CN106255017B

CN106255017B - Loudspeaker module

Info

Publication number: CN106255017B
Application number: CN201610854707.8A
Authority: CN
Inventors: 王景伟; 贾芸芸
Original assignee: Goertek Inc
Current assignee: Goertek Inc
Priority date: 2016-09-27
Filing date: 2016-09-27
Publication date: 2022-07-19
Anticipated expiration: 2036-09-27
Also published as: CN106255017A

Abstract

The invention discloses a loudspeaker module, which comprises a module shell and a loudspeaker single body arranged in the module shell, wherein a first electric connecting piece is arranged on the loudspeaker single body, a second electric connecting piece is arranged on the module shell, the loudspeaker module further comprises a strip-shaped conductive adhesive film formed by coating conductive adhesive, one end of the conductive adhesive film is connected with the first electric connecting piece, and the other end of the conductive adhesive film is connected with the second electric connecting piece. The loudspeaker module of the invention utilizes the conductive adhesive to conduct the internal circuit of the module, and can avoid some adverse effects caused by welding.

Description

Loudspeaker module

Technical Field

The present invention relates to an electroacoustic conversion technology, and more particularly, to a speaker module.

Background

In the prior art, inside the speaker module, the speaker monomer and other electronic parts are connected and conducted in a welding manner, for example, the speaker module comprises a flexible circuit board and a speaker monomer, wherein the speaker monomer is connected and conducted with the flexible circuit board in a welding manner, and then the module circuit is led out through the flexible circuit board wiring. Besides the heavy metal smoke dust in the tin-lead solder can cause environmental pollution and health damage, the welding connection conduction mode also has other problems: (1) high temperature is generated in the welding process, and the plastic part of the module is easy to deform; the bonding pad of the flexible circuit board is easy to tilt; there is a risk of stress concentration around the pad and the line is easily broken. (2) In order to reduce the distance between the flexible circuit board and the electronic part, the flexible circuit board circuit is relatively long, the circuits are bent and overlapped, certain influence is generated on the reliability of the flexible circuit board, and meanwhile, the manufacturing difficulty of products is increased. (3) The soldering needs to be done to the accurate positioning of the flexible circuit board, but because the module space is relatively narrow, it is more difficult to mount the flexible circuit board in the module. Therefore, it is necessary to provide a new conduction method for the internal circuit of the speaker module.

Disclosure of Invention

It is an object of the present invention to provide a speaker module, which has a conductive structure of its internal circuit to avoid at least one of the above-mentioned problems.

According to a first aspect of the invention, a speaker module is provided, which comprises a module housing and a speaker unit installed in the module housing, wherein a first electrical connector is arranged on the speaker unit, a second electrical connector is arranged on the module housing, and the speaker module further comprises a strip-shaped conductive adhesive film formed by coating conductive adhesive, one end of the conductive adhesive film is connected with the first electrical connector, and the other end of the conductive adhesive film is connected with the second electrical connector.

Optionally, the first electrical connector is a conductive metal sheet, and the second electrical connector is a conductive metal sheet or a PCB.

Optionally, the routing area for coating the conductive adhesive film on the module housing includes a plurality of horizontal planes parallel to the pads of the first electrical connector or the second electrical connector and an inclined plane for connecting between two adjacent horizontal planes with different heights.

The loudspeaker module of the invention utilizes the conductive adhesive to conduct the internal circuit of the module, and can avoid some adverse effects caused by welding.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic structural diagram of a speaker module according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a speaker module according to another embodiment of the present invention.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as exemplary only and not as limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

The core scheme of the invention is to connect and conduct the internal circuit of the loudspeaker module by using the conductive adhesive, and the high-temperature welding link is saved, so that the adverse effect of some welding on the module can be avoided, and the environmental pollution caused by heavy metal in tin-lead solder can be avoided.

< example one >

An embodiment of a speaker module according to the present invention is described with reference to fig. 1:

the speaker module includes a speaker unit 1, a flexible wiring board 2, and a housing 3 accommodating the speaker unit 1 and the flexible wiring board 2.

The loudspeaker single body 1 is provided with a first electric connecting piece 11, the shell 3 is provided with a second electric connecting piece 4, the electric connecting part 21 at the first end of the flexible circuit board 2 is connected and conducted with the first electric connecting piece 11 on the loudspeaker single body 1 through conductive glue, and the electric connecting part at the second end of the flexible circuit board 2 is electrically connected with the second electric connecting piece 4 on the shell 3.

Among them, the electrical connection portion 21 at the first end of the flexible circuit board 2 is, for example, a metal sheet; the electrical connection portion 21 and the first electrical connection member 11 may partially overlap, and the electrical connection portion 21 is disposed above the first electrical connection portion 11.

The first electrical connector 11 is, for example, a conductive metal sheet. The second electrical connection 4 is, for example, a conductive metal sheet on which a pad 41 is provided; the second electrical connector 4 may also be a PCB board.

< example two >

Another embodiment of the speaker module provided by the present invention is described with reference to fig. 2:

the speaker module includes a speaker unit 1 and a housing 3 accommodating the speaker unit 1.

The loudspeaker single body 1 is provided with a first electric connecting piece 11, the shell 3 is provided with a second electric connecting piece 4, the conductive adhesive coating forms a strip-shaped conductive adhesive film 200, one end of the conductive adhesive film 200 is connected with the first electric connecting piece 11 of the loudspeaker single body 1, and the other end of the conductive adhesive film is connected with the second electric connecting piece 4 on the shell 3.

The routing area for coating the conductive adhesive film 200 on the housing 3 includes a plurality of horizontal planes parallel to the pads of the first electrical connector 11 or the second electrical connector 4 and inclined planes for connecting two adjacent horizontal planes with different heights, and the inclined planes transition between the adjacent horizontal planes, so that the conductive adhesive film 200 is not easy to break.

The conductive adhesive is an adhesive with conductive performance after being cured or dried, and usually takes matrix resin and conductive filler, namely conductive ions, as main components. According to the loudspeaker module, the internal circuit of the module is conducted by using the conductive adhesive, and the conductive adhesive can be bonded at a proper curing temperature, for example, the epoxy resin adhesive can be cured at the temperature of between room temperature and 150 ℃ and is far lower than the welding temperature of tin-lead welding, which is more than 200 ℃, so that the problems of module deformation, flexible circuit board tilting and stress concentration risk around a bonding pad, which are possibly caused by high welding temperature, are avoided, meanwhile, the use amount of a Ni/Au plated layer can be reduced, and the manufacturing cost is saved. Meanwhile, the conductive adhesive is used for connecting and conducting the internal circuit of the loudspeaker module, the process is simpler, the operation is easy, the automatic production is convenient to realize, and the production efficiency is improved.

Although some specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope of the present invention. The scope of the invention is defined by the appended claims.

Claims

1. A loudspeaker module comprises a module shell and a loudspeaker single body arranged in the module shell, wherein a first electric connector is arranged on the loudspeaker single body, a second electric connector is arranged on the module shell,

the circuit also comprises a circuit formed by a strip-shaped conductive adhesive film formed by coating conductive adhesive;

the routing area for coating the conductive adhesive film on the module shell comprises a plurality of horizontal planes parallel to the bonding pads of the first electric connecting piece or the second electric connecting piece and inclined planes for connecting two adjacent horizontal planes with different heights;

one end of the circuit is connected with the first electric connector, and the other end of the circuit is connected with the second electric connector.

2. The speaker module as recited in claim 1, wherein the first electrical connector is a conductive sheet metal and the second electrical connector is a conductive sheet metal or a PCB board.