JPH0326567B2 - - Google Patents
Info
- Publication number
- JPH0326567B2 JPH0326567B2 JP58203524A JP20352483A JPH0326567B2 JP H0326567 B2 JPH0326567 B2 JP H0326567B2 JP 58203524 A JP58203524 A JP 58203524A JP 20352483 A JP20352483 A JP 20352483A JP H0326567 B2 JPH0326567 B2 JP H0326567B2
- Authority
- JP
- Japan
- Prior art keywords
- holding
- lead
- electronic component
- holding portion
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000000605 extraction Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 235000000396 iron Nutrition 0.000 description 2
- 238000013016 damping Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0528—Holders; Supports for bulk acoustic wave devices consisting of clips
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
この発明は、端子付電子部品の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electronic component with a terminal.
この発明にかかる電子部品素体としては、例え
ば第１図、第２図に示すように、短冊状の圧電セ
ラミツク基板１の表面の一端側から長手方向の一
定位置まで全幅にわたつて電極膜２を設けるとと
もに、裏面の他端側から長手方向の一定位置まで
全幅にわたつて電極膜２を設けるとともに、裏面
の他端側から長手方向の一定位置まで全幅にわた
つて電極膜３を設けてそれぞれの電極膜２，３の
一部が圧電セラミツク基板１を介して対向するよ
うにしてエネルギー閉じ込め形として動作させる
厚みすべり振動モードを用いた圧電共振エレメン
ト４がある。 As shown in FIGS. 1 and 2, for example, the electronic component body according to the present invention includes an electrode film 2 extending over the entire width from one end side of the surface of a strip-shaped piezoelectric ceramic substrate 1 to a fixed position in the longitudinal direction. At the same time, an electrode film 2 is provided over the entire width from the other end side of the back surface to a certain position in the longitudinal direction, and an electrode film 3 is provided over the entire width from the other end side of the back surface to a certain position in the longitudinal direction. There is a piezoelectric resonant element 4 using a thickness shear vibration mode that operates as an energy trapping type in which parts of the electrode films 2 and 3 face each other with a piezoelectric ceramic substrate 1 in between.
そして、上記電極膜２，３の、圧電セラミツク
基板１の端部側がそれぞれ引出し電極となつてい
る。 The ends of the electrode films 2 and 3 of the piezoelectric ceramic substrate 1 serve as extraction electrodes, respectively.
この発明は、このような圧電共振エレメント４
などの電子部品素体を端子へ確実に接続する方法
を提供することを主な目的とする。 The present invention provides such a piezoelectric resonant element 4
The main objective is to provide a method for reliably connecting electronic component bodies such as terminals to terminals.
以下にこの発明の一実施例について説明する。 An embodiment of the present invention will be described below.
第３図、第４図において、１０はフープ、１１
はリード部分で、リード部分１１はフープ１０か
ら一定間隔をおいて一体形成されている。リード
部分１１の先端にはリード部分１１より幅広に
（２倍以上）形成された部分がありこの部分は折
曲げ線１３がリード部分１１の長さ方向に沿うよ
うに略Ｕ字状に（第６図）折曲げられて保持部分
１４とそして、上記リード部分１１と保持部分１
４とから端子が形成されている。保持部分１４の
側部開口同士は互いに対向している。第５図に示
すように保持部分１４とリード部分１１の境界部
にはクランク状に折曲げられて形成された段部か
らなるストツパ部分１５が設けられており、この
ストツパ部分１５は保持部分１４の底部の相当部
分を占めている。圧電共振エレメント４を保持部
分１４，１４で保持するとともに電極膜２，３と
保持部分１４，１４とを電気的に導通させるのは
以下の手順で行なう。すなわち、圧電共振エレメ
ント４は上下左右の方向性を問われることなく、
その長さ方向がリード部分１１と直交する向きに
のみ整えらせてパーツフイーダなどで搬送されて
来る。エレメント４をＵ字状の保持部分１４，１
４に第３，４図Ａ方向から挿入する直前に、保持
部分１４，１４をわずかに互いにはなれる方向に
拡げ、その状態を保つたままエレメント４を保持
部分１４，１４に入れストツパ部分１５にエレメ
ント４があたつたら拡げることをやめる。すると
リード部分１１，１１が有するバネ性でエレメン
ト４にはその長さ方向に圧接力を保持部分１４，
１４から受けて保持がなされる。あるいは、保持
部分１４，１４を拡げることなく、エレメント４
の両端を保持部分１４，１４におさめる。この状
態で電極膜２，３の端部分と保持部分１４，１４
とをはんだやその他はんだに準ずる接続材（この
明細書ではこれらを総称してはんだ等を呼ぶ）で
電気的に接続する。はんだづけの場合、第３，４
図のＡ方向からはんだゴテ１６，１６を保持部分
１４，１４に近づける。この行程中にはんだ１
７，１７がＢ方向に送り出される。したがつては
んだゴテ１６，１６によつてはんだ１７，１７が
溶融保持部分１４，１４内空間に落下する。落下
したはんだは保持部分１４と圧電共振エレメント
４との間の〓間に流れ込み、圧電共振エレメント
４の一方の面から他方の面にまで回り込む。した
がつて、引出し電極が圧電共振エレメント４の同
一面上に形成されている場合はもちろん、互いに
異なる面に形成されている場合にも該引出し電極
と保持部分１４は確実に接続される。保持部分１
４，１４はエレメント４の大きさに対し大きめに
形成しておくと種々の大きさのエレメント４に対
し兼用できて好ましい。本発明に関しては、保持
部分１４の形状は略Ｕ字状で、圧電共振エレメン
ト（電子部品素体）４を端部において両面から所
定の〓間を介して保持することができる形状であ
ればよい。したがつて、この明細書において「略
Ｕ字状」とは第７図に示すような多角形状はもち
ろん、コ字状（特に図示しない）等の形状をも含
むものである。 In Figures 3 and 4, 10 is a hoop, 11
is a lead portion, and the lead portion 11 is integrally formed with the hoop 10 at a constant distance. At the tip of the lead part 11, there is a part that is wider than the lead part 11 (more than twice as wide), and this part has a substantially U-shape (a U-shape) so that the bending line 13 runs along the length direction of the lead part 11. Figure 6) The holding part 14 is bent and the lead part 11 and the holding part 1 are bent.
A terminal is formed from 4. The side openings of the holding portion 14 are opposed to each other. As shown in FIG. 5, a stopper part 15 consisting of a stepped part bent into a crank shape is provided at the boundary between the holding part 14 and the lead part 11. occupies a considerable portion of the bottom of the The piezoelectric resonant element 4 is held by the holding parts 14, 14, and the electrode films 2, 3 and the holding parts 14, 14 are electrically connected to each other by the following procedure. In other words, the piezoelectric resonant element 4 is independent of the vertical and horizontal directions.
The parts are conveyed by a parts feeder or the like with their lengths aligned only in a direction perpendicular to the lead part 11. The element 4 is attached to the U-shaped holding part 14,1
Immediately before inserting the element 4 from the direction A in FIGS. 3 and 4, the holding parts 14, 14 are slightly expanded in the direction in which they are separated from each other, and while maintaining this state, the element 4 is inserted into the holding parts 14, 14, and the element 4 is inserted into the stopper part 15. When element 4 is warm, stop expanding. Then, due to the spring properties of the lead portions 11, 11, a pressure force is applied to the element 4 in the length direction of the holding portion 14,
14 and is held. Alternatively, without expanding the holding portions 14, 14, the element 4
Both ends of the holder are placed in the holding parts 14, 14. In this state, the end portions of the electrode films 2, 3 and the holding portions 14, 14
and are electrically connected using solder or other connecting materials similar to solder (in this specification, these are collectively referred to as solder, etc.). For soldering, 3rd and 4th
The soldering irons 16, 16 are brought close to the holding parts 14, 14 from the direction A in the figure. During this process, solder 1
7 and 17 are sent out in the B direction. Therefore, the solder 17, 17 falls by the soldering irons 16, 16 into the space within the molten holding portions 14, 14. The fallen solder flows into the space between the holding portion 14 and the piezoelectric resonant element 4, and wraps around from one surface of the piezoelectric resonant element 4 to the other surface. Therefore, the extraction electrode and the holding portion 14 are reliably connected not only when the extraction electrodes are formed on the same surface of the piezoelectric resonant element 4 but also when they are formed on different surfaces. Holding part 1
4 and 14 are preferably formed to be larger than the size of the element 4 so that they can be used for elements 4 of various sizes. Regarding the present invention, the shape of the holding portion 14 may be approximately U-shaped, as long as it can hold the piezoelectric resonant element (electronic component body) 4 at the end with a predetermined distance from both sides. . Therefore, in this specification, the term "substantially U-shaped" includes not only polygonal shapes as shown in FIG. 7, but also shapes such as a U-shape (not particularly shown).
また、電子部品素体としては、上記実施例に示
すような厚みすべり振動モードを用いた圧電共振
エレメントに限らず、両端部に引出し電極が形成
された他の振動モードを用いた振動素子などの電
子部品素体が例示され、これらの種々の電子部品
素体に関して本発明を適用することができる。 In addition, the electronic component body is not limited to a piezoelectric resonant element using a thickness-shear vibration mode as shown in the above embodiment, but also a vibrating element using other vibration modes with extraction electrodes formed at both ends. Electronic component bodies are exemplified, and the present invention can be applied to these various electronic component bodies.
この発明の端子付電子部品の製造方法は、リー
ド部分と、該リード部分の一端側にあつて該リー
ド部分と一体に形成され下記電子部品素体を保持
する保持部分と、下記電子部品素体の前記リード
部分方向への移動を阻止するストツパ部分とを有
する端子であつて、前記保持部分の側部開口が相
対向するように平行に配設された２本の端子と、
対向する互いに異なる面に設けられた電極から互
いに異なる両端側に引出し電極が引き出されてお
り、前記保持部分の間に保持され、前記引出し電
極がはんだ等により前記保持部分に電気的に接続
されている電子部品素体とを有する圧電部品の製
造方法において、
前記保持部分を、折曲げ線が前記リード部分の
長手方向に沿うように略Ｕ字状に折曲げて形成
し、
前記ストツパ部分として、前記保持部分と前記
リード部分との境界部付近で前記リード部分を折
曲げて前記保持部分の底部開口の相当部分を実質
的に塞ぐ段部を形成し、
前記電子部品素体の両端部を、その両面との間
に所定の〓間を保持しつつ、その両面側から前記
保持部分により挾むように保持し、
溶融したはんだ等を上方から前記電子部品素体
と前記保持部分との〓間に滴下させ、はんだ等を
該〓間に回り込ませて前記引出し電極と前記保持
部分とを接続することを特徴としている。したが
つて、保持部分と段部からなるストツパ部分によ
り保持部分は容器状に形成されており、溶融はん
だの保持容量が大きいため、上方から滴下された
溶融はんだが相当量保持部分内に溜まり、これが
電子部品素体と前記保持部分との〓間に回り込ん
で引出し電極と保持部分とが確実に接続される。
これはこの発明に固有の効果であり、電子部品素
体の両端部に形成された引出し電極を、それが互
いに異なる面に形成されている場合にも、一つの
工程で、端子に接続することが可能となり、製造
工程が簡略化されて圧電部品の量産化が可能にな
る。また、はんだの保持容量が大きいことから接
続の信頼性が向上するとともに電子部品が圧電共
振部品である場合には、圧電素子の振動部から伝
ぱんする振動を圧電素子の端部で吸収して反射を
抑制するダンピング効果も向上する。 The method for manufacturing an electronic component with a terminal according to the present invention includes a lead portion, a holding portion that is formed integrally with the lead portion on one end side of the lead portion and holds the following electronic component element, and the following electronic component element: a stopper portion for preventing movement of the terminal toward the lead portion, the two terminals being arranged in parallel so that the side openings of the holding portions face each other;
Extracting electrodes are extended from opposite ends of electrodes provided on mutually different surfaces, and are held between the holding parts, and the leading electrodes are electrically connected to the holding part by soldering or the like. In the method of manufacturing a piezoelectric component having an electronic component body, the holding portion is bent into a substantially U-shape so that the bending line runs along the longitudinal direction of the lead portion, and the stopper portion is formed by bending the holding portion into a substantially U-shape. bending the lead portion near the boundary between the holding portion and the lead portion to form a stepped portion that substantially closes a substantial portion of the bottom opening of the holding portion; While maintaining a predetermined gap between both sides, the electronic component is held between both sides by the holding parts, and molten solder or the like is dropped from above between the electronic component body and the holding parts. The lead electrode is connected to the holding portion by passing solder or the like around the gap. Therefore, the holding part is formed into a container shape by the stopper part consisting of the holding part and the stepped part, and has a large holding capacity for molten solder, so a considerable amount of molten solder dropped from above accumulates in the holding part. This wraps around between the electronic component body and the holding portion, and the lead electrode and the holding portion are reliably connected.
This is an effect unique to this invention, and it is possible to connect the extraction electrodes formed at both ends of the electronic component body to the terminal in one process even if they are formed on different surfaces. This simplifies the manufacturing process and enables mass production of piezoelectric components. In addition, the large holding capacity of the solder improves the reliability of the connection, and when the electronic component is a piezoelectric resonant component, the vibration propagating from the vibrating part of the piezoelectric element is absorbed by the end of the piezoelectric element. The damping effect that suppresses reflection is also improved.
第１図は平面図、第２図は側面図、第３図は平
面図、第４図は側面図、第５図は斜視図、第６図
と第７図は正面図。
２，３は電極膜、４は圧電共振エレメント、１
１はリード部分、１４は保持部分、１５はストツ
パ部分。
Fig. 1 is a plan view, Fig. 2 is a side view, Fig. 3 is a plan view, Fig. 4 is a side view, Fig. 5 is a perspective view, and Figs. 6 and 7 are front views. 2 and 3 are electrode films, 4 is a piezoelectric resonant element, 1
1 is a lead part, 14 is a holding part, and 15 is a stopper part.
Claims (1)
て該リード部分と一体に形成され下記電子部品素
体を保持する保持部分と、下記電子部品素体の前
記リード部分方向への移動を阻止するストツパ部
分とを有する端子であつて、前記保持部分の側部
開口が相対向するように平行に配設された２本の
端子と、対向する互いに異なる面に設けられた電
極から互いに異なる両端側に引出し電極が引き出
されており、前記保持部分の間に保持され、前記
引出し電極がはんだ等により前記保持部分に電気
的に接続されている電子部品素体とを有する端子
付電子部品の製造方法において、 前記保持部分を、折曲げ線が前記リード部分の
長手方向に沿うように略Ｕ字状に折曲げて形成
し、 前記ストツパ部分として、前記保持部分と前記
リード部分との境界部付近で前記リード部分を折
曲げて前記保持部分の底部開口の相当部分を実質
的に塞ぐ段部を形成し、 前記電子部品素体の両端部を、その両面との間
に所定の〓間を保持しつつ、その両面側から前記
保持部分により挟むように保持し、 溶融したはんだ等を上方から前記電子部品素体
と前記保持部分との〓間に滴下させ、はんだ等を
該〓間に回り込ませて前記引出し電極と前記保持
部分とを接続することを特徴とする端子付電子部
品の製造方法。[Scope of Claims] 1. A lead portion, a holding portion that is formed integrally with the lead portion on one end side of the lead portion and holds the electronic component element described below, and a direction toward the lead portion of the electronic component element described below. The terminal has a stopper portion for preventing movement of the holding portion, the terminal having two terminals arranged in parallel so that the side openings of the holding portion face each other, and two terminals provided on opposite mutually different surfaces. A terminal having an electronic component body in which lead electrodes are drawn out from the electrodes at different ends, and held between the holding parts, and the lead electrodes are electrically connected to the holding part by solder or the like. In the method for manufacturing an electronic component, the holding portion is formed by bending into a substantially U-shape such that the bending line runs along the longitudinal direction of the lead portion, and the holding portion and the lead portion serve as the stopper portion. bending the lead portion near the boundary with the holding portion to form a stepped portion that substantially closes a portion of the bottom opening of the holding portion; While holding the gap between the electronic component body and the holding part, hold it between both sides of the holding part, and drop molten solder etc. from above between the electronic component body and the holding part to apply the solder etc. A method for manufacturing an electronic component with a terminal, characterized in that the lead-out electrode and the holding portion are connected by wrapping the electrode between them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20352483A JPS6094517A (en) | 1983-10-28 | 1983-10-28 | Manufacture of electronic component with terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20352483A JPS6094517A (en) | 1983-10-28 | 1983-10-28 | Manufacture of electronic component with terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6094517A JPS6094517A (en) | 1985-05-27 |
| JPH0326567B2 true JPH0326567B2 (en) | 1991-04-11 |
Family
ID=16475572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20352483A Granted JPS6094517A (en) | 1983-10-28 | 1983-10-28 | Manufacture of electronic component with terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6094517A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100254890B1 (en) * | 1997-05-28 | 2000-05-01 | 이형도 | An electronic parts having 2 terminal parts for piezoelectric device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5574028U (en) * | 1978-11-15 | 1980-05-21 |
-
1983
- 1983-10-28 JP JP20352483A patent/JPS6094517A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6094517A (en) | 1985-05-27 |
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