JPS6076710A - Optical coupling device - Google Patents

Optical coupling device

Info

Publication number
JPS6076710A
JPS6076710A JP58185432A JP18543283A JPS6076710A JP S6076710 A JPS6076710 A JP S6076710A JP 58185432 A JP58185432 A JP 58185432A JP 18543283 A JP18543283 A JP 18543283A JP S6076710 A JPS6076710 A JP S6076710A
Authority
JP
Japan
Prior art keywords
holder
coupling
guide ring
light emitting
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58185432A
Other languages
Japanese (ja)
Inventor
Kuniaki Iwamoto
岩本 邦彬
Masatoshi Saruwatari
猿渡 正俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Nippon Telegraph and Telephone Corp
Original Assignee
NEC Corp
Nippon Telegraph and Telephone Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Telegraph and Telephone Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58185432A priority Critical patent/JPS6076710A/en
Publication of JPS6076710A publication Critical patent/JPS6076710A/en
Pending legal-status Critical Current

Links

Landscapes

  • Led Devices (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To enable fixing of a light emitting element and a coupling element at <=2mum deviation from an optimum adjusting position by fitting loosely the cylindrical part of a holder to the groove part of a guide ring then fixing the guide ring and the holder by the fitted part thereof. CONSTITUTION:A semiconductor laser 1 is melt stuck and fixed via a heat sink 2 to a stem 3 and a guide ring 16 is hermetically fixed thereto. A groove-shaped ring 11 is formed to the ring 16 in such a way that the cylindrical part of a holder 15 fits loosely into said part. The light emitting pattern of a semiconductor laser 1 is monitored with an IR television camera or the like through a coupling element 4 fixed to the holder 15 and the positional relation of the stem 3 and the holder 15 is so adjusted as to maximize the coupling efficiency to a prescribed optical coupler. A solder material 17 is then thermally stuck to the holder 15 by a high frequency coil or the like installed around the holder, thereby fixing the holder.

Description

【発明の詳細な説明】 この発明性、光情報伝送用の光素子と光7アイパーとの
結合装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION This invention relates to a coupling device between an optical element for transmitting optical information and an optical 7-eyeper.

AlGaAsやInGaAsPを母材2した半導体レー
ザや発光ダイオードの開発と相まって低損失光ファイバ
ーの開発は、光7アイバー伝送システムの実用化を著し
く加速した。
The development of low-loss optical fibers, coupled with the development of semiconductor lasers and light-emitting diodes using AlGaAs and InGaAsP as base materials, has significantly accelerated the commercialization of optical fiber transmission systems.

光7アイバー通信システムにおいて半導体レーザや発光
ダイオードから放射した高品質の光ビームを効率よく、
光ファイバーに結合させる方法を開発することは重要な
課題である。このために、光ファイバーの先端を丸めて
レンズ作用をもたせた方式や、発光素子と光7アイバー
の間に球レンズや円柱レンズ等の結合素子を配置する等
の方法が提案されている。これらの結合素子は発光素子
から数μmから数10μm程度の距離まで近接させる必
要があシ、各種の保持・固定方法が採用されている。こ
れらの結合素子を用いて、理論値通りの高い光の結合効
率を得るためには、その位信″決めを極めて高い精度で
行わなければならない。例えば、単一モードで発振して
いる半導体レーザ光を単一モード光7アイパーに結合さ
せる場合、結合効率の低下eldBにおさえるためには
、ビーム出射方向で±201tm程度以内、出射方向と
垂直な面内では±2μm程度以内に結合素子を調整・固
定しなければならない。
Optical 7 Eyebar communication system efficiently uses high-quality light beams emitted from semiconductor lasers and light-emitting diodes.
Developing methods for coupling to optical fibers is an important challenge. For this purpose, methods have been proposed, such as a method in which the tip of the optical fiber is rounded to have a lens effect, and a method in which a coupling element such as a ball lens or a cylindrical lens is placed between the light emitting element and the optical 7 eye bar. These coupling elements must be placed close to the light emitting element within a distance of several micrometers to several tens of micrometers, and various holding and fixing methods are employed. In order to use these coupling elements to obtain a high light coupling efficiency that matches the theoretical value, the position must be determined with extremely high precision.For example, when using a semiconductor laser that oscillates in a single mode, When coupling light into a single mode light 7 eyeper, in order to suppress the coupling efficiency drop to eldB, the coupling element must be adjusted to within about ±201 tm in the beam emission direction and within about ±2 μm in the plane perpendicular to the emission direction.・Must be fixed.

結合素子を1iIAI!・固定する作業は、通常固定さ
れた発光素子にノ…電して発光させ、この発光ビームを
赤外テレビ・カメラで監視するか、又は光ファイバー出
力全測定しながら着脱可能な調整治具にとりつけた結合
素子をx、y、z三軸方向に調整して最適位1〜゛を決
める。そのあとで発光素子と結合素子を保持する各々の
金属部材を半田付や溶接等の手段で固定する方法が採用
されている。このとき、半導体レーザ弄の発光素子は、
ヘキ開で形成した反射面や、p−n接合の路用した部分
が空気中の酸素等で咳化し、動作特性を劣化させ、信頼
性を損なうだめ窒素等の不活性ガス雰囲気中で気Wi刺
止する心安がある。しかるに従来提案されている方法で
−1、半田付や溶接で発光素子と結合素子忙同定する際
、最適調整位置からのズレを数μm以内に保った’! 
マ10−’ atm*cc/see以下の気密を得るこ
と(辻極めて困難でめった。
1iIAI coupling element!・Fixing work is usually done by powering a fixed light emitting element to emit light and monitoring this emitted beam with an infrared television or camera, or by attaching it to a removable adjustment jig while measuring the entire optical fiber output. The coupling element thus obtained is adjusted in the x, y, and z three-axis directions to determine the optimum position 1 to . After that, a method is adopted in which the metal members holding the light emitting element and the coupling element are fixed by means such as soldering or welding. At this time, the light emitting element of the semiconductor laser is
To prevent the reflective surface formed by cleavage and the exposed part of the p-n junction from becoming irritated by oxygen in the air, deteriorating operating characteristics and impairing reliability, do not expose the reflective surface to the exposed part of the p-n junction in an inert gas atmosphere such as nitrogen. There is peace of mind that it will stop. However, with the conventionally proposed method, the deviation from the optimal adjustment position was kept within a few μm when the light emitting element and coupling element were identified by soldering or welding.
Achieving an airtightness of less than 10-' atm*cc/see was extremely difficult and rare.

この発明の目的は、上述の欠点を解決するためになされ
たもので、発光素子と光ファイバーとの結合装置におい
て、発光素子と結合素子を最適調整位置からのズレ紫2
μm以下にして同定できかつ同時に10−” a tm
・cc/sec以下の気密封止を再現性良く実現する結
合装置を提供することにある。
An object of the present invention was to solve the above-mentioned drawbacks, and the purpose of the present invention is to provide a coupling device for a light emitting element and an optical fiber, in which the light emitting element and the coupling element are deviated from the optimal adjustment position.
Can be identified at micrometers or less and at the same time 10-” atm
- It is an object of the present invention to provide a coupling device that realizes airtight sealing of cc/sec or less with good reproducibility.

この発明によれば光素子を採知する基台と、光素子eこ
光学的に結合する結合素子を気密保持するホルダーと、
このホルダーと基台を任意の位置関係に保持固定させる
だめの基台と気密に固定されたガイドリングから成る光
結合装置において、ガイドリンクに溝を形成し、その溝
部とホルダーの筒部がゆるく嵌合するようになっており
、かつに合部でガイドリングと、ホルダーを固定するこ
とを特徴とする光結合装置が得られる。
According to this invention, a base for picking up an optical element, a holder for airtightly holding a coupling element for optically coupling the optical element e,
In this optical coupling device, which consists of a base that holds and fixes the holder and base in an arbitrary positional relationship, and a guide ring that is airtightly fixed, a groove is formed in the guide link, and the groove and the cylindrical part of the holder are loosely connected. An optical coupling device is obtained, which is characterized in that the guide ring and the holder are fitted together, and the guide ring and holder are fixed at the joint.

この発明は、発光素子の材料によらず、かつ半導体レー
ザや発光ダイオードによらず適用できるが、もっとも大
きな効果を与えると考えられる単一モードで発1辰′T
ゐ半導体レーザと単一モード光ファイバーの結合の場合
を中心に図面を参照して詳細に説明する。
This invention can be applied regardless of the material of the light emitting element, and regardless of whether it is a semiconductor laser or a light emitting diode.
A detailed explanation will be given with reference to the drawings, focusing on the case of coupling a semiconductor laser and a single mode optical fiber.

第1図は、従来機業されている結合装置を示す概念的断
面図で、半導体レーザ1はダイヤモンド等からなるヒー
トシンク2を介して、ステム3に融着固定されている。
FIG. 1 is a conceptual cross-sectional view showing a conventional coupling device, in which a semiconductor laser 1 is fused and fixed to a stem 3 via a heat sink 2 made of diamond or the like.

結合素子4(この例では球レンズで図示しである)は、
ホルダー5に気密状態で同定されている。ステム3に気
密状態で固定されたガイドリンク6とホルダー5はゆる
い嵌合状態になっている。ステム3とホルダー5はそれ
ぞれ微動台で保持され(図示せず)、半導体レーザ1の
発光パターンを結合素子4を通して赤外テレビカメラ等
で監視し、所定の光ファイバー(図示せず)への結合効
率が最大になるようにステム3とホルダー5の位置関係
を調整し、ホルダー5の周囲に設置した高周波コイル(
図示せず)で半田材7を加熱m融ぢせることにより最適
状態で固定できるようになっている。半導体レーザ1等
の光半導体素子はヘキ開で形成した反射面や、pn接合
の落出した部分が空気中の酸素で酸化し、動作特性を劣
化なせ、信頼性を損なうため通常屋素等の不活性ガス雰
囲気中で気密封止をする必要がある。しかるに従来方法
においては、半田材7がホルダー5とガイドリング6の
全周を均一に溶融・接着する工夫がないため、球レンズ
4と半導体レーザ1の位−関係を数μmから数10μm
の範囲で微調し半田4月7でそれらの位14関係ケ固定
し、かつ同時に10−8a0−8at/sec以上のス
(密封止金性なうことは憾めて困難であり、その歩留は
著しく小さいという欠点を有していた。
The coupling element 4 (illustrated in this example as a ball lens) is
It is identified in the holder 5 in an airtight state. The guide link 6, which is airtightly fixed to the stem 3, and the holder 5 are loosely fitted. The stem 3 and holder 5 are each held by a fine movement table (not shown), and the emission pattern of the semiconductor laser 1 is monitored with an infrared television camera or the like through the coupling element 4 to determine the coupling efficiency to a predetermined optical fiber (not shown). Adjust the positional relationship between the stem 3 and holder 5 so that the
By heating and melting the solder material 7 (not shown), it is possible to fix the solder material 7 in an optimal state. Optical semiconductor devices, such as semiconductor lasers 1, are usually exposed to the atmosphere because the reflective surface formed by cleavage and the fallen part of the pn junction are oxidized by oxygen in the air, deteriorating the operating characteristics and impairing reliability. It must be hermetically sealed in an inert gas atmosphere. However, in the conventional method, there is no way to uniformly melt and bond the solder material 7 over the entire circumference of the holder 5 and guide ring 6, so the positional relationship between the ball lens 4 and the semiconductor laser 1 is varied from several μm to several tens of μm.
Fine adjustment is made within the range of 14 degrees, and the 14 related parts are fixed with soldering, and at the same time the speed is 10-8a0-8at/sec or more (it is extremely difficult to make a sealing metal, and the yield rate is had the disadvantage of being extremely small.

第2図は、この発明の芙施例r示す概念的断面図で、第
1図と同じ部材については同一番号を附しである。半導
体レーザ1はダイヤモンドやシリコン等からなるヒート
シンク2を介して、ステム3に融着固定されている。結
合素子4(この例では球レンズで示しである)はホルダ
ー15に気密状態で固定されている。このとき艮好な気
密状態を得るためにはホルダー15の材質をコバーとし
低融点ガラスを用いて融着することが好ましい。
FIG. 2 is a conceptual sectional view showing a further embodiment of the invention, in which the same members as in FIG. 1 are given the same numbers. A semiconductor laser 1 is fused and fixed to a stem 3 via a heat sink 2 made of diamond, silicon, or the like. The coupling element 4 (shown as a ball lens in this example) is fixed to the holder 15 in an airtight manner. At this time, in order to obtain a good airtight state, it is preferable that the material of the holder 15 be made of glass and fused using low melting point glass.

ステム3にはガイドリンク16が溶接によって同心状に
固定さ匍、かつ気密状態になっている。ここで特徴的な
点は、ガイドリンク16の上部に図示するような溝状リ
ング11が形成しであることと、ホルダー15の筒部が
前記溝状リング11にゆるく嵌合するようになっており
、かつ円筒中央部で外側にふくらむ形状にしであるとこ
ろにある。
A guide link 16 is fixed concentrically to the stem 3 by welding and is airtight. The characteristic point here is that a grooved ring 11 as shown in the figure is formed on the upper part of the guide link 16, and the cylindrical part of the holder 15 fits loosely into the grooved ring 11. It has a shape that bulges outward at the center of the cylinder.

実際の調整・固定作業は、結合素子4が上になるように
ステム3とホルダー15をそれぞれ微動台に保持して(
図示せず)行なうことが肝要である。この位置関係にお
いてホルダー15の筒部のふくらみ部分の目的の一つは
、別途に形成したリング状半田タプレッ)17が所定の
位置に再現性よくセットすることにある。次に第1図の
例と同様に半導体レーザ1の発光パターンを結合素子4
全通して赤外テレビカメラ等で監視し、所定の光ファイ
バー(図示せず)への結合効率が最大になるようにステ
ム3とホルダー15の位置関係を調整し、ホルダー15
の周囲に設置した高周波コイル(図示せず)等で半田材
17を加熱浴融させる。
The actual adjustment and fixing work is carried out by holding the stem 3 and holder 15 on the fine movement table with the coupling element 4 facing upward (
(not shown) is essential. In this positional relationship, one of the purposes of the bulging portion of the cylindrical portion of the holder 15 is to set the separately formed ring-shaped solder taplet 17 in a predetermined position with good reproducibility. Next, similarly to the example in FIG.
The entire passage is monitored with an infrared television camera, etc., and the positional relationship between the stem 3 and the holder 15 is adjusted so that the coupling efficiency to a predetermined optical fiber (not shown) is maximized.
The solder material 17 is melted in a heating bath using a high frequency coil (not shown) installed around the solder material 17.

ホルダー15の筒部のふくらみの他の目的は、溶融した
半田材17がガイドリング16及びホルダー15の間隙
に均−溶は落ちることにある。このときガイドリング1
6及びホルダー15の金属部に良質の金メッキを施こす
ことにより、加熱溶融された1個分の半田リング17が
、ホルダーとガイドリンクの間を均一に濡らす確率は4
〜5倍に改善され、50個試作したところ130個は1
0−810−8at/secの気密状態が得られた。次
に半田リング17を2個にしたところ、溶けた半田材は
溝11にたまる状態になり、100−8at*cc/s
ec以上の気密状態が得られる割合は90%以上と著し
く改善されることがわかった。このとき、発光素子1と
結合素子4の間の微調作朶は第1図の場合と全く同様に
できるので、高い気密性と高精度の位置調整が必要とさ
れる単一モード光ファイバー用の光結合装置が高い歩留
りで再現性よく得られるようになった。
Another purpose of the bulge in the cylindrical portion of the holder 15 is to allow the molten solder material 17 to fall uniformly into the gap between the guide ring 16 and the holder 15. At this time, guide ring 1
By applying high-quality gold plating to the metal parts of the holder 6 and the holder 15, the probability that one heated and melted solder ring 17 will evenly wet the space between the holder and the guide link is 4.
It has been improved by ~5 times, and when 50 prototypes were produced, 130 were 1
An airtight state of 0-810-8 at/sec was obtained. Next, when the number of solder rings 17 was changed to two, the melted solder material accumulated in the groove 11, and the rate was 100-8 at*cc/s.
It was found that the rate of achieving an airtight state of ec or higher was significantly improved to 90% or more. At this time, the fine adjustment between the light emitting element 1 and the coupling element 4 can be made in exactly the same way as in the case of Fig. 1, so that the light for single mode optical fibers, which requires high airtightness and high precision position adjustment, Coupling devices can now be obtained with high yield and good reproducibility.

以上発光素子1及び結合素子4として、半導体レーザ及
び球レンズの場合を中心にしてこの発明について説明し
”T−pitが、この他に発光素子としては発光ダイオ
ード、結合素子としてはロッドレンズや収束性ロフトレ
ンズ等にも使用できることはいうまでもない。また本発
明の実施例では光素子としてづ^光素子を例として説明
しだが、公知の受光素子を用いても良い。
The present invention has been explained above mainly using a semiconductor laser and a ball lens as the light emitting element 1 and the coupling element 4. Needless to say, the present invention can also be used for optical loft lenses, etc. In the embodiments of the present invention, an optical element is used as an example of an optical element, but a known light-receiving element may also be used.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、従来提案されている結合装置ケ示す概念的断
面図、第2図は、この発明の実施例を示す概念的断面図
である。ここで、1は半導体レーザ、2はヒートシンク
、3はステム、4は球レンズ、5,15けホルダー、6
,16はガイドリング、7.17は半田材、11は溝状
リングを示す。
FIG. 1 is a conceptual sectional view showing a conventionally proposed coupling device, and FIG. 2 is a conceptual sectional view showing an embodiment of the present invention. Here, 1 is a semiconductor laser, 2 is a heat sink, 3 is a stem, 4 is a ball lens, 5, 15 holder, 6
, 16 is a guide ring, 7.17 is a solder material, and 11 is a grooved ring.

Claims (1)

【特許請求の範囲】[Claims] 光素子を保持する基台と、前記光素子に光学的に結合す
る結合素子を気密保持するホルダーと、該ホルダーと前
dC基台を任意の位置関係に保持固定させるだめの前記
基台と気密に固定されたガイドリングから成る光結合装
置忙おいて、前記ガイドリングに溝を形成し、咳溝部と
、前記ボルダ−の筒部がゆるく嵌合するようになってお
りがっ嵌合部で前記ガイドリングと、前記ホルダーを固
定することを特徴とする光結合装倣。
a base for holding an optical element; a holder for airtightly holding a coupling element optically coupled to the optical element; and an airtight seal for holding and fixing the holder and the front dC base in an arbitrary positional relationship. In the optical coupling device, a groove is formed in the guide ring, and the groove part and the cylindrical part of the boulder are loosely fitted together. An optical coupling arrangement characterized in that the guide ring and the holder are fixed.
JP58185432A 1983-10-04 1983-10-04 Optical coupling device Pending JPS6076710A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58185432A JPS6076710A (en) 1983-10-04 1983-10-04 Optical coupling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58185432A JPS6076710A (en) 1983-10-04 1983-10-04 Optical coupling device

Publications (1)

Publication Number Publication Date
JPS6076710A true JPS6076710A (en) 1985-05-01

Family

ID=16170680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58185432A Pending JPS6076710A (en) 1983-10-04 1983-10-04 Optical coupling device

Country Status (1)

Country Link
JP (1) JPS6076710A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4769684A (en) * 1987-07-07 1988-09-06 Rca Inc. Angle mount header
US5916458A (en) * 1995-08-31 1999-06-29 Fujitsu Limited Production of optical module assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4769684A (en) * 1987-07-07 1988-09-06 Rca Inc. Angle mount header
US5916458A (en) * 1995-08-31 1999-06-29 Fujitsu Limited Production of optical module assembly

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