JPS60102604A - Manufacture device of optical coupling device - Google Patents

Abstract

PURPOSE:To adjust and fix with a high accuracy an optical element and a coupling element, also to raise workability and reproducibility of a soldering work, and to form a uniform adhesive strength by using a high temperature gas flow or laser light, as a solder melting means. CONSTITUTION:A nozzle 8 is made so as to coincide with the number and position of a hole 5 of the upper part of a coupling element holder 4, and also a heated nitrogen gas is made to flow into a pipe 9 so that the heated nitrogen gas, etc. are jetted through the nozzle 8. By this jet air current, a solder grain 6 can be heated and melted locally. In this case, when each member is brought to auxiliary heating through a jig with a manipulator for holding a stem 1 and the coupling holder 4, a larger effect is brought on in order to not only shorten a work time but also increase a solder adhesive strength and raise a uniformity. According to this device, no jig contacts to a solder material, and a soldering work can be executed by no-contact, therefore, an accuracy for adjusting and fixing a relative position of a light emitting element and a coupling element 3 is improved, and also a remarkable effect is obtained in the workability and uniformity, too.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a coupling device for optical information transmission between an element and an optical 7-eye.

The development of low-loss optical fibers, coupled with the development of AA'GaAs x InGaAsP f matrix semiconductor lasers and light-emitting diodes, has significantly accelerated the transformation of the original fiber transmission system.

High-quality light beams emitted from semiconductor lasers and light-emitting diodes are efficiently converted into one beam in the optical 7-eye bar multiplication system.
It is important to develop a method for bonding to the original fiber! There is one question. For this.

Methods have been proposed, such as rounding the tip of the optical fiber to give it a lens effect, and arranging all coupling elements such as ball lenses or cylindrical lenses between elements such as light-emitting elements and light-receiving elements and the original fiber. . These coupling cords are optical elements′/
Because of this, it is necessary to place the metals close to each other at a distance of several micrometers to several 10 micrometers, and various methods of holding and fixing are employed.

Using these coupling elements, in order to obtain the original coupling efficiency as high as the general value, what is the positioning? This must be done with extremely high precision. For example, when coupling four-cow laser beams oscillating in a single mode to a single-mode original fiber, K should be within ±20 μm in the beam emission direction, just below the coupling efficiency (to suppress it to 1 dB, In a plane perpendicular to , the coupling turret must be fully adjusted and fixed within ±2 μmd degrees.Hereinafter, two examples will be explained in the case of a light emitting device as an element.

The work of adjusting and fixing the coupling element is usually done by energizing the fixed light emitting element to emit light, monitoring the emitted beam with a full infrared television camera, or by measuring the optical fiber output while making adjustments that can be noticed. Coupling element 'kx' attached to the jig
Adjust in the three axial directions to determine the optimal position. After that, a method is adopted in which the light emitting element and the coupling element are fixed by means such as welding or attaching metal members to the metal members that hold the light emitting element and the coupling element.

However, in the welding method, the material is deformed during welding, and the position of the coupling element often moves by about 10-odd micrometers, making it unsuitable when fixation must be performed with an accuracy of several micrometers or less. I understand. On the other hand, in the case of Ushida attachment, the total positional variation of the coupling element can be kept to 1 μm or less by firmly fixing each member when fixing the solder, although the method of attachment is slightly different. For this reason, a method using a soldering IC is often adopted, and in order to melt the solder material, heating means such as high frequency heating or a normal soldering iron are used. However, it is not easy to adjust the relative positions of the light emitting element and the coupling element with an accuracy of less than a total number of micrometers, and to heat and melt all of the predetermined solder material while firmly fixing it in that state.

For example, in the case of high frequency heating method, 5 light emitting elements and a confectionery?
The heating state of the solder material is affected by the adjustment and fixing jig, making it difficult to obtain a uniform fusion state.

On the other hand, the method using a soldering iron requires a jig to adjust and fix the valley element, and the position of the solder material can be easily adjusted, so the arbitrary influence on the heated part can be considerably reduced. Thin materials tend to react with the soldering material, and as a result, the shape of the iron tip is easily deformed, which drastically reduces the workability and reproducibility of soldering work performed on minute parts, and reduces the bond strength. There was also a problem with reality.

The purpose of the present invention was to solve the above-mentioned drawbacks, and to provide a bonding device for optical elements and optical fibers.
The relative position a of the optical element and the coupling element can be adjusted and fixed with high accuracy, and the soldering work can be performed with uniform reproducibility and uniform J.
An object of the present invention is to provide a bonding device manufacturing device that realizes k-layer strength.

Fuenimei is characterized by the use of a hot gas stream or a laser source as the Hirata bath melting means.

This invention can be applied regardless of the material of the element and regardless of the semiconductor laser or light emitting diode.

The biggest effect? The case of coupling between a semiconductor laser that oscillates in a single mode and a single-mode source fiber will be described in detail with reference to one plane at the center of the entire structure.

FIG. 1 is a conceptual perspective view of a bonding device for explaining the entire manufacturing device of a bonding device using a soldering iron, which has been proposed in the past. ) is attached, and the auxiliary ring 2 is attached coaxially with this. The coupling element holder 4 has a coupling element 3 such as a spherical lens with a diameter of 0.5 to 1.5 mm installed in advance in the center, and a jig with a mani-epilator (not shown in the figure) provided separately. ) by
The relative position of the light emitting element and the coupling element 3 is ± between all beam emission directions.
Within about 20μm, ±2μm in the plane perpendicular to the exit direction
- A hole 5 with a diameter of about 1 mm is bored on the upper outer periphery of the coupling element holder 4, into which a solder grain 6 can be set.

This solder grain 6 is made into an A diameter so that the tip fits into the hole.
Further, the fine-adjustment resistor (not shown) is heated and melted by a soldering god 7 having λ' and 1ζ. At this time, the stem 1 and the coupling element holder 4 are fixed by the above-mentioned jig with a remanipulator, so after the solder grains 6 are uniformly melted,
By quickly moving the soldering iron 7, the shift in the pairwise positional relationship between the light emitting element and the coupling element 3 can be made negligibly small, and the laser beam is converted into parallel light and becomes a single beam. It is possible to efficiently couple light to an optical line such as a mode fiber. However, materials such as copper that have high thermal conductivity are normally used for the soldering iron 7, but these materials do not cause chemical reactions with the soldering material. Riya Ding.

As a result, the shape of the iron tip may be distorted or distorted. Particularly (C) It has been found that deformation of the tip of a thinner soldering iron as in this case significantly reduces the uniformity and reproducibility of soldering work, and also greatly impedes the reproducibility of the contact strength. Fig. 2 is a conceptual perspective view of a coupling device for assembling an embodiment of the present invention, in which the same members as in Fig. 1 are given the same numbers.The configuration of each part is shown in Fig. 1. It's almost the same, except that instead of the soldering iron 7, there's a nozzle 8 and a gold-filled pipe 9.
This is something I use completely. The nozzles 8 are made so that the number and position of the holes 5 in the upper part of the coupling element holder 4 match.

In this pipe 9, a diaphragm gas heated to 200° C. or higher is completely flowed, and heated nitrogenous gas or the like is jetted through a nozzle 8. The entire solder grain 6 can be locally heated and melted by this jet stream. At this time, it is better to use a jig with a manipulator (lA not shown) to hold the entire stem l and coupling element holder 4 and perform auxiliary heating on all of the parts, which will not only shorten the working time but also increase the solder bond strength and improve uniformity. 9. With this manufacturing equipment, there are no jigs that come into contact with the solder material, which has a great effect on 9. No contact,
Since soldering work can now be performed, the accuracy of adjusting and fixing the relative position of the light emitting element and the coupling element 3 has been improved, as well as
Significant effects were also obtained in terms of workability and uniformity.

As mentioned above, we have described how to manufacture a coupling device with excellent reproducibility Ic using a jet stream system with surface temperature. A method of using an oscillation or pulse oscillation light source to insulate the original fiber can also achieve the same workability, reproducibility, and adhesive strength as this invention.

In addition, although the VC of the present invention has been explained in the case of a semiconverter laser and a ball lens as the light emitting C element and the coupling element 3, in addition to this, an original photodiode may be used as the light emitting element, and a Rondo lens may be used as the coupling element. Needless to say, it can also be used for convergent rod lenses.

[Brief explanation of the drawing]

Fig. 1 is a conceptual perspective view of a coupling device for explaining a conventionally proposed coupling device manufacturing device, and Fig. 2 is a conceptual perspective view of a coupling device for explaining the actual/A911k of the present invention. It is. Here, 1 is the stem, 2 is the auxiliary ring, and 3
4 is a coupling element, 4 is a coupling element holder, 5 is a hole, 6 is a solder grain, 7 is a soldering iron, 8 is a nozzle, and 9 is a pipe.

Claims (1)

[Claims] In optical coupling device manufacturing equipment in which the relative positions of optical elements and coupling elements are fully adjusted and fixed by soldering, the solder material is heated and melted without contact using a high-temperature gas flow or laser light. Optical coupling device V manufacturing equipment.