JPS61239209A - Production of semiconductor laser and optical fiber coupling device - Google Patents

Production of semiconductor laser and optical fiber coupling device

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Publication number
JPS61239209A
JPS61239209A JP8053685A JP8053685A JPS61239209A JP S61239209 A JPS61239209 A JP S61239209A JP 8053685 A JP8053685 A JP 8053685A JP 8053685 A JP8053685 A JP 8053685A JP S61239209 A JPS61239209 A JP S61239209A
Authority
JP
Japan
Prior art keywords
optical fiber
semiconductor laser
fixing member
laser
coupling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8053685A
Other languages
Japanese (ja)
Inventor
Kazuo Toda
戸田 和郎
Satoshi Ishizuka
石塚 訓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8053685A priority Critical patent/JPS61239209A/en
Publication of JPS61239209A publication Critical patent/JPS61239209A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To improve the mass-productivity by sticking the first fixing member fixing a semiconductor laser and a lens and the second fixing member fixing a ferrule,where a fiber is stored, in such positions with a resin that the coupling efficiency is maximum and subjecting them to laser welding. CONSTITUTION:A semiconductor laser 2 and a lens holder 6 of a lens 5 are stuck to a package system to form the first fixing member. A ferrule 8 holding an optical fiber jacket 10 whose optical fiber strand 9 is exposed is adhered to a ferrule holder 7 with a resin 11 to form the second fixing member. The first and the second fixing members are adjusted finely in (x), (y), and (z) directions to attain positions of maximum coupling efficiency, and parts A and B are adhered with a resin, and they are stuck by laser welding. Thus, the degradation of the coupling efficiency during production is prevented to improve the mass-productivity.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は半導体レーザを光ファイバに結合する装置の製
造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a device for coupling a semiconductor laser to an optical fiber.

従来の技術 従来、半導体レーザと光ファイバを結合する装置として
は種々のものが考えられておシ、代表的なものの構造の
縦断面図を第3図に示す。第3図において1はパッケー
ジステム、2は半導体レーザ、3はモニタ用受光素子、
4は電極、6は球レンズ、6はレンズホルダ、7はフェ
ルールホルダ、8はフェル−!、9は光ファイバ素線、
1oは光ファイバジャケットである。この構造は光軸を
中心とした同心円筒形を基本としている。この結合装置
の製造方法としては、まず球レンズ6をレンズホルダ6
に固定し、このレンズ付ホルダをあらかじめ半導体レー
ザ2が固定されたパッケージステム1にはめ込み固定す
る。球レンズ5のレンズホルダ6への固定は樹脂接着、
ロウ付、ハンダ付等のいずれかによる。またレンズホル
ダ6のパッケージステム1への固定は樹脂接着、抵抗溶
接等のいずれかによるものである。球レンズ6の光軸ず
れにg集光ビームの角度ずれが起こり、結合効率が劣化
するが、半導体レーザ2の発光中心の位置精度が±10
0μm以内ならば、パッケージステム1.レンズホルダ
6の機械的加工精度で劣化は充分抑えられている。一方
、光ファイバ素線9はフェル−/L/8に樹脂接着剤で
固定されており、7エルールホルダ7に2μm程度のク
リアランスを設けてガイドされている。ここでフェル−
/L/8を光軸平向方向(2方向)および光軸垂直方向
Cx、!方向)にマニュピレータで微調整を行って最大
の結合効率となるところで第3図中のムおよびBの部分
を樹脂接着剤で完全固定するか、あるいは樹脂接着剤で
仮固定した後に抵抗溶接で固定していた(例えば、立川
、猿渡:昭和68年電子通信学会半導体、材料部門全国
大会291)。
2. Description of the Related Art In the past, various devices have been considered for coupling a semiconductor laser and an optical fiber, and FIG. 3 shows a vertical cross-sectional view of the structure of a typical device. In Fig. 3, 1 is a package stem, 2 is a semiconductor laser, 3 is a monitor light receiving element,
4 is an electrode, 6 is a ball lens, 6 is a lens holder, 7 is a ferrule holder, and 8 is a fer-! , 9 is an optical fiber wire,
1o is an optical fiber jacket. This structure is based on a concentric cylindrical shape centered on the optical axis. As a manufacturing method of this coupling device, first, the ball lens 6 is attached to the lens holder 6.
This lens-equipped holder is fitted and fixed into the package stem 1 to which the semiconductor laser 2 has been fixed in advance. The ball lens 5 is fixed to the lens holder 6 by resin adhesion.
By brazing, soldering, etc. Further, the lens holder 6 is fixed to the package stem 1 by resin adhesion, resistance welding, or the like. The optical axis deviation of the ball lens 6 causes an angular deviation of the g-condensed beam, which deteriorates the coupling efficiency, but the positional accuracy of the emission center of the semiconductor laser 2 is ±10.
If it is within 0 μm, package stem 1. The mechanical processing precision of the lens holder 6 sufficiently suppresses deterioration. On the other hand, the optical fiber wire 9 is fixed to the ferrule/L/8 with a resin adhesive, and is guided by the ferrule holder 7 with a clearance of about 2 μm. Fell here
/L/8 in the optical axis horizontal direction (two directions) and the optical axis vertical direction Cx, ! (direction) with a manipulator, and when the maximum coupling efficiency is achieved, completely fix the parts M and B in Figure 3 with resin adhesive, or temporarily fix them with resin adhesive and then fix them with resistance welding. (For example, Tachikawa, Saruwatari: 1988 IEICE Semiconductor and Materials Division National Conference 291).

発明が解決しようとする問題点 このような従来の半導体レーザ・光ファイバ結合装置で
は、特にフェルール8のx、y、z方向の微調整後の抵
抗溶接の際には圧力を加えるため光軸ずれを少くするた
めと溶接強度を保つだめの圧力調整が必要となシ、さら
に仮固定の接着剤の量を少なめにつけなければ抵抗溶接
が困難であった。さらにフェル−/L/8とフェルール
ホルダ7との固定には形状的に抵抗溶接が困難であった
。また抵抗溶接の場合、ひとつひとつを治具にはさみ圧
力をかけて溶接するため量産性の点で劣っており、一方
樹脂接着による固定は従来から行われている方法ではあ
るが長期的な信頼性の点で問題があった。
Problems to be Solved by the Invention In such a conventional semiconductor laser/optical fiber coupling device, optical axis misalignment occurs due to the application of pressure, especially during resistance welding after fine adjustment of the ferrule 8 in the x, y, and z directions. It was necessary to adjust the pressure in the reservoir to reduce the welding strength and to maintain welding strength, and resistance welding was difficult unless a small amount of temporary fixing adhesive was applied. Furthermore, resistance welding was difficult to fix the ferrule holder 7 to the ferrule holder 7 due to its shape. Furthermore, in the case of resistance welding, each piece is sandwiched between jigs and welded under pressure, which is inferior in terms of mass production.On the other hand, fixing with resin bonding is a conventional method, but it has poor long-term reliability. There was a problem with that.

本発明はかかる点に鑑みてなされたものであシ、製造が
容易で製造中の結合効率の劣化が少なく量産性および長
期的な信頼性に優れた半導体レーザ・光ファイバ結合装
置を提供することを目的としている。
The present invention has been made in view of the above points, and an object of the present invention is to provide a semiconductor laser/optical fiber coupling device that is easy to manufacture, has little deterioration in coupling efficiency during manufacturing, and is excellent in mass productivity and long-term reliability. It is an object.

問題点を解決するだめの手段 本発明は上記問題点を解決するために、上記半導レーザ
とレンズを第1の固定治具により固定し、上記光ファイ
バを光軸に対して平行および垂直方向への位置調整が可
能な第2の固定治具で前記第1の固定治具に結合効率が
最大となる位置で樹脂接着剤で固着し、さらにレーザ溶
接により固着するものである。
Means for Solving the Problems In order to solve the above problems, the present invention fixes the semiconductor laser and the lens using a first fixing jig, and fixes the optical fiber in parallel and perpendicular directions to the optical axis. A second fixing jig whose position can be adjusted is fixed to the first fixing jig with a resin adhesive at a position where the coupling efficiency is maximized, and further fixed by laser welding.

作用 本発明は、上記した構成であり、樹脂接着剤固着後での
レーザによる非接触溶接であるため抵抗溶接のように圧
力は全く加わらず、さらに他の溶接方法に比べて溶接入
熱が非常に少ないことから製造時における結合効率の劣
化は少なく、またメタル固定であることから長期的な信
頼性に優れ、数値制御テーブル等の利用によシ量産性も
向上する。
Function The present invention has the above-mentioned configuration, and since it is non-contact welding using a laser after the resin adhesive is fixed, no pressure is applied unlike resistance welding, and the welding heat input is much lower than other welding methods. Since the coupling efficiency is small, there is little deterioration in coupling efficiency during manufacturing, and since it is fixed to metal, it has excellent long-term reliability, and the use of numerical control tables etc. can improve mass production.

実施例 以下に本発明の一実施例における半導体レーザ・光ファ
イバ結合装置の製造方法について第1図。
Embodiment FIG. 1 shows a method of manufacturing a semiconductor laser/optical fiber coupling device according to an embodiment of the present invention.

第2図とともに説明する。第1図は従来例として示した
第3図のものとほとんど同じ構造のものであるので共通
部分の説明は省略する。11は樹脂接着剤、α、βはレ
ーザ溶接ビームである。従来例の場合と同様にしてパッ
ケージステム1.半導体レーザ29球レンズ5.レンズ
ホルダ6は互いに固定されており、光ファイバ素線9は
、フェル−/L’ 8に固定されている。フェル−/l
/8はフェルールホルダ7に2μm程度のクリアランス
でガイドサしておりマニュピレータでフェル−)vBを
持ちx、y、Z方に微調整することで最大結合効率の位
置で保持する。ここでAおよびB部分を樹脂接着剤で固
着する。樹脂接着剤が固化した後に、レーザ溶接によシ
固着する。樹脂接着剤がレーザ溶接ビームを吸収しない
ものならば円周上全面に塗布してもかまわず、樹脂接着
剤を介して溶接を行う。
This will be explained with reference to FIG. Since the structure shown in FIG. 1 is almost the same as that shown in FIG. 3 as a conventional example, explanation of the common parts will be omitted. 11 is a resin adhesive, and α and β are laser welding beams. Package stem 1. Semiconductor laser 29 ball lens 5. The lens holders 6 are fixed to each other, and the optical fiber strand 9 is fixed to the fer/L' 8. Fer-/l
/8 is guided by the ferrule holder 7 with a clearance of about 2 μm, and is held at the position of maximum coupling efficiency by finely adjusting it in the x, y, and Z directions using a manipulator to hold the fer-)vB. At this point, parts A and B are fixed with a resin adhesive. After the resin adhesive has solidified, it is fixed by laser welding. As long as the resin adhesive does not absorb the laser welding beam, it may be applied to the entire circumference, and welding is performed through the resin adhesive.

樹脂接着剤がレーザ溶接ビームを吸収するものならば適
度な間隔で塗布し、樹脂接着剤のない部分を溶接する。
If the resin adhesive absorbs the laser welding beam, apply it at appropriate intervals and weld the parts where there is no resin adhesive.

レーザ溶接機としてはYAGレーザ(λ=1.06am
 )の方がCO21z−ザ(λ= 10.6 μm )
に比べ金属表面での反射が少なく溶接が容易である。例
えばステンレス鋼の場合、表面のあらさや加工ひずみに
よっても異なるが、λ−1.06μmに対しては反射率
FJeo%、λ= 10.6μmに対してのそれはFI
90%とYAGレーザのほうが適している。
YAG laser (λ=1.06am
) is better than CO21z-the (λ= 10.6 μm)
There is less reflection on the metal surface compared to , making it easier to weld. For example, in the case of stainless steel, the reflectance is FJeo% for λ-1.06 μm, and that for λ = 10.6 μm is FI
At 90%, YAG laser is more suitable.

反射率、温度変化による結合効率の劣化を引き起こす原
因となる熱膨張係数、および加工のしやすさ、さび等の
ことを考え合わせるとレンズホルダ6、フェルールホル
ダ7等の固定治具はステンレス鋼が適している。
Considering reflectance, coefficient of thermal expansion that causes deterioration of coupling efficiency due to temperature changes, ease of processing, rust, etc., fixing jigs such as lens holder 6 and ferrule holder 7 should be made of stainless steel. Are suitable.

樹脂接着剤としては、例えば紫外線硬化性接着剤は紫外
線の光量によシ固化程度を制御が可能で、硬化による樹
脂の収縮からくる光軸ずれをマニュピレータで補正しな
がら最終硬化させることができるため結合条件のきびし
いシングルモード光ファイバと半導体レーザとの結合の
際に有利である。
As for resin adhesives, for example, ultraviolet curable adhesives can control the degree of hardening depending on the amount of ultraviolet rays, and can be used for final curing while correcting optical axis deviation caused by resin contraction due to curing using a manipulator. This is advantageous when coupling a semiconductor laser to a single-mode optical fiber that requires severe coupling conditions.

フェルールホルダ7の溶接部の厚さがo、4mmのステ
ンレス鋼(5US303 )を用い、樹脂接着剤として
通常の紫外線硬化性接着剤を円周上全面に塗布し、YA
(rレーザでレンズホルダ6との溶接を等間隔に8ケ所
行った場合で引っばり強度は、950 kgである。こ
こでYAGレーザはパルス発振のものを使用し、条件と
してはパルス輻5m5ec。
The welded part of the ferrule holder 7 is made of stainless steel (5US303) with a thickness of o and 4 mm, and an ordinary ultraviolet curable adhesive is applied to the entire circumference as a resin adhesive.
(The tensile strength is 950 kg when welding with the lens holder 6 at 8 points equally spaced using an r laser is 950 kg. Here, the pulsed YAG laser is used, and the pulse intensity is 5 m5 ec.

繰シ返し10 pp8 、レンズ:f5Qmm、1シE
17ト当りのエネルギー約45で行っている。円周上全
面をシーム溶接すれば機械的強度はさらに上げることが
できる。
Repetition: 10 pp8, Lens: f5Qmm, 1xE
This is done using approximately 45 energy per 17 tons. Mechanical strength can be further increased by seam welding the entire circumference.

フェル−)vsとフェルールホルダ7との溶接モ同様に
行いコア径10μmのシングルモード光ファイバを結合
した場合で結合効率−s、sdB程度、出力変動は0〜
50°Cで±0.5dB程度である。
Welding of the ferrule holder 7 and the ferrule holder 7 was performed in the same way, and when a single mode optical fiber with a core diameter of 10 μm was coupled, the coupling efficiency was approximately -s, sdB, and the output fluctuation was 0 to 0.
It is about ±0.5 dB at 50°C.

フェルールホルダ7とレンズホルダ6との接触面にすき
間がある場合は溶接ができないのでよシ確実に溶接を行
うため、フェルール8に第1図に示すような突起部を設
け、まず最大結合効率の位置で2方向、すなわちA部分
だけを樹脂接着剤で固着し、あらかじめ溶接した後に突
起部をバネでレンズホルダ6に押さえつけてフェルール
ホルダ7が完全に密着した状態で樹脂接着剤で固着した
後で行うと良い。また第2図はフェルールホルダ7の厚
さによるレーザ溶接ビームの方向を示す縦断面図である
。レーザ溶接ビームのエネルギーにもよるが薄い場合、
あるいはエネルギーが高い場合にはe)のように溶接す
ることが可能であるが、厚い場合あるいは(&)の方法
で溶接が困難な場合は(b)のように溶接できる。一般
的に(b)の方法が強度的には強いが、必要な強度を一
得ることができればいずれの方法でもかまわない。黒い
部分が溶接されている部分である。
If there is a gap between the contact surfaces of the ferrule holder 7 and the lens holder 6, welding will not be possible, so in order to ensure reliable welding, a protrusion as shown in Figure 1 is provided on the ferrule 8, and first the maximum coupling efficiency is achieved. After fixing only the A part in two directions at the position with resin adhesive, welding it in advance, press the protrusion against the lens holder 6 with a spring, and fix it with the resin adhesive with the ferrule holder 7 completely attached. It's good to do it. Further, FIG. 2 is a longitudinal sectional view showing the direction of the laser welding beam depending on the thickness of the ferrule holder 7. It depends on the energy of the laser welding beam, but if it is thin,
Alternatively, if the energy is high, it is possible to weld as in e), but if the material is thick or it is difficult to weld using method (&), welding can be performed as in (b). Generally, method (b) is strong, but any method may be used as long as the required strength can be obtained. The black part is the welded part.

樹脂接着剤で固着したあとはマニュピレータからはずし
てレーザ溶接できるので数値制御テーブル等を利用すれ
ば量産性も向上できる。レーザ溶接ビームのエネルギー
が高い場合など樹脂接着剤による固着はしであるものの
溶接によるひつげシなどのひずみが起こり結合効率が劣
化する場合もあるが、レーザ溶接ビームを2つあるいは
4つに分割し、円周上の対角線を同時に2ケ所あるいは
4ケ所溶接することにより結合効率の劣化は抑えられる
After being fixed with resin adhesive, it can be removed from the manipulator and laser welded, so mass production can be improved by using a numerical control table or the like. When the energy of the laser welding beam is high, even though the resin adhesive is used, distortion may occur due to welding, reducing the coupling efficiency. However, by simultaneously welding two or four diagonal lines on the circumference, deterioration in coupling efficiency can be suppressed.

発明の効果 以上述べてきたように、本発明によれば、製造が容易で
製造中の結合効率の劣化が少なく量産性および長期的な
信頼性に優れた半導体レーザ・光ファイバ結合装置が実
現できる。
Effects of the Invention As described above, according to the present invention, it is possible to realize a semiconductor laser/optical fiber coupling device that is easy to manufacture, has little deterioration in coupling efficiency during manufacturing, and is excellent in mass productivity and long-term reliability. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例における半導体レーザ・光フ
ァイバ結合装置の製造方法を説明するための半導体レー
ザ・光ファイバ結合装置の縦断面図、第2図は同方法に
よるレーザ溶接部分の縦断面図、第3図は従来の製造方
法を説明するための半導体レーザ・光ファイバ結合装置
の縦断面図である。 2・・・・・・半導体レーザ、5・・・・・・球レンズ
、6・・・・・・レンズホルダ、7・・・・・・フェル
ールホルダ、8・・・・・・フェルール、9・・・・・
・光ファイバ素線、11・・・・・・樹脂接着剤。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図          5−一一工東しンス゛第2図 CQ−)       (b)
FIG. 1 is a longitudinal cross-sectional view of a semiconductor laser/optical fiber coupling device for explaining the manufacturing method of the semiconductor laser/optical fiber coupling device in one embodiment of the present invention, and FIG. 2 is a longitudinal cross-section of a laser welded portion by the same method. The plan view and FIG. 3 are longitudinal sectional views of a semiconductor laser/optical fiber coupling device for explaining a conventional manufacturing method. 2... Semiconductor laser, 5... Ball lens, 6... Lens holder, 7... Ferrule holder, 8... Ferrule, 9・・・・・・
・Optical fiber wire, 11...Resin adhesive. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 5-11 Engineering East Building Figure 2 CQ-) (b)

Claims (5)

【特許請求の範囲】[Claims] (1)半導体レーザと、光ファイバと、前記半導体レー
ザからの出射光を前記光ファイバに集光するレンズと、
前記半導体レーザとレンズを固定する第1の固定部材と
、前記光ファイバを、光軸に対して平行および垂直方向
への位置調整が可能なように前記第1の固定部材に固定
する第2の固定部材を備え、前記第2の固定部材を第1
の固定部材に結合効率が最大となる位置で樹脂接着剤で
固着し、さらにレーザ溶接により固着することを特徴と
する半導体レーザ・光ファイバ結合装置の製造方法。
(1) a semiconductor laser, an optical fiber, and a lens that focuses the light emitted from the semiconductor laser onto the optical fiber;
a first fixing member that fixes the semiconductor laser and the lens; and a second fixing member that fixes the optical fiber to the first fixing member so that the position of the optical fiber can be adjusted in parallel and perpendicular directions with respect to the optical axis. a fixing member, the second fixing member is connected to the first fixing member;
A method for manufacturing a semiconductor laser/optical fiber coupling device, which comprises fixing the semiconductor laser to the fixing member using a resin adhesive at a position where the coupling efficiency is maximum, and further fixing by laser welding.
(2)樹脂接着剤はレーザ溶接のレーザ光の吸収が少な
いものであり、レーザ溶接は樹脂接着剤を透過して行な
われることを特徴とする特許請求の範囲第1項記載の半
導体レーザ・光ファイバ結合装置の製造方法。
(2) The semiconductor laser and light according to claim 1, wherein the resin adhesive has a low absorption of laser light for laser welding, and the laser welding is performed through the resin adhesive. A method of manufacturing a fiber coupling device.
(3)樹脂接着剤は紫外線硬化性接着剤であることを特
徴とする特許請求の範囲第1項又は第2項記載の半導体
レーザ・光ファイバ結合装置の製造方法。
(3) The method for manufacturing a semiconductor laser/optical fiber coupling device according to claim 1 or 2, wherein the resin adhesive is an ultraviolet curable adhesive.
(4)レーザ溶接はYAGレーザ溶接であることを特徴
とする特許請求の範囲第1項、第2項又は第3項記載の
半導体レーザ・光ファイバ結合装置の製造方法。
(4) The method for manufacturing a semiconductor laser/optical fiber coupling device according to claim 1, 2, or 3, wherein the laser welding is YAG laser welding.
(5)第1および第2の固定部材はステンレス鋼である
ことを特徴とする特許請求の範囲第1項、第2項、第3
項又は第4項記載の半導体レーザ・光ファイバ結合装置
の製造方法。
(5) Claims 1, 2, and 3, characterized in that the first and second fixing members are made of stainless steel.
A method for manufacturing a semiconductor laser/optical fiber coupling device according to item 1 or 4.
JP8053685A 1985-04-16 1985-04-16 Production of semiconductor laser and optical fiber coupling device Pending JPS61239209A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8053685A JPS61239209A (en) 1985-04-16 1985-04-16 Production of semiconductor laser and optical fiber coupling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8053685A JPS61239209A (en) 1985-04-16 1985-04-16 Production of semiconductor laser and optical fiber coupling device

Publications (1)

Publication Number Publication Date
JPS61239209A true JPS61239209A (en) 1986-10-24

Family

ID=13721070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8053685A Pending JPS61239209A (en) 1985-04-16 1985-04-16 Production of semiconductor laser and optical fiber coupling device

Country Status (1)

Country Link
JP (1) JPS61239209A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63307410A (en) * 1987-06-10 1988-12-15 Nec Corp Photosemiconductor module
EP0369609A2 (en) * 1988-11-18 1990-05-23 Mitsubishi Denki Kabushiki Kaisha A semiconductor laser device and a method of producing same
US5107537A (en) * 1990-01-05 1992-04-21 U.S. Philips Corp. Optoelectronic device having a coupling comprising a lens and arranged between an optical transmission fiber and a semiconductor laser diode
JPH08271766A (en) * 1995-03-31 1996-10-18 Nec Corp Production of optical coupling module
JP2015045875A (en) * 2008-11-24 2015-03-12 コーニング インコーポレイテッド Weld joining method and device having weld-joined component

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63307410A (en) * 1987-06-10 1988-12-15 Nec Corp Photosemiconductor module
EP0369609A2 (en) * 1988-11-18 1990-05-23 Mitsubishi Denki Kabushiki Kaisha A semiconductor laser device and a method of producing same
US5107537A (en) * 1990-01-05 1992-04-21 U.S. Philips Corp. Optoelectronic device having a coupling comprising a lens and arranged between an optical transmission fiber and a semiconductor laser diode
JPH08271766A (en) * 1995-03-31 1996-10-18 Nec Corp Production of optical coupling module
JP2015045875A (en) * 2008-11-24 2015-03-12 コーニング インコーポレイテッド Weld joining method and device having weld-joined component

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