JPS60245262A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS60245262A
JPS60245262A JP10045784A JP10045784A JPS60245262A JP S60245262 A JPS60245262 A JP S60245262A JP 10045784 A JP10045784 A JP 10045784A JP 10045784 A JP10045784 A JP 10045784A JP S60245262 A JPS60245262 A JP S60245262A
Authority
JP
Japan
Prior art keywords
lead
frame
plug
semiconductor device
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10045784A
Other languages
Japanese (ja)
Inventor
Takeshi Komaru
小丸　健
Shunji Koike
俊二 小池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10045784A priority Critical patent/JPS60245262A/en
Publication of JPS60245262A publication Critical patent/JPS60245262A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the performance of a semiconductor device by a method wherein the joint between the frame is made narrower than the width of a socket plug. CONSTITUTION:The lead frame is formed out of a four-side frame 1 forming a square in the perimeter. Inside two opposed sides of the frame 1, leads 2 extending to the center whose end is rectangular are joined at the tip of the plug 2a which is the outer lead of the lead 2. The tip 2b of the plug 2a of the outer lead that of the joint between the frame 1 is narrower than the other part of the plug 2a. The CERDIP type semiconductor device manufactured by using such a lead frame is equipped with outer leads narrower in the plug tip 2b. Therefore, the mounting substrate can smoothly be plugged into a socket.

Description

【発明の詳細な説明】 ［技術分野］ 本発明はリードフレームに関し、特に半導体装置の性能
向上に適用して有効な技術に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a lead frame, and particularly to a technique that is effective when applied to improving the performance of a semiconductor device.

［背景技術］ いわゆるサーディンプ型の如き気密封止型の半導体装置
は、セラミックからなるパンケージの両側に、はぼ該パ
ッケージ下方に折り曲げられた外部リードを備えてなる
もので、実装基板のソケットに該外部リードの差し込み
部を挿入して使用されるものである。[Background Art] A hermetically sealed semiconductor device, such as the so-called sardimp type, is equipped with external leads on both sides of a ceramic pan cage that are bent downwards from the package, and are connected to sockets on a mounting board. It is used by inserting the insertion portion of the external lead.

前記半導体装置は、予め所定位置で折り曲げられたリー
ドフレームを、該リードフレームの内部リード先端部と
パッケージ基板に搭載されているペレットとをワイヤボ
ンディングを行った後に、該パンケージ基板とキャップ
との間に挟持した状態で、低融点ガラスで融着固定する
と同時に該バ°ツケージ基板とキャンプとで形成される
キャビティを気密封止してなるものである。In the semiconductor device, the lead frame is bent in advance at a predetermined position, and after wire bonding is performed between the internal lead tips of the lead frame and the pellet mounted on the package substrate, The package substrate is sandwiched between the package substrates, and is fused and fixed with low melting point glass, and at the same time, the cavity formed by the package substrate and the camp is hermetically sealed.

その後、各リードをフレーム連結部で切断することによ
り、前記半導体装置が完成される。Thereafter, the semiconductor device is completed by cutting each lead at the frame connecting portion.

このようにして製造される半導体装置は、リード切断が
ソケット差し込み部と同−巾のフレーム連結部で行われ
る場合には、外部リード差し込み部先端が矩形形状にな
るため、該半導体装置を実装基板のソケットへ挿入する
作業を円滑に行うことができないという問題があること
が、本発明者により見い出された。In the semiconductor device manufactured in this way, when the leads are cut at the frame connecting portion having the same width as the socket insertion portion, the tips of the external lead insertion portions have a rectangular shape. The inventor of the present invention has discovered that there is a problem in that the operation of inserting the device into the socket cannot be performed smoothly.

なお、サーディンプ型半導体装置については、たとえば
、工業調査会１９８０年１月１５日発行の「ＩＣ化実装
技術」のＰ１３Ｂ以下に示されている。The sardimp type semiconductor device is described, for example, on page 13B of "IC Mounting Technology" published by Kogyo Kenkyukai on January 15, 1980.

［発明の目的］ 本発明の目的は、半導体装置の性能向上に適用して有効
な技術を提供することにある。[Object of the Invention] An object of the present invention is to provide a technique that is effective when applied to improving the performance of a semiconductor device.

本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
。The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

［発明の概要］ 本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、次の通りである。[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

すなわち、気密封止型半導体装置用のリードフレームに
おいて、リード切断部であり内部リードのソケット差し
込み部先端であるフレームとの連結部を該ソケット差し
込み部の巾より狭くすることにより、該連結部でリード
を切断して形成される外部リードのソケット差し込み部
先端を狭く形成することができ、該リードフレームを用
いて形成される半導体装置の実装の円滑化を達成するも
のである。That is, in a lead frame for a hermetically sealed semiconductor device, by making the connection part with the frame, which is the lead cutting part and the tip of the socket insertion part of the internal lead, narrower than the width of the socket insertion part, the connection part The tip of the socket insertion part of the external lead formed by cutting the lead can be formed narrowly, thereby achieving smooth mounting of a semiconductor device formed using the lead frame.

［実施例］ 図は、本発明による一実施例であるリードフレ一ムの概
略を、その平面図で示したものである。[Example] The figure is a plan view schematically showing a lead frame which is an example of the present invention.

本実施例のリードフレームは、四角形を形成する４辺か
らなるフレーム１で周囲が形成され、対向する２辺のフ
レーム１の内側には、端部が四角形の中央部近傍に延在
するリード２が、該リード２の外部リードの差し込み部
２ａの先端で連結されてなるものである。The lead frame of this embodiment is surrounded by a frame 1 consisting of four sides forming a rectangle, and inside the two opposing sides of the frame 1 are leads 2 whose ends extend near the center of the rectangle. are connected at the tip of the insertion portion 2a of the external lead of the lead 2.

前記リードフレームの特徴は、フレーム１との連結部で
ある外部リードの差し込み部２ａの先端２ｂを該差し込
み部２ａの他の部分より狭く形成せしめたところにある
。A feature of the lead frame is that the tip 2b of the external lead insertion part 2a, which is the connection part with the frame 1, is formed narrower than the other part of the insertion part 2a.

本実施例のリードフレームを用いて製造される号−ディ
ソプ型半導体装置は、外部リードがリード２のフレーム
１との連結部を切断することにより形成されるので、差
し込み部先端２ｂが細い形状の外部リードを備えたもの
となる。In the Disop type semiconductor device manufactured using the lead frame of this embodiment, the external leads are formed by cutting the connecting portions of the leads 2 and the frame 1, so the insertion portion tip 2b has a narrow shape. It will be equipped with an external lead.

したがって、本実施例のリードフレームを用いることに
より、実装基板のソケットへの差し込みを円滑に行うこ
とができるサーディンブ型半導体装置を提供することが
できる。Therefore, by using the lead frame of this embodiment, it is possible to provide a sardine-type semiconductor device in which a mounting board can be smoothly inserted into a socket.

なお、本実施例のリードフレームは、４２−アロイまた
はコバール等の材料を用いて、通常の方法、たとえばプ
レス成型で容易に製造できるものである。The lead frame of this example can be easily manufactured by a conventional method such as press molding using a material such as 42-alloy or Kovar.

［効果］ （１）、リードフレームについて、フレームとの連結部
におけるリード中を狭く形成することにより、該リード
フレームを用いて製造される半導体装置の外部リードの
ソケット差し込み部先端を他のリード中より狭い形状に
することができるので、実装基板のソケットへスムーズ
に挿入実装することができる半導体装置を提供すること
ができる。[Effects] (1) In the lead frame, by narrowing the inside of the lead at the connecting part with the frame, the tip of the socket insertion part of the external lead of a semiconductor device manufactured using the lead frame can be narrowed inside the other lead. Since the shape can be made narrower, it is possible to provide a semiconductor device that can be smoothly inserted and mounted into a socket of a mounting board.

（２）、前記ｆｌｌにより、電子機器製造における作業
性を向上させることができる。(2) The flll can improve workability in manufacturing electronic devices.

以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は前記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない。Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

たとえば、リードのフレームとの連結部の形状は、実施
例に示したものに限るものでなく、他のソケット差し込
み部のり一ドｌＪより狭い形状であればいかなるもので
あってもよい。For example, the shape of the connecting portion of the lead to the frame is not limited to that shown in the embodiment, but may be any shape as long as it is narrower than the other socket insertion portions.

【図面の簡単な説明】[Brief explanation of the drawing]

図は、本発明による一実施例のリードフレームを示す概
略平面図である。 １・・・フレーム、２・・・リード、２ａ・・・差し込
み部、２ｂ・・・差し込み部先端。The figure is a schematic plan view showing a lead frame according to an embodiment of the present invention. 1... Frame, 2... Lead, 2a... Insertion part, 2b... Insertion part tip.

Claims (1)

【特許請求の範囲】[Claims] １、気密封止型半導体装置用リードフレームにおいて、
フレーム連結部のリード中を狭くしたことを特徴とする
リードフレーム。1. In the lead frame for hermetically sealed semiconductor devices,
A lead frame characterized by narrowing the middle of the lead at the frame connection part.
JP10045784A 1984-05-21 1984-05-21 Lead frame Pending JPS60245262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10045784A JPS60245262A (en) 1984-05-21 1984-05-21 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10045784A JPS60245262A (en) 1984-05-21 1984-05-21 Lead frame

Publications (1)

Publication Number Publication Date
JPS60245262A true JPS60245262A (en) 1985-12-05

Family

ID=14274442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10045784A Pending JPS60245262A (en) 1984-05-21 1984-05-21 Lead frame

Country Status (1)

Country Link
JP (1) JPS60245262A (en)

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