JPS6076709A - Optical coupling device - Google Patents

Optical coupling device

Info

Publication number
JPS6076709A
JPS6076709A JP58185431A JP18543183A JPS6076709A JP S6076709 A JPS6076709 A JP S6076709A JP 58185431 A JP58185431 A JP 58185431A JP 18543183 A JP18543183 A JP 18543183A JP S6076709 A JPS6076709 A JP S6076709A
Authority
JP
Japan
Prior art keywords
lens
holder
stem
coupling element
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58185431A
Other languages
Japanese (ja)
Other versions
JPH0827422B2 (en
Inventor
Kuniaki Iwamoto
岩本 邦彬
Masatoshi Saruwatari
猿渡 正俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Nippon Telegraph and Telephone Corp
Original Assignee
NEC Corp
Nippon Telegraph and Telephone Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Telegraph and Telephone Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP18543183A priority Critical patent/JPH0827422B2/en
Publication of JPS6076709A publication Critical patent/JPS6076709A/en
Publication of JPH0827422B2 publication Critical patent/JPH0827422B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To enable fixing of a light emitting element and a coupling element at <=1mum deviation from an optimum adjusting position by the constitution in which the coupling element is held by a holder consisting of a plastic material so as to be coupled optically to a photoelectric transducer and these elements are sealed in a hermetic case provided with window pane. CONSTITUTION:A spherical lens 4 is thermocompression bonded to a stem 3 via a holder 5' and a cap 8 is provided on the outside thereof to seal hermetically the lens against the external air. Window pane 9 on which an antirefleting film is formed is attached to the cap 8 in the exit direction of light to constitute an optical coupling device. The holder 5 is preliminarily fixed to the stem 3 by thermocompression bonding or the like at about 100mum mechanical accuracy and thereafter the position of the lens 4 is adjusted to an optimum state while the light emitting pattern of a semiconductor laser 1 is monitored by an IR television camera or the like through the coupling element 4. The holder 5' consists of a plastic metal and therefore the position of the lens 4 is easily adjustable even after the lens is fixed to the stem 3. The lens is subjected to work hardening after the adjustment, by which the mechanical strength is increased.

Description

【発明の詳細な説明】 この発明は光結合装置に関し、とくに光情報伝送用の光
電変換素子と光7アイバーとの結合装置に関するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optical coupling device, and more particularly to a coupling device between a photoelectric conversion element and an optical 7-eye for optical information transmission.

A I Ga AsやInGaAsPを母材とした半導
体レーザや発光ダイオードの開発と相まって、低損失光
ファイバーの開発は、光フアイバー伝送システムの実用
化を著しく加速した。
The development of low-loss optical fibers, coupled with the development of semiconductor lasers and light-emitting diodes using AI GaAs and InGaAsP as base materials, has significantly accelerated the commercialization of optical fiber transmission systems.

光フアイバー通信システムにおいて半導体レーザや発光
ダイオードから放射した高品質の光ビームを効率よく、
光ファイバーに結合させる方法を開発する仁とは重要な
課題でちる。このために、光ファイバーの先端を丸めて
レンズ作用をもたせた方式や、発光素子と光ファイバー
の間に球レンズや円柱レンズ等の結合素子を配置する等
の方法が提案されている。仁れらの結合素子は発光素子
から数μmから数10μm程度の距離まで近接させる必
要があり、各種の保持・固定方法が採用されている。こ
れらの結合素子を用いて、理論値通りの高い光の結合効
率を得るためには、その位置決めを極めて高い精度で行
わなければならない。
In optical fiber communication systems, high-quality light beams emitted from semiconductor lasers and light-emitting diodes can be efficiently
Jin is developing a method to connect optical fibers, which is an important issue. To this end, methods have been proposed, such as a method in which the tip of the optical fiber is rounded to have a lens effect, and a method in which a coupling element such as a spherical lens or a cylindrical lens is placed between the light emitting element and the optical fiber. The coupling element of Nire et al. needs to be placed close to the light emitting element within a distance of several micrometers to several tens of micrometers, and various holding and fixing methods are employed. In order to use these coupling elements to obtain a high light coupling efficiency in accordance with the theoretical value, their positioning must be performed with extremely high precision.

例えば単一モードで発振している半導体レーザ光を、単
一モード光ファイバーに結合させる場合、結合効率の低
下を1dBにおさえるためにはビーム出射方向で±20
μm程度以内、出射方向と垂直な面内では、±2μm程
度以内に結合素子を調整−固定しなければならない。
For example, when coupling a semiconductor laser beam oscillating in a single mode to a single mode optical fiber, in order to suppress the decrease in coupling efficiency to 1 dB, it is necessary to
The coupling element must be adjusted and fixed within about μm, and within about ±2 μm in a plane perpendicular to the emission direction.

結合素子を調整2固定する作業は通常、固定された発光
素子に通電して発ブCさ亡、この発光ビームを赤外テレ
ビ・カメラで監視するか、又は光フアイバ出力を測定し
ながら着脱可能なこ1整治具にと9つけた結合素子をx
+ )’+ z三軸方向に調整して、最適位置を決める
。このとき、発光素子と結合素子を半田付や、溶接で固
定可能な金属部材にとりつけて2〈ことにより、最適1
i11整位置のまま固定できるはずである。しかるに、
実際実験を行なってみると、半田付や溶接で固定する際
、接着時の温度間化のため、最適v1整位置から数/Z
ln程度の位置ズレが生ずる。
The work of adjusting and fixing the coupling element is usually done by energizing the fixed light emitting element to stop it from emitting C, and then monitoring this emitted beam with an infrared television or camera, or attaching and detaching it while measuring the optical fiber output. The coupling element attached to Nako1 adjustment jig and 9
+ )' + Z Adjust in the three axes directions to determine the optimal position. At this time, the light emitting element and the coupling element are attached to a metal member that can be fixed by soldering or welding.
It should be possible to fix it in the i11 position. However,
In actual experiments, when fixing by soldering or welding, due to the temperature difference during bonding, the number/Z
A positional shift of about ln occurs.

この発明の目的は、以上の欠点を解決するためになされ
たものでるシ発光素子と光ファイバーとの結合装置にお
いて、発光素子と結合素子を最適調整位置からのズレを
1μn以下にして固定でき。
SUMMARY OF THE INVENTION An object of the present invention is to provide a coupling device for a light emitting element and an optical fiber, which has been made in order to solve the above-mentioned drawbacks, in which the light emitting element and the coupling element can be fixed with a deviation of 1 .mu.n or less from the optimum adjustment position.

高い結合効率會再現性良く実現する結合装置を提供する
ことにある。
The object of the present invention is to provide a coupling device that achieves high coupling efficiency and good reproducibility.

この発明によれば、光電変換素子を保持する基台と、光
電変換素子に光学的に結合する結合素子を保持するホル
ダーと、光電変換素子及び結合素子を外気から密封する
窓ガラス付気密容器から成る光結合装置において、前記
結合素子を保持するホルダー材料が可塑性金属から成っ
ていることを特徴とする光結合装置が得られる。
According to this invention, there is provided a base for holding a photoelectric conversion element, a holder for holding a coupling element optically coupled to the photoelectric conversion element, and an airtight container with a window glass for sealing the photoelectric conversion element and coupling element from outside air. An optical coupling device is obtained, characterized in that the holder material holding the coupling element is made of a plastic metal.

この発明は、発光素子の材料によらず、かつ半導体レー
ザや発光ダイオードによらず適用できるが、もっとも大
きな効果を与えると考λ−られる単一モードで発振する
半導体レーザと単一モード光ファイバーの結合の場合を
中心に図面を参照して詳細に説明する。
Although this invention can be applied regardless of the material of the light emitting element and regardless of the semiconductor laser or light emitting diode, the combination of a semiconductor laser that oscillates in a single mode and a single mode optical fiber is considered to have the greatest effect. The case will be explained in detail with reference to the drawings.

第1図は、従来提案されている、結合装置を示す概念的
断面図で、半導体レーザ1はダイヤモンド等からなるヒ
ートシンク2を介して、ステム3に融着固定されている
。結合素子4(この例では球レンズで図示しである〕は
、ホルダー5にハーメチックに固定されている。ステム
3にバーメチ、りに固定されたガイドリング6とホルダ
ー5はゆるい嵌合状態になっている。ステム3とホルダ
ー5は、それぞれ微動台で保持され(図示せず)、半導
体レーザ1の発光パターンを結合素子4を通して赤外テ
レビカメラ等で監視し、所定の光ファイバー(図示せず
)への結合効率が最大になるようにステム3とホルダー
5の位置関係を調整し、そのままの状態で半田材7を加
熱溶融させることによシ、最適状態で固定できるように
なっている0半導体レーザ1等の光半導体素子は、ヘキ
開で形成した反射面や、p”−”接合の露出した部分が
空気中の酸素で酸化し、動作特性を劣化させ、信頼性を
損なうため通常窒素等の不活性ガス雰囲気中でハーメチ
ックシールする必要がある。しかるに従来方法において
は、球レンズ4とホルダー5の固定をハーメチックにか
つ十分な強度で行なうことは容易でない。又、球レンズ
4と半導体レーザ1の位置関係を数μmnから数10μ
mの範囲で微調し半田材7でそれらの位置関係を固定し
かつこの時、同時にバーメチ、クシールすることは極め
て困難であゃ、その歩留は著しく小さいという欠点を有
していた。
FIG. 1 is a conceptual cross-sectional view showing a conventionally proposed coupling device, in which a semiconductor laser 1 is fused and fixed to a stem 3 via a heat sink 2 made of diamond or the like. The coupling element 4 (shown as a ball lens in this example) is hermetically fixed to the holder 5. The guide ring 6, which is fixed to the stem 3 by a bar, and the holder 5 are loosely fitted. The stem 3 and the holder 5 are each held by a fine movement table (not shown), and the emission pattern of the semiconductor laser 1 is monitored with an infrared television camera or the like through the coupling element 4, and a predetermined optical fiber (not shown) is connected to the stem 3 and the holder 5. By adjusting the positional relationship between the stem 3 and the holder 5 so as to maximize the coupling efficiency to the holder 5, and by heating and melting the solder material 7 in that state, the solder material 7 can be fixed in an optimal state. Optical semiconductor devices such as the laser 1 are usually exposed to nitrogen, etc. because the reflective surface formed by cleavage and the exposed part of the p"-" junction are oxidized by oxygen in the air, deteriorating operating characteristics and impairing reliability. However, in the conventional method, it is not easy to fix the ball lens 4 and the holder 5 hermetically and with sufficient strength. 1 positional relationship from several μm to several tens of μm
If it is extremely difficult to make fine adjustments within the range of m, fix their positional relationship with the solder material 7, and simultaneously perform barmetching and sealing at the same time, there is a drawback that the yield is extremely low.

第2図はこの発明の一実施例を示す概念的断面図であシ
、第1図と同一部材については、同一の番号を附しであ
る。球レンズ4はホルダー5′を介して、ステム3に熱
圧着されており、さらにその外側に、キャップ8があシ
光の出射方向には、反射防止膜の施された窓ガラス9が
とり付けである。ここでホルダー5′は例えば無酸素銅
等の可塑性金属から成シ、かつ3本足又は5本足状の構
造になっている。この構造において、予しめ100μm
程度の機械精度で、ホルダー5′をステム3に熱圧着等
で固定しておき、その後、第1図の場合と同称に半導体
レーザ1の発光パターンを結合素子4を通して赤外テレ
ビカメラ等で監視しながら、球レンズ4の位置を最適状
態に調整する。この時、ホルダー5′は無酸素銅等の可
塑性金属からなシ、かつ3本足構造になっているため、
足がステム3に固定された後でも球レンズ4の位置は容
易に調整でき、かつ調整した後は加工硬化によって機械
的強度が増えるといった特徴も有している。v!I整で
きる範囲は、光の出射方向で20〜30μm1光の出射
方向と垂直な面内方向で100μm程度”まで調整でき
、得られた結合効率は最適状態と比較して、0.5dB
以下の劣化にすることができた。
FIG. 2 is a conceptual sectional view showing one embodiment of the present invention, and the same members as in FIG. 1 are given the same numbers. The ball lens 4 is thermocompression bonded to the stem 3 via a holder 5', and a cap 8 is formed on the outside of the lens 4, and a window glass 9 coated with an anti-reflection film is attached in the light emission direction. It is. The holder 5' is made of a plastic metal such as oxygen-free copper, and has a three-legged or five-legged structure. In this structure, 100 μm
The holder 5' is fixed to the stem 3 by thermocompression bonding or the like with a certain level of mechanical precision, and then the light emitting pattern of the semiconductor laser 1 is passed through the coupling element 4 using an infrared television camera or the like in the same manner as in the case of FIG. The position of the ball lens 4 is adjusted to the optimum state while monitoring. At this time, since the holder 5' is not made of plastic metal such as oxygen-free copper and has a three-legged structure,
Even after the foot is fixed to the stem 3, the position of the ball lens 4 can be easily adjusted, and after adjustment, the mechanical strength is increased by work hardening. v! The range in which I can be adjusted is 20 to 30 μm in the light output direction, and approximately 100 μm in the in-plane direction perpendicular to the light output direction, and the obtained coupling efficiency is 0.5 dB compared to the optimal state.
The following deterioration could be achieved.

ホルダー5′は、密封ができない構造になっているため
、その外側に、密封用のキャップ8を熱圧着等で、ハー
メチックにステム3に封着する。
Since the holder 5' has a structure that cannot be sealed, a sealing cap 8 is hermetically sealed to the stem 3 on the outside by thermocompression bonding or the like.

光の出射方向には、反射防止)摸が施された窓ガラス9
が、密封型でと9付けてあり、窓ガラス9を通して出射
した光ビームを、光ファイバー等の任意の光学翠子(図
示せず)に結合できるようになっている。
In the direction of light emission, there is a window glass 9 with anti-reflection coating.
However, it is a sealed type and is marked 9, so that the light beam emitted through the window glass 9 can be coupled to any optical fiber (not shown) such as an optical fiber.

この構造による結合装置は、機械強度試験においても良
好な結果を示し、例えば100Gの加速試験や1mの落
下試験及び0〜100℃の温度サイクル試験においても
、光ビームの軸ズレは観測されず、結合効率の劣化も生
じなかった。又、0〜50℃の温度範囲で光ビームのズ
レは極めて小さく実用装置での問題は発生しなかった。
The coupling device with this structure also showed good results in mechanical strength tests, and for example, no axis deviation of the light beam was observed in 100G acceleration tests, 1m drop tests, and 0 to 100°C temperature cycle tests. No deterioration of coupling efficiency occurred. Further, the deviation of the light beam was extremely small in the temperature range of 0 to 50°C, and no problems occurred in practical equipment.

このように、結合素子を#ll械的にとシ付けた後で、
材料の可塑性を利用して微調整を行ない、これとは別に
設けたキャップによって、密封する構造にしたことで、
高N度R整の工数を著しく短縮できかつ、製造歩留は、
結合素子の無い単品とほぼ同じ値まで高くすることがで
きた。
In this way, after mechanically attaching the coupling elements,
By making fine adjustments using the plasticity of the material and creating a sealing structure with a separate cap,
The man-hours for high N degree R adjustment can be significantly reduced, and the manufacturing yield is
We were able to raise the value to almost the same as a single product without a coupling element.

以上発光素子と結合素子を半導体レーザと球レンズと[
7た場合について詳細に説明してきたが、この発明は他
の発光素子、例えば端面発光型及び表面発光型発光ダイ
オードにも適用できるとともに、球レンズの代わりに円
柱レンズ等の他の結合素子にも適用できることはいうま
でもない。
The above light emitting element and coupling element are combined into a semiconductor laser, a ball lens and [
Although the present invention has been described in detail for the case of 7, the present invention can also be applied to other light emitting devices, such as edge emitting type and surface emitting type light emitting diodes, and also to other coupling elements such as a cylindrical lens instead of a ball lens. Needless to say, it is applicable.

また本発明の装置によれば、発光素子の代わりに受光素
子を配置することも考えられる。したがって光II変換
素子と光ファイバーとの光結合装置として本発明は有益
である。
Further, according to the device of the present invention, it is also possible to arrange a light receiving element instead of the light emitting element. Therefore, the present invention is useful as an optical coupling device between a light II conversion element and an optical fiber.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、従来提案されている結合装置を示す概念的断
面図、第2図は、この発明の一実施例を示す概念的断面
図である。 1・・・・・・半導体レーザ、2・・・・・・ヒートシ
ンク、3・・・・・・ステム、4・・・・・・結合素子
、5.5’・・・・・・ホルダー、6・・・・・・ガイ
ドリング、7・・・・・・半田材、8・・・・・・ギャ
ップ、9・・・・・・窓ガラス。 、・′−゛− 第2 図
FIG. 1 is a conceptual sectional view showing a conventionally proposed coupling device, and FIG. 2 is a conceptual sectional view showing an embodiment of the present invention. 1...Semiconductor laser, 2...Heat sink, 3...Stem, 4...Coupling element, 5.5'...Holder, 6...Guide ring, 7...Solder material, 8...Gap, 9...Window glass. ,・′−゛− Figure 2

Claims (1)

【特許請求の範囲】[Claims] 光電変換素子を保持する基台と、前記光電変換素子に光
学的に結合する結合素子を保持するホルダーと、前記光
電変換素子及び結合素子を外気から密刺する窓ガラス付
気密容器から成る光結合装置において、前記結合素子を
保持するホルダー材料が可塑性金属から成っていること
を特徴とする光結合装置。
An optical coupling consisting of a base that holds a photoelectric conversion element, a holder that holds a coupling element that optically couples to the photoelectric conversion element, and an airtight container with a window glass that protects the photoelectric conversion element and coupling element from outside air. An optical coupling device characterized in that the holder material holding the coupling element is made of a plastic metal.
JP18543183A 1983-10-04 1983-10-04 Optical coupling device Expired - Lifetime JPH0827422B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18543183A JPH0827422B2 (en) 1983-10-04 1983-10-04 Optical coupling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18543183A JPH0827422B2 (en) 1983-10-04 1983-10-04 Optical coupling device

Publications (2)

Publication Number Publication Date
JPS6076709A true JPS6076709A (en) 1985-05-01
JPH0827422B2 JPH0827422B2 (en) 1996-03-21

Family

ID=16170662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18543183A Expired - Lifetime JPH0827422B2 (en) 1983-10-04 1983-10-04 Optical coupling device

Country Status (1)

Country Link
JP (1) JPH0827422B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4811350A (en) * 1986-08-05 1989-03-07 Sharp Kabushiki Kaisha Semiconductor laser apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896505U (en) * 1981-12-22 1983-06-30 日立電線株式会社 optical coupler
JPS58105514U (en) * 1982-01-12 1983-07-18 アンリツ株式会社 Optical communication component fixing device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896505U (en) * 1981-12-22 1983-06-30 日立電線株式会社 optical coupler
JPS58105514U (en) * 1982-01-12 1983-07-18 アンリツ株式会社 Optical communication component fixing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4811350A (en) * 1986-08-05 1989-03-07 Sharp Kabushiki Kaisha Semiconductor laser apparatus

Also Published As

Publication number Publication date
JPH0827422B2 (en) 1996-03-21

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