JPS607962A - 樹脂硬化方法 - Google Patents

樹脂硬化方法

Info

Publication number
JPS607962A
JPS607962A JP11502983A JP11502983A JPS607962A JP S607962 A JPS607962 A JP S607962A JP 11502983 A JP11502983 A JP 11502983A JP 11502983 A JP11502983 A JP 11502983A JP S607962 A JPS607962 A JP S607962A
Authority
JP
Japan
Prior art keywords
resin
film
curing
curing method
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11502983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0337987B2 (enrdf_load_stackoverflow
Inventor
Hideki Fujiwara
英樹 藤原
Niwaji Majima
庭司 間島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11502983A priority Critical patent/JPS607962A/ja
Publication of JPS607962A publication Critical patent/JPS607962A/ja
Publication of JPH0337987B2 publication Critical patent/JPH0337987B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
JP11502983A 1983-06-28 1983-06-28 樹脂硬化方法 Granted JPS607962A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11502983A JPS607962A (ja) 1983-06-28 1983-06-28 樹脂硬化方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11502983A JPS607962A (ja) 1983-06-28 1983-06-28 樹脂硬化方法

Publications (2)

Publication Number Publication Date
JPS607962A true JPS607962A (ja) 1985-01-16
JPH0337987B2 JPH0337987B2 (enrdf_load_stackoverflow) 1991-06-07

Family

ID=14652453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11502983A Granted JPS607962A (ja) 1983-06-28 1983-06-28 樹脂硬化方法

Country Status (1)

Country Link
JP (1) JPS607962A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63243015A (ja) * 1987-03-13 1988-10-07 ジヨンソン・アンド・ジヨンソン・ベイビー・プロダクツ・カンパニー スキンケア組成物
US6048549A (en) * 1997-12-19 2000-04-11 Johnson & Johnson Consumer Companies, Inc. Powder compositions

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63243015A (ja) * 1987-03-13 1988-10-07 ジヨンソン・アンド・ジヨンソン・ベイビー・プロダクツ・カンパニー スキンケア組成物
US6048549A (en) * 1997-12-19 2000-04-11 Johnson & Johnson Consumer Companies, Inc. Powder compositions
US6426092B1 (en) * 1997-12-19 2002-07-30 Johnson & Johnson Consumer Companies, Inc. Powder compositions comprising a skin irritation reducing agent
US6660304B2 (en) 1997-12-19 2003-12-09 Johnson & Johnson Consumer Companies, Inc Method of treating prickly heat

Also Published As

Publication number Publication date
JPH0337987B2 (enrdf_load_stackoverflow) 1991-06-07

Similar Documents

Publication Publication Date Title
US3985597A (en) Process for forming passivated metal interconnection system with a planar surface
EP0881668A3 (en) Deposition of an electrically insulating thin film with a low dielectric constant
JPS5843453A (ja) ポリイミド材料の食刻方法
JPS5944830A (ja) リフトオフ方法
US3767490A (en) Process for etching organic coating layers
JPS607962A (ja) 樹脂硬化方法
EP0794569A2 (en) Amorphous carbon film, formation process thereof, and semiconductor device making use of the film
JPH0444741B2 (enrdf_load_stackoverflow)
JPS60142545A (ja) 多層複合構造体
JPH08153951A (ja) 樹脂層の形成方法
US4289573A (en) Process for forming microcircuits
US4371565A (en) Process for adhering an organic resin to a substrate by means of plasma polymerized phosphines
JPS61502079A (ja) ポリ(メタクリル酸無水物)レジストを半導体に適用する方法
JPS5952840A (ja) 半導体装置の製造方法
JPH01307227A (ja) 微細加工方法
JPS58223346A (ja) 素子分離領域の形成方法
JPH02173269A (ja) Cvd装置用カーボン治具
JPS62188394A (ja) 導電性フイルムおよびその製造方法
JPH03190128A (ja) パターン形成方法
TW473919B (en) Plasma postprocessing technology of organic low-k material
JPS6060922A (ja) 水ガラスの硬化方法
JPS62214578A (ja) 磁気バブルメモリ素子の作製方法
JP3390647B2 (ja) 半導体素子のスピンオンガラス膜形成方法
JPS62219928A (ja) 絶縁膜の形成方法
JPS5925245A (ja) 半導体装置の製造方法