JPS6081900A - 電磁波遮蔽用導電性熱可塑性樹脂チップの製造方法 - Google Patents
電磁波遮蔽用導電性熱可塑性樹脂チップの製造方法Info
- Publication number
- JPS6081900A JPS6081900A JP19005683A JP19005683A JPS6081900A JP S6081900 A JPS6081900 A JP S6081900A JP 19005683 A JP19005683 A JP 19005683A JP 19005683 A JP19005683 A JP 19005683A JP S6081900 A JPS6081900 A JP S6081900A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- sheet
- shielding electromagnetic
- conductive
- electromagnetic waves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims description 50
- 238000000034 method Methods 0.000 title claims description 11
- 239000004020 conductor Substances 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19005683A JPS6081900A (ja) | 1983-10-11 | 1983-10-11 | 電磁波遮蔽用導電性熱可塑性樹脂チップの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19005683A JPS6081900A (ja) | 1983-10-11 | 1983-10-11 | 電磁波遮蔽用導電性熱可塑性樹脂チップの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6081900A true JPS6081900A (ja) | 1985-05-09 |
| JPH0358558B2 JPH0358558B2 (enrdf_load_stackoverflow) | 1991-09-05 |
Family
ID=16251604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19005683A Granted JPS6081900A (ja) | 1983-10-11 | 1983-10-11 | 電磁波遮蔽用導電性熱可塑性樹脂チップの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6081900A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133799A (ja) * | 1983-12-21 | 1985-07-16 | 株式会社東芝 | 電磁波シールド用マスターペレットの製造方法 |
| JPS61242124A (ja) * | 1985-04-18 | 1986-10-28 | Nippon Enkaku Seigyo Kk | 相互変調防止機能が改善されたラジオコントロール用受信機 |
| US5165985A (en) * | 1991-06-28 | 1992-11-24 | Minnesota Mining And Manufacturing Company | Method of making a flexible, transparent film for electrostatic shielding |
-
1983
- 1983-10-11 JP JP19005683A patent/JPS6081900A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133799A (ja) * | 1983-12-21 | 1985-07-16 | 株式会社東芝 | 電磁波シールド用マスターペレットの製造方法 |
| JPS61242124A (ja) * | 1985-04-18 | 1986-10-28 | Nippon Enkaku Seigyo Kk | 相互変調防止機能が改善されたラジオコントロール用受信機 |
| US5165985A (en) * | 1991-06-28 | 1992-11-24 | Minnesota Mining And Manufacturing Company | Method of making a flexible, transparent film for electrostatic shielding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0358558B2 (enrdf_load_stackoverflow) | 1991-09-05 |
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