easily causes the plastic portions deformation of module；Can easily tilt at the pad of flexible circuit board；Weldering
There is risk of stress concentrations around dish, circuit is easily broken off.(2) in order to reduce the distance between flexible circuit board and soft copy,
Flexible circuit board circuit can be the longest, and circuit has bending overlap more, and the reliability of flexible circuit board is produced certain impact,
Also increase product manufacturing difficulty simultaneously.(3) welding needs to be accurately positioned flexible circuit board, but due to module space relatively
Narrow, flexible circuit board mounts into can be more difficult during module.Therefore, it is necessary to propose one for speaker module internal circuit
New conduction mode.
Summary of the invention
It is an object of the present invention to provide a kind of speaker module, the conducting structure of its internal circuit at least can be kept away
Exempt from one of above-mentioned technical problem.
According to the first aspect of the invention, it is provided that a kind of speaker module, including module casing be arranged on described mould
Loudspeaker monomer in group housing, described loudspeaker monomer is provided with the first electrical connector, and described module casing is provided with second
Electrical connector, also includes the conductive adhesive film of banding being made up of conducting resinl coating, and one end of described conductive adhesive film connects described the
One electrical connector, the other end connects described second electrical connector.
Optionally, described first electrical connector is conductive metal sheet, and described second electrical connector is conductive metal sheet or PCB
Plate.
Alternatively, the routing region described module casing being used for applying conductive glued membrane includes and described first electrical connector
Or some horizontal planes of the pads parallel of described second electrical connector and for being connected the horizontal plane of adjacent two differing heights
Between inclined plane.
The speaker module of the present invention utilizes conducting resinl to turn on module internal circuit, it is possible to avoid some to cause due to welding
Harmful effect.
By detailed description to the exemplary embodiment of the present invention referring to the drawings, the further feature of the present invention and
Advantage will be made apparent from.
Accompanying drawing explanation
Combined in the description and the accompanying drawing of the part that constitutes description shows embodiments of the invention, and even
With its explanation together for explaining the principle of the present invention.
Fig. 1 is the structural representation of the speaker module that the embodiment of the present invention provides.
Fig. 2 is the structural representation of the speaker module that another embodiment of the present invention provides.
Detailed description of the invention
The various exemplary embodiments of the present invention are described in detail now with reference to accompanying drawing.It should also be noted that unless additionally have
Body illustrates, the parts illustrated the most in these embodiments and positioned opposite, the numerical expression of step and numerical value are not intended to this
The scope of invention.
Description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And any restriction applied or use.
May be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of when, described technology, method and apparatus should be considered a part for description.
It is shown here that any occurrence should be construed as merely exemplary with in all examples discussed, and not
It is as restriction.Therefore, other example of exemplary embodiment can have different values.
It should also be noted that similar label and letter represent similar terms, therefore, the most a certain Xiang Yi in following accompanying drawing
Individual accompanying drawing is defined, then need not it is further discussed in accompanying drawing subsequently.
The core scheme of the present invention is the internal circuit utilizing conducting resinl to connect conducting speaker module, owing to eliminating height
Temperature welding link, it is possible to avoid some welding harmful effects to module, additionally it is possible to avoid heavy metal in tin-lead solder to cause
Environmental pollution.
<embodiment one>
The embodiment of speaker module that the present invention provides is described with reference to Fig. 1:
Speaker module includes loudspeaker monomer 1, flexible circuit board 2 and houses loudspeaker monomer 1 and flexible circuit board
The housing 3 of 2.
Wherein, loudspeaker monomer 1 is provided with the first electrical connector 11, and housing 3 is provided with the second electrical connector 4, flexible wires
The electrical connection section 21 of the first end of road plate 2 is turned on by conductive adhesive with the first electrical connector 11 on loudspeaker monomer 1, soft
The electrical connection section of the second end of property wiring board 2 electrically connects with the second electrical connector 4 on housing 3.
Wherein, the electrical connection section 21 for example, foil of the first end of flexible circuit board 2；Electrical connection section 21 and the first electricity
Connector 11 can partly overlap, and electrical connection section 21 is arranged at the top of the first electrical connection section 11.
Wherein, the first electrical connector 11 for example, conductive metal sheet.Second electrical connector 4 for example, conductive metal sheet, its
It is provided with pad 41；Second electrical connector 4 can also be pcb board.
<embodiment two>
Another embodiment of speaker module that the present invention provides is described with reference to Fig. 2:
Speaker module includes loudspeaker monomer 1 and houses the housing 3 of loudspeaker monomer 1.
Wherein, loudspeaker monomer 1 is provided with the first electrical connector 11, and housing 3 is provided with the second electrical connector 4, conducting resinl
Coating constitutes the conductive adhesive film 200 of banding, and one end of conductive adhesive film 200 connects the first electrical connector 11 of loudspeaker monomer 1, separately
One end connects the second electrical connector 4 on housing 3.
Wherein, the first electrical connector 11 for example, conductive metal sheet.Second electrical connector 4 for example, conductive metal sheet, its
It is provided with pad 41；Second electrical connector 4 can also be pcb board.
Wherein, routing region housing 3 being used for applying conductive glued membrane 200 includes and the first electrical connector 11 or the second electricity
Some horizontal planes of the pads parallel of connector 4 and the inclination between the horizontal plane being connected adjacent two differing heights
Face, carries out transition by inclined plane between adjacent level face so that conductive adhesive film 200 is not easy fracture occur.
Conducting resinl is a kind of adhesive solidifying or having after drying electric conductivity, generally with matrix resin and conductive filler
I.e. conductive ion is for mainly comprising composition.The speaker module of the present invention utilizes conducting resinl to turn on module internal circuit, owing to leading
It is bonding that electricity glue can select suitable solidification temperature to carry out, as epoxy resin adhesive can solidify in room temperature to 150 DEG C, the lowest
In the welding temperature of more than 200 DEG C of tin-lead welding, avoiding problems module deformation, flexible circuitry that welding high temperature may cause
Plate tilts, the problem of pad ambient stress centralized risk, can also reduce plating Ni/Au layer usage amount simultaneously, save cost of manufacture.
Meanwhile, use conducting resinl connects conducting speaker module internal circuit, the simplest in technique, it is easy to operation, it is simple to realize certainly
Dynamic metaplasia is produced, and improves production efficiency.
Although by example, some specific embodiments of the present invention have been described in detail, but the skill of this area
Art personnel are it should be understood that example above is merely to illustrate rather than in order to limit the scope of the present invention.The skill of this area
Art personnel are it should be understood that can modify to above example without departing from the scope of the invention.The model of the present invention
Enclose and be defined by the following claims.
Claims (3)
1. a speaker module, including module casing and the loudspeaker monomer that is arranged in described module casing, described in raise one's voice
Device monomer is provided with the first electrical connector, and described module casing is provided with the second electrical connector, it is characterised in that
Also including the conductive adhesive film of the banding being made up of conducting resinl coating, one end of described conductive adhesive film connects described first and is electrically connected
Fitting, the other end connects described second electrical connector.
Speaker module the most according to claim 1, it is characterised in that described first electrical connector is conductive metal sheet,
Described second electrical connector is conductive metal sheet or pcb board.
Speaker module the most according to claim 1, it is characterised in that for applying conductive glued membrane on described module casing
Routing region include with described first electrical connector or some horizontal planes of the pads parallel of described second electrical connector and
Inclined plane between the horizontal plane being connected adjacent two differing heights.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610854707.8A CN106255017B (en) | 2016-09-27 | 2016-09-27 | Loudspeaker module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610854707.8A CN106255017B (en) | 2016-09-27 | 2016-09-27 | Loudspeaker module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106255017A true CN106255017A (en) | 2016-12-21 |
| CN106255017B CN106255017B (en) | 2022-07-19 |
Family
ID=57611159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610854707.8A Active CN106255017B (en) | 2016-09-27 | 2016-09-27 | Loudspeaker module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106255017B (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5970158A (en) * | 1997-07-30 | 1999-10-19 | Federal Signal Corporation | Compact horn speaker |
| US20030007653A1 (en) * | 1996-09-03 | 2003-01-09 | Farad Azima | Active acoustic devices |
| US20030202672A1 (en) * | 2002-04-26 | 2003-10-30 | Murata Manufacturing Co., Ltd. | Piezoelectric electro-acoustic transducer |
| US20090046884A1 (en) * | 2007-08-15 | 2009-02-19 | Schapiro Eduardo | Headset made from recyclable isolating materials |
| CN101668240A (en) * | 2008-09-05 | 2010-03-10 | 财团法人工业技术研究院 | Electrode connecting structure of loudspeaker monomer |
| KR101185780B1 (en) * | 2011-07-12 | 2012-10-02 | 아이모스시스템 주식회사 | Speaker |
| CN202907167U (en) * | 2012-09-28 | 2013-04-24 | 歌尔声学股份有限公司 | Loudspeaker device |
| US20130134833A1 (en) * | 2011-11-24 | 2013-05-30 | Samsung Electro-Mechanics Co., Ltd. | Ultrasonic sensor and method for manufacturing the same |
| CN203840538U (en) * | 2014-05-22 | 2014-09-17 | 歌尔声学股份有限公司 | Loudspeaker module group |
| CN105407438A (en) * | 2015-12-31 | 2016-03-16 | 歌尔声学股份有限公司 | Loudspeaker module set |
| CN105959887A (en) * | 2016-06-29 | 2016-09-21 | 歌尔股份有限公司 | Loud speaker and loud speaker module |
| CN206164830U (en) * | 2016-09-27 | 2017-05-10 | 歌尔股份有限公司 | Loudspeaker module group |
-
2016
- 2016-09-27 CN CN201610854707.8A patent/CN106255017B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030007653A1 (en) * | 1996-09-03 | 2003-01-09 | Farad Azima | Active acoustic devices |
| US5970158A (en) * | 1997-07-30 | 1999-10-19 | Federal Signal Corporation | Compact horn speaker |
| US20030202672A1 (en) * | 2002-04-26 | 2003-10-30 | Murata Manufacturing Co., Ltd. | Piezoelectric electro-acoustic transducer |
| US20090046884A1 (en) * | 2007-08-15 | 2009-02-19 | Schapiro Eduardo | Headset made from recyclable isolating materials |
| CN101668240A (en) * | 2008-09-05 | 2010-03-10 | 财团法人工业技术研究院 | Electrode connecting structure of loudspeaker monomer |
| KR101185780B1 (en) * | 2011-07-12 | 2012-10-02 | 아이모스시스템 주식회사 | Speaker |
| US20130134833A1 (en) * | 2011-11-24 | 2013-05-30 | Samsung Electro-Mechanics Co., Ltd. | Ultrasonic sensor and method for manufacturing the same |
| CN202907167U (en) * | 2012-09-28 | 2013-04-24 | 歌尔声学股份有限公司 | Loudspeaker device |
| CN203840538U (en) * | 2014-05-22 | 2014-09-17 | 歌尔声学股份有限公司 | Loudspeaker module group |
| CN105407438A (en) * | 2015-12-31 | 2016-03-16 | 歌尔声学股份有限公司 | Loudspeaker module set |
| CN105959887A (en) * | 2016-06-29 | 2016-09-21 | 歌尔股份有限公司 | Loud speaker and loud speaker module |
| CN206164830U (en) * | 2016-09-27 | 2017-05-10 | 歌尔股份有限公司 | Loudspeaker module group |
Non-Patent Citations (5)
| Title |
|---|
| WENKAI TAO, SI CHEN, P. BERGGREN AND J. LIU: "Reliability study for high temperature stable conductive adhesives", 《2010 INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: MICROTECH (APM)》 * |
| WENKAI TAO, SI CHEN, P. BERGGREN AND J. LIU: "Reliability study for high temperature stable conductive adhesives", 《2010 INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: MICROTECH (APM)》, 1 April 2010 (2010-04-01), pages 74 - 77 * |
| 于洁等: "连接显示器件与电路的关键材料——各向异性导电胶膜ACF的性能研究", 《2006中国平板显示学术会议论文集》 * |
| 于洁等: "连接显示器件与电路的关键材料——各向异性导电胶膜ACF的性能研究", 《2006中国平板显示学术会议论文集》, 9 April 2007 (2007-04-09), pages 404 - 406 * |
| 郑尧: "新型平板扬声器的设计", 《现代电子技术》, 15 December 2011 (2011-12-15) * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106255017B (en) | 2022-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2009057332A1 (en) | Circuit connecting method | |
| US20150147896A1 (en) | Electrical connector | |
| KR101443968B1 (en) | Power module package and method of manufacturing the same | |
| CN109672948A (en) | Microphone device | |
| CN108966485A (en) | Circuit board assemblies, electronic equipment, display screen device and its assembly method | |
| CN106571354A (en) | Power source converter and manufacture method therefor | |
| CN204031568U (en) | Flexible printed circuit board | |
| CN108462922B (en) | Vibrating diaphragm and sound production device | |
| CN206164830U (en) | Loudspeaker module group | |
| CN202773040U (en) | Loudspeaker module group | |
| CN106255017A (en) | Speaker module | |
| CN208638689U (en) | Loudspeaker mould group | |
| CN207200973U (en) | sound-producing device | |
| CN107509146B (en) | Sounding device and by connection elastic slice be embedded at the method in sounding device | |
| CN108321141B (en) | Binding structure of chip and electronic device | |
| CN201967253U (en) | Filter circuit board for connecting device | |
| CN104752401A (en) | Flexible Microelectronic Assembly And Method | |
| CN206301983U (en) | Multi-pin connector | |
| US20140131083A1 (en) | Printed circuit board and method for manufacturing the same | |
| CN204859557U (en) | Mems microphone | |
| CN202818766U (en) | PCB board with components mounted on surface thereof | |
| CN203674205U (en) | Wafer packaging structure of high-end camera module group | |
| CN202856978U (en) | Integrated structure of digital sound transmission plate and shielding cavity | |
| CN207475860U (en) | Speaker membrane structure | |
| CN221487959U (en) | Screen module for improving IC position strong hardness of flexible circuit board based on metal sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |