JPS6267914A - Electronic component - Google Patents

Abstract

PURPOSE:To connect electrodes of both major planes of a rectangular element as soon as the rectangular element terminals are connected by forming a clipped face and a side wall face to a holder of the terminal supporting both ends of the rectangular element. CONSTITUTION:The upper part of the 1st terminal 16 and the 2nd terminal 17 at both ends are pushed and spread in the opposite side to widen the interval of the holders 20, 20 and a ceramic base 2 is inserted from the upper part as shown in arrows A, A. Then solder 24 is given to a gap among the holders 20, 20 of the 1st terminal 16 and the 2nd terminal 17, the side wall face 23 and the ceramic base 2. Thus, electrodes 4, 5, 6, 9 at both ends of both the major planes of the ceramic base are connected surely to the 1st terminal 16 or the 2nd terminal 17.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field The present invention relates to an electronic component characterized by a terminal structure for connecting and fixing a rectangular plate-like element in which a film-like electrode is formed on a crystal substrate, a ceramic substrate, or the like.

(bl Prior Art and Its Disadvantages) When it is necessary to establish continuity between the electrodes formed on both main surfaces of a rectangular plate-like element, conventionally, a conductive adhesive is applied to connect these electrodes through the side surfaces of the substrate. was connected.

An example of a rectangular plate-shaped element that requires conduction between electrodes on both main surfaces is a piezoelectric resonator in which a capacitor as a load capacitance is integrally formed on a single ceramic substrate.

Hereinafter, the case of such a piezoelectric resonator will be explained based on FIGS. 5 to 8. This piezoelectric resonator 1 is of an energy trap type thickness longitudinal vibration mode, and has film-like electrodes on both main surfaces of a rectangular plate-shaped ceramic substrate 2 that is polarized by applying a high voltage and made into a piezoelectric body. It is constructed by forming. A first resonator electrode 3 forming a piezoelectric resonator, a first capacitor electrode 4 forming one capacitor, and a first capacitor electrode 5 forming the other capacitor are formed on the front main surface of the ceramic substrate 2. is formed. Of these, the first resonator electrode 3 and the first capacitor electrode 4 of one of the capacitors are connected on this main surface by an extraction electrode. Also, the first
The capacitor electrode 5 is connected to a connecting electrode 6 formed on the same main surface by an extraction electrode. A second resonator electrode 7 constituting a piezoelectric resonator and a continuous and integrated second capacitor electrode 8 constituting both capacitors are formed on the main surface on the back side of the ceramic substrate 2. There is. The second resonator electrode 7 is connected to a connecting electrode 9 formed on the same rear main surface by an extraction electrode. The connection electrode 9 on the back side and the connection electrode 6 on the front side are formed at the same position on the front and back sides of the end portion with the ceramic substrate 2 in between. The piezoelectric resonator 1 configured in this manner is connected and fixed to three lead terminals 10 to 12, as shown in FIGS. 6 and 7. The first lead terminal 10 at one end is connected and fixed to the first capacitor electrode 4 of one capacitor with solder or the like, and the 21st J-do terminal 1 at the other end is connected to the first capacitor electrode 4 of one capacitor.
1 is connected and fixed to the first capacitor electrode 5 of the other capacitor by soldering or the like. In addition, the third lead terminal 12 in the center
is connected and fixed to the second capacitor electrode 8 on the back side with solder or the like. Note that by soldering the first capacitor electrode 4.5, vibrations of the ceramic substrate 2 are damped, so that the first capacitor electrode 4.5 can function as a capacitor. However, even after each electrode 4, 5.8 and each lead terminal 10-12 are connected and fixed in this manner, there is still no conduction between the connecting electrodes 6, 9 in the electric circuit shown in FIG. For this reason, conventionally, in order to establish continuity between them, the connection was made by applying a conductive adhesive 14 from the connection electrode 6 on the front side of the ceramic substrate 2 to the connection electrode 9 on the back side of the ceramic substrate 2 through the side surface of the ceramic substrate 2. was.

However, such a process of applying the conductive adhesive 14 not only makes it difficult to automate the manufacturing of electronic components, but also reduces the film thickness of the conductive adhesive 14 at the edges between both main surfaces and side surfaces of the ceramic substrate 2. Since the wire becomes thinner, wire breakage tends to occur easily, which has the disadvantage of deteriorating the yield of the product.

(C1 Purpose of the Invention This invention was made in view of the above circumstances, and by forming a clamping surface and a side wall surface on the holding portion of the terminal that supports both ends of the rectangular plate element, An object of the present invention is to provide an electronic component having a terminal that can simultaneously connect and fix a shaped element to a terminal and connect electrodes on both main surfaces of a rectangular plate-like element.

(d1 Structure and Effect of the Invention The electronic component of the present invention has two or more terminals arranged, the two terminals at both ends are located on a lead portion and one side of this lead portion, and are arranged on a rectangular plate-like element. a holding part for supporting both ends, and a holding part formed on the holding part,
In an electronic component having a stopper portion for restricting movement of the supported rectangular plate-like element toward the lead portion, each holding portion of two terminals arranged at both ends is connected to both main parts of the rectangular plate-like element. Two opposing clamping surfaces are formed to sandwich the surfaces with a slight gap at both ends, and when a rectangular plate-like element is supported on the outside and is continuous with these two clamping surfaces, this square shape is formed. It is characterized by having side wall surfaces located slightly outside of both end side surfaces of the plate-like element.

When the electronic component of the present invention is configured as described above, each holding portion of the two terminals arranged at both ends covers and supports both main surfaces and side surfaces with a slight gap at both ends of the rectangular plate element. By simply pouring solder etc. into this gap, each electrode and each terminal on both main surfaces of the rectangular plate element can be connected, respectively.
At the same time, electrical continuity can be established between the electrodes on both main surfaces that require connection via solder or a terminal conductor. Therefore, the electronic component of the present invention does not require the process of applying conductive adhesive to connect the electrodes on both main surfaces of the rectangular plate-like element, so only slight changes can be made to the conventional mechanical device. The manufacturing of electronic components can be easily automated, and the electrodes on both main surfaces of the rectangular plate element are electrically connected to each other by the solder filled in the gap with the holding part and the internal body of the holding part. There is also no fear of a drop in product yield due to wire breakage.

EXAMPLE A case will be described below in which the electronic component of the present invention is applied to a terminal of a piezoelectric resonator using a ceramic substrate. Note that the same parts as those in the conventional example are given the same numbers and their explanations are omitted.

FIG. 1 is a perspective view of a terminal of an electronic component used in an embodiment of the present invention, FIGS. 2 and 3 are front views for explaining the work of attaching a ceramic substrate to a terminal of the electronic component,
The figure is a plan view of the terminal of the electronic component after it is attached to the ceramic substrate.

The terminals of the electronic component in this embodiment are arranged in one set on the hoop 15.
It is constructed by placing book terminals 16-1. The two first terminals 16 and second terminals 17 at both ends consist of a lead portion 19, a holding portion 20, and a stopper portion 21. The holding portion 20 is located on one end side of the lead portion 19, is formed integrally with the lead portion and is wider than each lead portion 19, and has one side such that the bending line runs along the length direction of the lead portion 19. By opening and bending, it is formed into a U-shaped cross section. Further, a U-shaped opening formed by bending the holding portion 20 is provided between the first terminal 16 and the second terminal 17 so as to face each other. For this reason, by inserting the two rings of the ceramic substrate 2 constituting the piezoelectric resonator 1 into the openings of the two holding parts 20 and 20, the bent (both sides of the letter 1 shape are the two main surfaces of the ceramic substrate 2). are sandwiched with a slight gap between them, so that two opposing clamping surfaces 22.22 are formed, and the bent U-shaped central part continues to these clamping surfaces 22.22 on the outside, and , a side wall surface 23 located slightly outside of both end side surfaces of the ceramic substrate 2 is formed.The other end side of the lead portion 19 is integrally connected to the hoop 15.The stopper portion 21 is The other end of the holding part 20 connected to the lead part 19 is bent into a crank shape, and is formed so that both lower ends of the ceramic substrate 2 inserted into the holding part 20 come into contact.The third terminal 18 is connected only to the lead part 19. It is provided so as to protrude from the hoop 15 near the approximate center of the first terminal 16 and the second terminal 17.

The working procedure for connecting and fixing the ceramic substrate 2 constituting the piezoelectric resonator 1 to the terminals of the electronic component of this embodiment configured as described above will be explained based on FIGS. 2 and 3.

In this ceramic substrate 2, a first capacitor electrode 4 constituting one capacitor is formed along the entire length along one end side of the main surface on the front side, and a first resonator electrode 3
and are connected by two extraction electrodes. Further, the first capacitor electrode 5 constituting the other capacitor is also formed along the entire length along the other end side of the main surface on the front side, and is continuous with the connection electrode 6 formed above the other end side. and become one. Second resonator electrode 7 on the main surface on the back side
is connected by two lead electrodes to a connection electrode 9 formed above the other end side of the main surface on the back side. The reason why the first and second resonator electrodes 3.7 are connected by two lead electrodes in this way is to prevent a decrease in product yield due to disconnection of the lead electrodes.

First, as shown in FIG. 2, the two first terminals 16 at both ends
Then, one of the second terminals 17 is pushed to the opposite side to widen the interval between the holding portions 20 and 20, and the ceramic substrate 2 is inserted from above as shown by arrows A and A. Both sides of the lower end of the inserted ceramic board 2 are the first terminals 1
When the terminals 6 and 17 come into contact with the stopper portions 21.21 and are restricted from moving downward, the force that was pushing these terminals 16.17 apart is released, as shown in FIG. Return to original position. After that, if solder 24 is poured into the gaps between the ceramic substrate 2 and each clamping surface 22 and side wall surface 23 of the holding portions 20 and 20 of the first terminal 16 and the second terminal 17, as shown in FIG. Since the solder 24 sufficiently wraps around this small gap, each electrode 4, 5, 6.9 at both ends of both main surfaces of the ceramic substrate 2 is securely connected to the first terminal 16 or the second terminal 17. connected to. Therefore, the connection electrode 6 and the connection electrode 9 formed on the front and back surfaces above the other end side of both main surfaces are reliably electrically connected via the solder 24 and the holding portion 20 of the second terminal 17, as shown in FIG. The same electric circuit as the conventional one shown in can be constructed. Also,
Guided by the first capacitor electrodes 4 and 5 formed over the entire length on both ends of the front main surface, the solder 24 can sufficiently penetrate downward to ensure a secure connection. As a method of soldering, it is possible to use a soldering iron or immerse it in a bath of molten solder.''As explained above, the terminal of the electronic component in this example is similar to that of the conventional electronic component. Since the connection electrodes 6.9 formed on both main surfaces of the ceramic substrate 2 can be connected in the manufacturing process, the ceramic substrate 2 constituting the piezoelectric resonator 1 in which the load capacitance is integrated on the same substrate can be connected. However, the manufacturing process itself
Furthermore, since there is no risk of wire breakage as would be the case when using a dielectric adhesive, it is possible to improve the yield of the product. Furthermore, since solder has a shorter curing time than conductive adhesive, the production schedule can be shortened. Since both ends of the element are held by terminals, the strength of the element is improved.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a terminal of an electronic component used in an embodiment of the present invention, FIGS. 2 and 3 are front views for explaining the work of attaching a ceramic substrate to a terminal of the electronic component,
The figure is a plan view of the terminal of the electronic component after it is attached to the ceramic board, Figure 5 is a front view of the ceramic board that constitutes the piezoelectric resonator with integrated load capacitance, and Figure 6 is the same ceramic board as the conventional one. Front view when attached to the terminal of an electronic component, No. 7
The figure is a plan view of the same, and FIG. 8 is an electrical schematic diagram of the electronic component. 2-Ceramic substrate (square plate-shaped Niremen 1~), 16-
1st terminal, 17 - 2nd terminal, 18 - 3rd terminal, 19 - lead part, 20 - holding part, 21 - stopper part, 22 - clamping surface,
23 ~ side wall surface.

Claims (1)

[Claims] (1) Two or more terminals are arranged, and the two terminals at both ends are connected to a lead part and a holding part on one side of the lead part to respectively support both ends of the rectangular plate element. , and a stopper portion formed on the holding portion to restrict movement of the supported rectangular plate-like element toward the lead portion, in which each holding portion of two terminals arranged at both ends is , two opposing clamping surfaces formed to sandwich both main surfaces of the rectangular plate element with a slight gap at both ends, and a rectangular plate element that is continuous with these two clamping surfaces on the outside. and side wall surfaces located slightly outside of both end side surfaces of the rectangular plate-like element when the electronic component is supported.