JP2804238B2 - Method for manufacturing optical semiconductor module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical semiconductor module having a light emitting device such as a semiconductor laser or a light emitting diode.

[0002]

2. Description of the Related Art The technology of coupling light from a light emitting element to an optical fiber via a lens is very important in fields such as optical communication and laser treatment equipment. In particular, in the case of optical communication, the core diameter of the single mode optical fiber is as small as about 8 μm, and it is difficult to efficiently couple the light emitted from the light emitting element to the incident part of the optical fiber. Less than,
A conventional optical semiconductor module will be described.

FIGS. 6A and 6B show, for example, Japanese Unexamined Patent Publication No.
FIG. 6 (a) is a side sectional view showing a first conventional optical semiconductor module disclosed in Japanese Patent No. 355706,
FIG. 6B is a cross-sectional view taken along the line VI-VI of FIG.

In FIGS. 6A and 6B, 601 is a semiconductor laser device, 602 is a submount made of SiC, and 603 is a stem made of copper. The semiconductor laser device 601 is mounted on the submount 60 by the die bonder.
2 and the submount 602 is fixed on the stem 603 by soldering, respectively. The stem 603 is fixed on a first base 604 made of copper by soldering. A gold wire (not shown) extends between the semiconductor laser 601 and the package 605 so that a current is supplied to the semiconductor laser element 601 from the outside.

In FIGS. 6A and 6B, reference numeral 606 denotes an aspheric lens having a numerical aperture of about 0.5 and an object-image distance of about 13 mm, and the aspheric lens 606 has a cylindrical shape made of stainless steel. Of the lens holder 607. 608 is a second base made of stainless steel;
Reference numeral 9 denotes an electronic cooler made of a Peltier element. The electronic cooler 608 is fixed in the package 605 by soldering in advance. The first base 604 and the second base 608 are fixed on the electronic cooler 609 by soldering.

The lens holder 607 is fixed on the second base 608 by laser welding. Before being fixed, the aspheric lens 606 and the semiconductor laser element 601 are fixed.
Is monitored by a television camera, the position of the aspheric lens 606 is adjusted so that the semiconductor laser element 601 comes to the focal position of the aspheric lens 606. At this time, the position can be adjusted only in the X and Z directions shown in FIGS. 6 (a) and 6 (b). The positioning accuracy in the Y direction depends on the processing accuracy of each component and the accuracy of the thickness of the solder. The optical isolator 610 is fixed inside the package 605 in advance.

In FIGS. 6 (a) and 6 (b), reference numeral 611 denotes a single mode optical fiber for optical communication. The single mode optical fiber 611 has a center axis aligned with a cylindrical ferrule 612 made of zirconia and stainless steel. It is fixed with high precision. The ferrule holder 613 has a rubbing surface between the ferrule holder 613 and the package 605, and has a hole having a circular cross section so that the ferrule 612 can be inserted while being rubbed. The position of the single mode optical fiber 611 is determined so that the semiconductor laser element 601 oscillates and the amount of incident light becomes maximum. The ferrule holder 613, the package 605, and the ferrule 612 are fixed to each other by laser welding. 614 is the package 605
615, a light receiving element, and 616, a light receiving element mount.

FIG. 7 shows, for example, Anritsu Technical, N
o. It is a side sectional view of the conventional 2nd optical semiconductor module shown on pages 65 and 48-54.

In FIG. 7, reference numeral 701 denotes a semiconductor laser element, 702 denotes a stem made of copper, and the semiconductor laser element 701 is connected to the stem 702 by a die bonder.
The stem 702 is fixed to a copper base 703 by soldering.

In FIG. 7, reference numeral 704 denotes an aspherical lens having a numerical aperture of about 0.6 and a focal length on the laser side of about 1 mm. The aspherical lens 704 is fitted in a lens holder 705. The optical isolator 706 is fixed to the lens holder 705 with the optical axis aligned with the lens holder 705. Butt block 707
Is provided to match the distance between the semiconductor laser element 701 and the aspheric lens 704 with the focal length of the aspheric lens 704. The butting block 707 is located on the front side (FIG. 7).
When viewed from the left side, it has a U-shape, and is in contact with the rubbing surface 708 of the lens holder 705 on the left and right sides and the lower surface.

Therefore, regarding the positioning accuracy in the Z direction, the processing accuracy of the length of the butting block 707, the fitting accuracy of the aspheric lens 704 and the lens holder 705, and the positioning accuracy of the semiconductor laser element 701 and the stem 702 are considered. Determined by the sum. On the other hand, the X and Y directions are adjusted by moving the lens holder 705 while rubbing against the abutment block 707.
The lens holder 705 and the butting block 707 are fixed by laser welding.

The electronic cooler 710 is fixed to the package 709 by soldering, and the copper base 703 is fixed to the electronic cooler 710 by soldering.

In FIG. 7, reference numeral 711 denotes a single mode optical fiber for optical communication, and the method of adjusting the position of the single mode optical fiber 711 is the same as that of the first conventional optical semiconductor module. 712 is a cylindrical ferrule made of zirconia and stainless steel;
Denotes a ferrule holder, and 714 denotes a lid of the package 709.

FIG. 8 is a side sectional view of a third conventional optical semiconductor module disclosed in, for example, JP-A-3-61927 or JP-A-55-22968. Unlike the first or second optical semiconductor module, the third optical semiconductor module has a cylindrical outer shape, and the electronic cooler is not located immediately below the semiconductor laser device.

In FIG. 8, 801 is a semiconductor laser device, 820 is a stem made of copper, and 821 is a base made of copper or iron. Current is supplied to the semiconductor laser element 801 from the lead wire 803. Reference numeral 805 denotes a spherical lens. The spherical lens 805 is fixed to a glass plate 826 with resin, and the glass plate 826 is fixed to the bottom of a bottomed cylindrical cap 823. A ring-shaped metal member 822 is disposed between the cap 823 and the base 821 so as to rub against both the cap 823 and the base 821. Typical positions are X, Y,
It can be adjusted in the Z direction. 824 is a rubbing surface.

A holder 827 is disposed between the optical fiber 814 and the cap 823.
27, the relative position between the optical fiber 814 and the cap 823 can be adjusted in the X, Y, and Z directions. Incidentally, 81
Reference numeral 3 denotes an optical fiber cover, and 828 denotes an optical fiber holding base.

[0017]

However, the conventional first to third optical semiconductor modules do not satisfy the required positioning accuracy and have high optical coupling efficiency because of the following reasons. Is not enough to get.

A semiconductor laser device 90 as shown in FIG.
1. In the case where the lens 902 and the optical fiber 903 are optically coupled, the relationship between the coupling efficiency of the lens and the amount of displacement when the mutual position deviates from the optimal position will be described. Note that FIG.
904 is a ferrule.

The full width at half maximum of the emitted light of the semiconductor laser element 901 is about 30 degrees in the Y direction and about 25 degrees in the X direction. The lens 902 is an aspherical lens. In the lens 902, the numerical aperture on the laser side is about 0.45, the numerical aperture on the fiber side is about 0.1, and the object-image distance at which the maximum coupling efficiency is obtained is about 13 mm. If an ideal coupling is obtained, the design is such that a coupling efficiency of about 75% can be obtained. The optical fiber 903 is equivalent to that shown in the first conventional optical semiconductor module.

FIG. 9 shows a state in which the semiconductor laser element 901, the lens 902, and the optical fiber 903 are adjusted to a positional relationship at which the maximum coupling efficiency is obtained.

If the lens 902 moves from this state, the coupling efficiency is drastically reduced. The coupling efficiency is the highest efficiency 9
In the case of a standard which is judged to be defective when it falls to 0% (deterioration of 0.1 dB), the non-defective range is about ± 0.3 μm in the X and Y directions and about ± 3 μm in the Z direction. Hereinafter, this non-defective range will be referred to as "original non-defective range". No matter how highly efficient the lens is, if the above positioning accuracy cannot be realized, the performance cannot be exhibited.

The first to third conventional optical semiconductor modules are about ± 15 μm in the X and Y directions and ± 15 μm in the Z direction.
Even if the range of non-defective products is relaxed to about 30 μm, even the accuracy of the range of non-defective products cannot be satisfied. Hereinafter, the reason will be sequentially described.

First, in the conventional first optical semiconductor module, the positioning accuracy in the Y direction is determined by the semiconductor laser element 601, the submount 602, the stem 603, the first base 604, the lens holder 607, and the second base 6.
08 in the thickness direction, the accuracy of center axis alignment between the aspherical lens 606 and the lens holder 607, the amount of deviation between the optical axis of the aspherical lens 606 and the optical axis, and the thickness of the solder material. Depends. The processing accuracy of copper and stainless steel is generally limited to ± 20 μm. If a higher processing accuracy is required, the processing cost becomes too high, resulting in a large increase in the cost of the optical semiconductor module. Also, the aspheric lens 6
06 and the lens holder 607 are aligned ±
The limit is about 5 μm. The thickness of the solder material is ± 3.
A variation of about μm is inevitable. Therefore, when all of these dimensional errors are summed, the allowable range of about ± 15 μm in the Y direction greatly deviates.

Next, according to the second conventional optical semiconductor module, the positioning accuracy in the Z direction is determined by component tolerance. Specifically, the processing accuracy of the length of the butting block 707 is at least ± 20 μm, and the fitting accuracy of the aspheric lens 704 and the lens holder 705 in the Z direction is ± 30.
μm, and the alignment accuracy between the semiconductor laser element 701 and the stem 702 is ± 10 μm. The sum of these dimensional errors is ± 60 μm, which also greatly deviates from the allowable range of about ± 30 μm in the Z direction.

Next, in the document showing the third conventional optical semiconductor module, the position of the spherical lens 805 can be adjusted in all directions of X, Y and Z with respect to the semiconductor laser element 801 and the optimum position is determined. Describes that the light output is monitored. Spherical lens 805 and semiconductor laser element 801
For precise alignment with the light receiving element for monitoring, a light receiving element having a narrow opening or an optical fiber 8
A monitoring optical fiber having a core diameter equal to or smaller than the core diameter of 14 must be used.

However, as a result of verification by the present inventors, the positions of the monitoring optical fiber and the spherical lens 805 are within ± 15 μm in the X and Y directions with respect to the optimum value (ideal focus position), and If the deviation is not within the range of ± 30 μm,
Even if the semiconductor laser element 801 and the semiconductor laser element 801 are precisely aligned, a good product value of “90% or more of the maximum coupling efficiency” cannot be satisfied.

However, there is no description in the above document at all. Further, since the cap 823 is formed by pressing, sufficient processing accuracy cannot be obtained. For this reason, the tolerance of the cap 823 becomes large, and the gap between the cap 823 and the metal fitting 822 becomes about ± 50 μm or more. Therefore, the spherical lens 805 moves when it is fixed by laser welding or the like, which also greatly deviates from the allowable range of about ± 15 μm in the X and Y directions.

In the case of the above-mentioned component shape, it is difficult to bring the electronic cooler directly below the semiconductor laser device as in the case of the conventional first or second optical semiconductor module. It cannot be used when control is required or when an element that generates a large amount of heat is cooled.

The above problems can be summarized and explained. According to a method of positioning a lens which partially depends on the dimensional accuracy of components like the first or second optical semiconductor module in the related art,
It is extremely difficult to satisfy the required positional accuracy. Further, in the method of monitoring the coupling efficiency as in the third conventional optical semiconductor module, according to the verification of the present inventors, the positional relationship between the lens and the monitoring light receiving component must be precisely determined in advance. However, in the conventional third optical semiconductor module, such a device is not devised, and high optical coupling efficiency cannot be obtained.

In view of the above, it is an object of the present invention to provide a method for manufacturing an optical semiconductor module capable of obtaining a high optical coupling rate.

[0031]

According to the method of manufacturing an optical semiconductor module according to the present invention, if the position of the optical fiber is readjusted to maximize the coupling efficiency in a state where the lens is misaligned, the range of non-defective products is expanded. It has been found and made based on the findings. Conventionally, the position of the optical fiber is adjusted after the lens position is determined, and the light emitting element, the lens, and the optical fiber are fixed in this state.
After the lens position is determined precisely, the light emitting element and the lens are fixed, then the optimum position of the optical fiber is searched, and the optical fiber is fixed to the lens in this state.

FIG. 1 shows the relationship between the displacement of the lens and the coupling efficiency. In this case, the non-defective range is about ± 15 μm in the X and Y directions and about ± 30 μm in the Z direction (hereinafter, this non-defective range is referred to as “improved non-defective range”). Of course, these values will vary with different lenses and fiber optics. Generally NA (numerical aperture)
The larger the lens used, the narrower the quality range.
Recently, to obtain higher coupling efficiency, NA
However, it has become common sense to use a lens of 0.5 or more. For this reason, the original good product range seems to be gradually narrowing.

However, the solution principle of the present invention is that "after accurately determining the lens position, the light emitting element and the lens are fixed, then the optimum position of the optical fiber is searched, and the optical fiber is fixed to the lens in this state. According to the method described above, the result that the improved non-defective range expands 50 times in the X and Y directions and 10 times in the Z direction as compared with the original non-defective range is unchanged.

Specifically, a solution according to the first aspect of the present invention is to provide a method for manufacturing an optical semiconductor module, which comprises fitting a cylindrical lens holder holding a lens into one end of a supporting cylindrical member, and At the other end of the supporting cylindrical member, a cylindrical aligning optical fiber holder having an outer diameter substantially equal to the inner diameter of the supporting cylindrical member while holding the aligning optical fiber is fitted, and Between the lens holder and the centering optical fiber holder inside the supporting cylindrical member, the lens holder and the centering optical fiber are positioned such that the incident portion of the centering optical fiber is located at the focal point of the lens. By inserting a cylindrical spacer having a length that regulates the distance from the optical fiber holder and having an outer diameter substantially equal to the inner diameter of the supporting cylindrical member, the alignment light is inserted. The alignment optical fiber holder is temporarily fixed to the lens holder in a state where the fiber can obtain the maximum coupling efficiency with respect to the lens, and the supporting cylindrical member, the lens holder, the alignment optical fiber holder, and the spacer are provided. A first step of obtaining a composite part consisting of: a second step of arranging the composite part such that the lens faces an emission part of a light emitting element held by a base; and emitting light from the light emitting element. And the emitted light is guided to the entrance of the alignment optical fiber, and the composite component is three-dimensionally moved with respect to the light emitting element such that the amount of light incident on the alignment optical fiber is maximized. Third
A fourth step of fixing the lens holder to the base in a state where the amount of light incident on the alignment optical fiber is maximized; and a fifth step of removing the alignment optical fiber holder from the lens holder. And emitting the light from the light emitting element and guiding the emitted light to the incident portion of the mounting optical fiber held by the mounting optical fiber holder so that the amount of light incident on the mounting optical fiber is maximized. A sixth step of moving the mounting optical fiber holder three-dimensionally with respect to the light emitting element; and mounting the mounting optical fiber holder in a state where the amount of light incident on the mounting optical fiber is maximized. And a seventh step of fixing to

According to a second aspect of the present invention, a configuration is provided in which the core diameter of the optical fiber for alignment is smaller than the core diameter of the optical fiber for mounting to the configuration of the first aspect.

According to a third aspect of the present invention, in the configuration of the first aspect, the base in the second step has a wall perpendicular to an optical axis of light emitted from the light emitting element held by the base. The fourth step adds a configuration including a step of fixing the lens holder to the wall of the base.

In a fourth aspect of the present invention, there is provided a method for manufacturing an optical semiconductor module, comprising the steps of: fitting a cylindrical lens holder holding a lens into one end of a supporting cylindrical member; At the other end of the supporting cylindrical member, a cylindrical aligning optical fiber holder having an outer diameter substantially equal to the inner diameter of the supporting cylindrical member while holding the aligning optical fiber is fitted, and Between the lens holder and the centering optical fiber holder inside the supporting cylindrical member, the lens holder and the centering optical fiber are positioned such that the incident portion of the centering optical fiber is located at the focal point of the lens. By inserting a cylindrical spacer having a length that regulates the distance from the optical fiber holder and having an outer diameter substantially equal to the inner diameter of the supporting cylindrical member, the alignment light is inserted. The alignment optical fiber holder is temporarily fixed to the lens holder in a state where the fiber can obtain the maximum coupling efficiency with respect to the lens, and the supporting cylindrical member, the lens holder, the alignment optical fiber holder, and the spacer are provided. A first step of obtaining a composite part comprising: holding a light-emitting element on a base having a wall portion perpendicular to an optical axis of light emitted from the light-emitting element, wherein the lens is a light-emitting element held by the base. A second step of arranging the composite component so as to face an emission unit and contact the lens holder with the wall, and emit light from the light emitting element and apply the emitted light to the alignment optical fiber. The composite component is two-dimensionally guided in a plane perpendicular to the optical axis of the light emitted from the light emitting element so that the amount of light incident on the alignment optical fiber is maximized. A third step of moving, a fourth step of fixing the lens holder to the base in a state where the amount of light incident on the optical fiber for alignment is maximized, and a step of attaching the optical fiber holder for alignment to the lens holder. And removing the light from the light emitting element and guiding the emitted light to an incident portion of the mounting optical fiber held by the mounting optical fiber holder, and the light amount of the light incident on the mounting optical fiber is reduced. A sixth step of moving the mounting optical fiber holder three-dimensionally with respect to the light emitting element so that the mounting optical fiber holder is maximized, and the mounting optical fiber in a state in which the incident portion of the mounting optical fiber is located at the focal point of the lens. And a seventh step of fixing the holder to the lens holder.

According to a fifth aspect of the present invention, in addition to the configuration of the fourth aspect, a configuration is provided in which the core diameter of the alignment optical fiber is equal to or less than the core diameter of the mounting optical fiber.

[0039]

According to the structure of the first aspect, the composite component is three-dimensionally moved with respect to the light emitting element so that the amount of light emitted from the light emitting element and incident on the optical fiber for alignment is maximized. When the lens holder holding the lens is fixed to the base holding the light emitting element, the optical axis shifts between the light emitting element and the lens due to welding or soldering,
The mounting optical fiber holder holding the mounting optical fiber is moved three-dimensionally with respect to the light emitting element so that the amount of light emitted from the light emitting element and incident on the mounting optical fiber is maximized. The deviation of the optical axis between them is corrected. If the mounting optical fiber holder is fixed to the lens holder in this state, a slight shift of the optical axis will occur between the lens and the mounting optical fiber, but this shift of the optical axis will degrade by about 10% of the maximum coupling efficiency. Can be suppressed.

In the composite part, the alignment optical fiber holder holding the alignment optical fiber is temporarily fixed to the lens holder in a state where the maximum optical coupling efficiency is obtained with respect to the lens held by the lens holder. When the composite component is moved, the lens and the optical fiber for alignment move at the same time, so that in the third step, the lens, that is, the lens holder is moved in three directions, and the optical fiber for alignment is obtained. A state in which the amount of incident light is maximized is obtained.

According to the second or fifth aspect of the present invention, since the core diameter of the optical fiber for alignment is smaller than the core diameter of the optical fiber for mounting, the lens has a light emitting element with an accuracy higher than the coupling efficiency required for the optical fiber for mounting. Can be fixed against

According to the third aspect of the present invention, since the base holding the light emitting element has a wall perpendicular to the optical axis of the light emitted from the light emitting element, the lens holder is fixed to the wall of the base. Thereby, the lens holder can be easily fixed to the base.

According to the fourth aspect of the present invention, the composite component is moved in a plane perpendicular to the optical axis of the light emitted from the light emitting element so that the amount of light emitted from the light emitting element and incident on the optical fiber for alignment is maximized. When the lens moves two-dimensionally and the lens holder holding the lens is fixed to the base holding the light emitting element in this state, the optical axis shifts between the light emitting element and the lens due to welding or soldering. The mounting optical fiber holder holding the mounting optical fiber is moved three-dimensionally with respect to the light emitting element so that the amount of light emitted from the element and incident on the mounting optical fiber is maximized. Is corrected. If the mounting optical fiber holder is fixed to the lens holder in this state, a slight shift of the optical axis will occur between the lens and the mounting optical fiber, but this shift of the optical axis will degrade by about 10% of the maximum coupling efficiency. Can be suppressed.

In the composite part, the alignment optical fiber holder holding the alignment optical fiber in a state where the maximum optical coupling efficiency is obtained for the lens held in the lens holder is temporarily fixed to the lens holder. When the composite component is moved, the lens and the optical fiber for alignment move at the same time. Therefore, in the third step, the lens, that is, the lens holder is moved only in two directions, and the light enters the optical fiber for alignment. A state in which the amount of emitted light is maximized is obtained.

[0045]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first optical semiconductor module and a method of manufacturing the same according to the present invention will be described below with reference to FIGS.

2 and 3, reference numeral 101 denotes a semiconductor laser device; 102, a submount made of SiC; 103, a gold-plated copper stem;
1 is fixed on the submount 102 and the submount 102 is fixed on the stem 103 by soldering.
Reference numeral 104 denotes a first base made of stainless steel.
The bottom surface of the base 104 is formed flat,
At least the bottom surface of the first base 104 and the contact surface with the stem 103 are covered with gold. The first base 104 has a wall 105 extending vertically upward from its upper surface.
The wall 105 has an opening 106 through which the laser light emitted from the semiconductor laser element 101 passes.

After adjusting the angle of the stem 103 so that the optical axis of the laser beam emitted from the semiconductor laser element 101 is perpendicular to the wall 105, the stem 103 is fixed to the first base 104. First base 1 as described above
The reason why the bottom surface of the first base 104 is flat and covered with gold is that the bottom surface of the first base 104 comes into contact with an electronic cooler made of a Peltier element or the like over a wide area, and good heat exchange is performed. It is.

In FIG. 2 and FIG. 3, reference numeral 107 denotes an aspherical lens. The aspherical lens 107 is designed so that aberration is minimized with respect to the oscillation wavelength of the semiconductor laser element 101. A typical value of the aspheric lens 107 is about 3 mm in diameter, and the numerical apertures on the semiconductor laser element side and the optical fiber side are about 0.5 and about 0.5 mm, respectively.
1, the focal length on the semiconductor laser element 101 side is about 1.3 mm, and the focal length on the optical fiber side is about 9 m
m. Here, the focal length is a distance from the end surface of the aspherical lens 107.

In FIGS. 2 and 3, reference numeral 110 denotes a cylindrical first holder, and reference numeral 108 denotes a second holder inserted inside the first holder 110.
07 is fitted to the second holder 108 with high precision. As the fitting method, the aspherical lens 107 is attached to the second holder 10 while the second holder 108 is heated.
8 and using a difference in thermal expansion coefficient between the two, there is a method of fixing when cooled, or a method of previously placing the second holder 108 in a mold at the time of molding the aspheric lens 107. . By these methods, the positional relationship between the aspherical lens 107 and the second holder 108 and the optical axes of the two are accurately matched. The outer wall surface 109 of the second holder 108 is circular and smooth. Such a circular shaving process is suitable for working with tight tolerances because the accuracy is easy to obtain. However, the same accuracy can be obtained even if the inner and outer surfaces of the second holder 108 are subjected to planar processing and formed into a rectangular tube shape.

The inner wall surface 111 of the first holder 110 is formed into a smooth circular shape in accordance with the outer wall surface 109 of the first holder 108. The margin of the fitting dimension between the inner wall surface 111 of the first holder 110 and the outer wall surface 109 of the second holder 108 is usually about ± 20 μm, but if the precision is further increased, the margin of the fitting dimension is reduced to about ± 10 μm. It is possible to Thereby, the second holder 108 slides smoothly with respect to the first holder 110. When the second holder 108 has a rectangular cylindrical shape, the first holder 110
When the inner wall surface 111 is formed in a flat shape by wire processing or the like, the same accuracy can be obtained. The end face 112 of the first holder 110 is formed smoothly and is in contact with the wall 105 of the first base 104.

In FIG. 2, reference numeral 113 denotes an alignment optical fiber having a core diameter equal to or smaller than the core diameter of the mounting optical fiber. Reference numeral 114 denotes a cylindrical ferrule having a double structure of stainless steel and zirconia for reinforcing the optical fiber 113 for alignment. The ferrule 114
Is 2.5 mm, the supporting cylinder 115 having the same inner diameter as the outer diameter can be fitted to the ferrule 114. The support cylinder 115 is made of, for example, stainless steel, and can slightly expand and contract in the radial direction. As a method of expansion and contraction, there is a method of warming and expanding, or a method of cutting a part of the circumference and pressing it from the outside with a spring.
As a result, simply inserting the ferrule 114 into the support cylinder 115 allows the ferrule 114 to be held by the support cylinder 115 and the centers of the two to be accurately aligned.

A cylindrical spacer 116 having the same outer diameter as the ferrule 114 is fitted in the support cylinder 115. The end of the second holder 108 on the right side in FIG. 2 is cut so as to have the same outer diameter as the ferrule 114, and the ferrule 114, the spacer 116, and the second holder 108 have no gap therebetween. And is pushed into the supporting cylinder 115. In this case, the length of the spacer 116 is predetermined so that the alignment optical fiber 116 is accurately positioned at the focal point of the aspheric lens 107. In order to increase the dimensional accuracy, it is desirable that the spacer 116 be made of a ceramic such as zirconia having a high processing accuracy. Second holder 108 and spacer 116
Is held simply by being inserted into the supporting cylinder 115.

As shown in FIG. 2 and FIG. 3, Z
The axis is the X axis in a direction parallel to the upper surface of the first base 104 and perpendicular to the optical axis, and the Y axis is a direction perpendicular to the upper surface of the first base 104. The centering process is performed with the Z-axis direction set in the vertical direction.

Hereinafter, the steps of alignment and fixing between the alignment optical fiber 113, the aspherical lens 107, and the semiconductor laser element 101 will be described with reference to FIG.

First, after fixing the first base 104 to a table (not shown), a current is supplied to the semiconductor laser element 101 through the current supply lines 117 and 118. Support cylinder 115
Is mounted on a precision three-axis stage for alignment. At this time, the first holder 110 holds the first base 1 by gravity.
04 is in contact with the wall 105.

While a constant current is applied to the semiconductor laser element 101 to cause laser oscillation, the optical fiber 113 for alignment is used.
The supporting cylinder 115 is moved in the X, Y, and Z directions by a precision three-axis stage so that the amount of light entering the device becomes maximum. At this time, although the alignment accuracy of the aspheric lens 107 is determined by the accuracy of the precision three-axis stage, the alignment can be performed within an accuracy of about ± 0.5 μm. Further, since the core diameter of the optical fiber 113 for alignment is the same as or smaller than the core diameter of the optical fiber for mounting, the displacement of the optical fiber 113 for alignment with respect to the semiconductor laser element 101 appears sensitively as a change in the amount of light. Alignment is possible. The feature of this alignment method is that, although it is a three-member alignment including the semiconductor laser element 101, the aspherical lens 107, and the alignment optical fiber 113, X, The point is that the alignment can be performed only by one movement in the Y and Z directions. This is the optical fiber for alignment 1
This is because the 13 incident portions can be positioned at the focal point of the aspheric lens 107 in advance. If the insertion method is not adopted, the alignment optical fiber 113 must also be independently aligned, so that 3 axes × 3 axes = 9 axes, and an enormous amount of time is required.

The aspherical lens 107 and the optical fiber for alignment 1 are maintained while maintaining the state where the three alignments have been performed.
If 13 can be fixed, a value exceeding 90% can be obtained as the coupling efficiency to the final mounting optical fiber. However, the first holder 110 and the second holder 1
When laser welding is performed at the portion 119, the second holder 108 is inclined with respect to the first holder 110 by at most the amount of the gap therebetween. For this reason, the first holder 110 and the wall 105 of the first base 104
And an inclined gap is formed. In this state, the first holder 110 and the wall 105 are laser-welded at the portion 121. As described above, the method of performing laser welding from the side in a state where the end surfaces of the fitting portions are almost in contact with each other is a method that minimizes the displacement. However, since the absolute amount of volume change at the time of condensation at the melting point is different, the position of the aspherical lens 107 is slightly shifted from that at the time of alignment. This shift amount is the first
The larger the gap between the holder 110 and the second holder 108, the larger the gap. As described with reference to FIG. 1, since the amount of displacement in the X and Y directions must be suppressed to about ± 15 μm, the gap must be suppressed to within about 10 μm.

After the aspheric lens 107 is fixed to the semiconductor laser element 101 as described above, the supporting cylinder 115 is removed.

Hereinafter, the steps of aligning and fixing the mounting optical fiber 133 and the aspherical lens 107 will be described with reference to FIG.

In FIG. 3, reference numeral 130 denotes a second base made of stainless steel, and the second base 130 has an opening 131 through which laser light passes. The second base 130 is connected to the first base 1 via the second holder 110.
04 is laser welded. An optical isolator 132 is fixed on the second base 130. The bottom surface of the second base 130 is flat and covered with gold. For this reason, the bottom surface of the second base 130 is fixed to an electronic cooler made of a Peltier element or the like by solder over a wide area, and good heat exchange is performed, whereby the temperature of the optical isolator 132 is precisely controlled.

In FIG. 3, reference numeral 134 denotes a cylindrical ferrule for reinforcing the mounting optical fiber 133. The ferrule 134 has a double structure of stainless steel and zirconia. An optical fiber holder 135 has an inner wall surface 136 formed into a smooth circular shape. Ferrule 134 and optical fiber holder 1
The fitting allowance between 35 is usually about ± 20 μm, but if the accuracy is further improved, the fitting allowance can be made about ± 10 μm. Thereby, the ferrule 134
Slides smoothly with respect to the optical fiber holder 135.

As in the case of the optical fiber 113 for alignment,
Alignment is performed with the Z direction vertical. The first base 104 is fixed to a base (not shown), and supplies a current to the semiconductor laser element 101 through current supply lines 117 and 118. The ferrule 134 is attached to a precision three-axis stage for alignment. At this time, the optical fiber holder 135 is in contact with the second base wall 137 by gravity.

While a constant current is applied to the semiconductor laser element 101 to cause laser oscillation, the mounting optical fiber 133 is
The ferrule 134 is moved in the X, Y, and Z directions by a precision three-axis stage so that the amount of light entering the device becomes maximum. At this time, although the alignment accuracy of the aspheric lens 107 is determined by the accuracy of the precision three-axis stage, the alignment can be performed within an accuracy of about ± 0.5 μm. As described above, the aspheric lens 107
Has a deviation amount within about ± 10 μm. However,
Within this range of the deviation amount, the deviation amount can be corrected by aligning the mounting optical fiber 134 as described above, and the position of the mounting optical fiber 133 is shifted by laser welding after the alignment. Even if it is deviated, it can be suppressed to about 10% of the maximum coupling efficiency. Specifically, a high optical coupling efficiency of about 80% can be obtained.

Even if this first optical semiconductor module is not mounted in a package, if the semiconductor laser element 101 is energized in this state, characteristics such as light output and spectrum by pulse driving can be measured, and a good product inspection can be performed. Is possible. In addition, if it is temporarily fixed on an electronic cooler, characteristics such as optical output and spectrum when a direct current is applied, deterioration of optical coupling efficiency in a temperature cycle test, and a life test can be performed. Cooler can be saved.

In the first optical semiconductor module, the mounting optical fiber 133 and the optical fiber holder 135 are fixed to the second base 131.
Alternatively, it may be mounted on the outer wall of the package on which the first optical semiconductor module is installed.

Immediately after the alignment shown in FIG. 2 is completed,
In addition to measuring characteristics such as optical output and spectrum, dynamic characteristics can be evaluated by inputting analog or digital signals. In this case, an optical isolator can be inserted before the ferrule 114 or in the middle of the mounting optical fiber 113 as necessary.

Hereinafter, a second optical semiconductor module and a method of manufacturing the same according to the present invention will be described with reference to FIGS.

In FIG. 4A, reference numeral 201 denotes a semiconductor laser device; 202, a submount made of SiC; 203, a gold-plated copper stem;
01 is fixed on the submount 202, and the submount 202 is fixed on the stem 203 by soldering. Reference numeral 204 denotes a first base made of stainless steel, and a bottom surface of the first base 204 and a contact surface with the stem 203 are covered with gold. The first base 204 has a wall 205 extending vertically upward from the upper surface thereof. The wall 205 has an opening 208 through which a lens holder 207 holding an aspheric lens 206 is inserted.
The bottom surface of the first base 204 is flat and covered with gold. For this reason, it comes into contact with an electronic cooler composed of a Peltier element or the like over a wide area, and good heat exchange is performed.

The aspheric lens 206 is designed so that aberration is minimized with respect to the oscillation wavelength of the semiconductor laser element 201. A typical value of the aspheric lens 207 is about 1.9 mm in diameter,
The numerical aperture on the 1 side and the optical fiber side are about 0.6 and about 0.1, respectively, the focal length on the semiconductor laser element 201 side is about 0.4 mm, and the focal length on the optical fiber side is about 7 m.
m. Here, it is assumed that the focal length is a distance from the end face of the lens.

The aspherical lens lens 206 is fitted with high accuracy in a state where it slightly projects from the cylindrical lens holder 207 toward the semiconductor laser element 201. This fitting method is the same as that of the first optical semiconductor module. Thereby, the positional relationship between the aspherical lens 206 and the lens holder 207 and the optical axes of both are accurately matched.

The lens holder 207 has a jaw 210 having a thickness (about 2 mm or more) enough to give sufficient rigidity to the lens holder 207. Therefore, the lens holder 207 is required Does not bend or bend due to welding. Opening 20 of wall 205
There is a gap of about 0.5 mm or more between the lens 8 and the lens holder 207 for centering in the X and Y directions. The wide smooth end face 209 of the jaw 210 is located on the wall 2 of the first base 204.
05.

As described above, the focal length of the aspheric lens 206 on the semiconductor laser element 201 side is about 0.4 mm.
This is a design value, and may actually be slightly different due to the limit of processing accuracy. When the processing accuracy is poor, the focal position may deviate from the geometrical optical axis of the aspherical lens 206. Therefore, a preliminary experiment can be performed using the same semiconductor laser device and optical fiber to determine the actual focal position. The coordinates of the focal position thus obtained are (X1, Y1, Z1).
The origin is the end surface 211 of the aspheric lens 206.

As shown in FIG. 1, the positioning accuracy between the aspheric lens 206 in the Z direction (optical axis direction) and the semiconductor laser element 201 is allowed to be about ± 30 μm. This is a value that can be sufficiently handled by mechanical alignment. Therefore, the following description can be made.

First, the lens holder 207 is attached to the wall 205.
, And observed under a microscope from above, and displayed on a television monitor. Next, the stem 203 to which the semiconductor laser element 201 is fixed is sucked by the vacuum collet and brought on the first base 204. Using a television monitor, the stem 203 is fixed to the submount 203 by soldering so that the Z coordinate of the end face of the semiconductor laser element 201 matches Z1. With this method, a positioning accuracy of about ± 10 μm can be reliably obtained. At this time, the angle can also be adjusted so that the end face of the semiconductor laser element 201 is perpendicular to the optical axis.
Since the adjustment in the X and Y coordinate directions is performed in a later lens alignment process, it may be roughly determined.

In FIG. 4B, reference numeral 212 denotes an alignment optical fiber having a core diameter equal to or smaller than the core diameter of the mounting optical fiber, and reference numeral 213 denotes a double structure of stainless steel and zirconia and reinforces the alignment optical fiber 212. It is a cylindrical ferrule for performing. The ferrule 213
Is 2.5 mm, the supporting cylinder 214 having the same inner diameter as the outer diameter can be fitted to the ferrule 213. The support cylinder 214 is made of, for example, stainless steel, and can slightly expand and contract in the radial direction. As a method of expansion and contraction, there is a method of warming and expanding, or a method of cutting a part of the circumference and pressing it from the outside with a spring.
Thus, by simply inserting the ferrule 213 into the support cylinder 214, the ferrule 213 is held by the support cylinder 214, and the centers of both ferrules 213 are accurately aligned.

A cylindrical spacer 215 having the same outer diameter as the ferrule 213 is fitted into the supporting cylinder 214. The right end of the lens holder 207 in FIG. 4B is cut so as to have the same outer diameter as the ferrule 213, and the ferrule 213, the spacer 215, and the lens holder 207 are formed so that no gap is formed between them. Into the supporting cylinder 214. In this case, the length of the spacer 215 is predetermined so that the alignment optical fiber 212 is accurately located at the focal point of the aspherical lens 206. Spacers 215 are used to increase dimensional accuracy.
Is preferably made of a ceramic such as zirconia with high processing accuracy. Lens holder 207 and spacer 2
15 is held simply by being inserted into the supporting cylinder 214.

As shown in FIGS. 4A and 4B, the Z axis is in the optical axis direction, the X axis is in a direction parallel to the upper surface of the first base 204 and perpendicular to the optical axis, and The Y axis is taken in a direction perpendicular to the upper surface. In this case, the alignment does not need to be performed with the Z-axis direction set in the vertical direction.

Hereinafter, the steps of aligning and fixing the alignment optical fiber 212, the aspheric lens 206, and the semiconductor laser element 201 will be described with reference to FIG.

First, after fixing the first base 204 to a table (not shown), current is supplied to the semiconductor laser element 201 by the current supply sources 216 and 217. Support cylinder 214
Is mounted on a precision three-axis stage for alignment.

While a constant current is applied to the semiconductor laser element 201 to cause laser oscillation, the alignment optical fiber 212
In order to maximize the amount of light entering, the flange 210 is
With a precision three-axis stage while pressing against
14 in the X and Y directions. At this time, the aspherical lens 2
Although the alignment accuracy of 06 is determined by the accuracy of the precision three-axis stage, alignment can be performed within an accuracy of about ± 0.5 μm. Further, since the core diameter of the optical fiber 212 for alignment is the same as or smaller than the core diameter of the optical fiber for mounting, the positional deviation of the optical fiber 212 for alignment with respect to the semiconductor laser element 201 appears sensitively as a change in the amount of light. Alignment is possible. Similar to the first optical semiconductor module, despite the alignment of the three bodies including the semiconductor laser element 201, the aspherical lens 206, and the optical fiber 212 for alignment, it is as if the X, Y alignment is performed like the alignment between two bodies. , Can be adjusted only by one movement in the Z direction.

The aspherical lens 206 and the optical fiber 2 for alignment are maintained while maintaining the state where the three alignments have been performed.
If 12 can be fixed, a value exceeding 90% can be obtained as the coupling efficiency to the final mounting optical fiber. However, the lens holder 207 and the first base 20
When the fourth wall portion 205 is laser-welded at the portion 218, the position of the aspherical lens 206 is slightly shifted from that at the time of alignment due to a change in volume at the time of condensation at the melting point. However,
The lens holder 207 and the wall 20 of the first base 204
Since there is no gap between the five cities, the above-mentioned amount of displacement is much smaller than that of the first optical semiconductor module.

As described above, the aspheric lens 206
Is fixed to the semiconductor laser element 201, and then the support cylinder 214 is removed.

The steps of aligning and fixing the mounting optical fiber 233 and the aspherical lens 206 will be described below with reference to FIG.

In FIG. 5, reference numeral 230 denotes a second base made of stainless steel, and the second base 230 has an opening 231 through which laser light passes. The second base 230 is laser-welded to the jaw 210 of the lens holder 207. An optical isolator 232 is fixed inside the second base 230. The bottom surface of the second base 230 is flat and covered with gold. For this reason, the bottom surface of the second base 230 is fixed to the electronic cooler made of a Peltier element or the like by solder over a wide area, and good heat exchange is performed, whereby the temperature of the optical isolator 132 is precisely controlled.

In FIG. 5, reference numeral 234 denotes a cylindrical ferrule for reinforcing the mounting optical fiber 233. The ferrule 234 has a double structure of stainless steel and zirconia. An optical fiber holder 235 has an inner wall surface 236 formed into a smooth circular shape. Ferrule 234 and optical fiber holder 23
5 is usually about ± 20 μm, but if the precision is further improved, the fitting margin can be made about ± 10 μm. As a result, the ferrule 234 slides smoothly with respect to the optical fiber holder 235.

The alignment is performed with the Z direction being the vertical direction. The first base 204 is fixed to a base (not shown), and supplies a current to the semiconductor laser element 201 through current supply lines 216 and 217. The ferrule 234 is attached to a precision three-axis stage for alignment. At this time, the optical fiber holder 235 is moved by the second base 230 due to gravity.
Is in contact with the end surface 237 of the

While a constant current is applied to the semiconductor laser element 201 to cause laser oscillation, the mounting optical fiber 233 is
The ferrule 234 is moved in the X, Y, and Z directions by a precision three-axis stage so that the amount of light entering the light source becomes maximum. At this time, although the alignment accuracy of the aspheric lens 206 is determined by the accuracy of the precision three-axis stage, the alignment can be performed within an accuracy of about ± 0.5 μm. By aligning the mounting optical fiber 233 with respect to the aspherical lens 206 having a slight amount of misalignment, even if the position of the mounting optical fiber 233 is deviated from the time of alignment by subsequent laser welding, almost the highest. Coupling efficiency is maintained.

Even if the second optical semiconductor module is not assembled in a package, if the semiconductor laser element 201 is energized in this state, characteristics such as light output and spectrum by pulse driving can be measured, and non-defective products can be inspected. Is possible. Also, if it is temporarily fixed on an electronic cooler, characteristics such as optical output and spectrum when a direct current is applied, evaluation of deterioration of optical coupling efficiency in a temperature cycle test, and a life test can be performed. Electronic cooler can be saved.

In the second optical semiconductor module, the mounting optical fiber 233 and the optical fiber holder 235 are fixed to the second base 230.
Alternatively, the first optical semiconductor module may be attached to an outer wall of a package in which the first optical semiconductor module is installed.

Immediately after the alignment shown in FIG. 4B, characteristics such as optical output and spectrum can be measured, and dynamic characteristics can be evaluated by inputting analog or digital signals. In this case, if necessary, the ferrule 21
An optical isolator can be inserted before the optical fiber 3 or in the middle of the optical fiber 212 for alignment.

Further, it goes without saying that the above-described method of aligning the precision lens and the optical fiber can be applied to an optical semiconductor element having a small light incident surface or light exit surface, such as a high-speed LED or a high-speed light receiving element.

[0092]

According to the method for manufacturing an optical semiconductor module according to the first aspect of the present invention, the mounting optical fiber holding the mounting optical fiber is maximized so that the amount of light emitted from the light emitting element and incident on the mounting optical fiber is maximized. The optical fiber holder is moved three-dimensionally with respect to the light emitting element, and the mounting optical fiber holder is fixed to the lens holder in this state, so that the deviation of the optical axis between the light emitting element and the lens due to welding or soldering is corrected. As a result, the deviation of the optical axis is suppressed to about 10% of the maximum coupling efficiency, whereby a high coupling efficiency can be obtained.

When the composite part is moved, the lens and the optical fiber for alignment are simultaneously moved. Therefore, in the third step, the lens, that is, the lens holder is moved in three directions, and the light enters the optical fiber for alignment. Since the state in which the amount of light is maximized is obtained, it is not necessary to move the optical fiber for alignment in accordance with the movement of the lens, and the operation of moving the optical fiber for alignment in three directions while moving the lens in three directions is possible. This is unnecessary, and the time required for the alignment process can be greatly reduced.

Further, before fixing the lens holder to the base in a state in which the amount of light emitted from the light emitting element and entering the optical fiber for alignment is maximized, characteristics such as light output and spectrum of the light emitting element, or signal transmission before fixing the lens holder to the base. Performing an evaluation test of characteristics and the like can save the trouble of performing a characteristic evaluation test of the light emitting element later, and when the light emitting element is found to be defective,
Since the fixing of the lens can be stopped, parts can be saved.

According to the method of manufacturing an optical semiconductor module according to the second or fifth aspect of the present invention, the core diameter of the optical fiber for alignment is smaller than the core diameter of the optical fiber for mounting, so that the coupling efficiency required for the optical fiber for mounting is higher than that. Since the lens can be fixed to the light emitting element with the accuracy described above, the coupling efficiency to the mounting optical fiber is further improved.

According to the method of manufacturing an optical semiconductor module according to the third aspect of the present invention, since the base holding the light emitting element has the wall perpendicular to the optical axis of the light emitted from the light emitting element, the lens holder By fixing to the wall of the base, the lens holder can be easily fixed to the base.

According to the method of manufacturing an optical module according to the fourth aspect of the present invention, similarly to the first aspect of the present invention, the mounting optical fiber is set so that the amount of light emitted from the light emitting element and incident on the mounting optical fiber is maximized. The held mounting optical fiber holder is moved three-dimensionally with respect to the light emitting element,
In this state, the mounting optical fiber holder is fixed to the lens holder, so that the deviation of the optical axis between the light emitting element and the lens due to welding or soldering is corrected,
High coupling efficiency is obtained.

When the composite component is moved, the lens and the optical fiber for alignment are simultaneously moved. Therefore, in the third step, the lens, that is, the lens holder is moved only in two directions to be incident on the optical fiber for alignment. Since the state in which the amount of light is maximized is obtained, it is not necessary to move the optical fiber for alignment in accordance with the movement of the lens, and it is necessary to move the optical fiber for alignment in two directions while moving the lens in two directions. This is unnecessary, and the time required for the alignment process can be greatly reduced.

Further, similarly to the first aspect of the present invention, before fixing the lens holder to the base in a state where the amount of light emitted from the light emitting element and entering the optical fiber for alignment is maximized, the light output of the light emitting element is adjusted. An evaluation test can be performed on characteristics such as spectrum and spectrum or signal transmission characteristics.

[Brief description of the drawings]

FIG. 1 is a characteristic diagram showing a change in optical coupling efficiency when the deterioration of optical coupling efficiency due to a displacement of a lens is recovered by readjustment of the position of an optical fiber.

FIG. 2 is a cross-sectional view illustrating a method for manufacturing a first optical semiconductor module according to the present invention.

FIG. 3 is a cross-sectional view showing a configuration of a first optical semiconductor module according to the present invention and a method for manufacturing the same.

FIG. 4 is a sectional view illustrating a method for manufacturing a second optical semiconductor module according to the present invention.

FIG. 5 is a cross-sectional view illustrating a configuration of a second optical semiconductor module according to the present invention and a method for manufacturing the same.

6A and 6B show a first conventional semiconductor module, and FIG.
FIG. 6 is a side sectional view, and FIG. 6B is a sectional view taken along line VI-VI in FIG.

FIG. 7 is a side sectional view showing a second conventional semiconductor module.

FIG. 8 is a side sectional view showing a third conventional semiconductor module.

FIG. 9 is a schematic configuration diagram for explaining a problem of a conventional semiconductor module.

[Explanation of symbols]

 Reference Signs List 101 semiconductor laser element 102 submount 103 stem 104 first base 105 wall 106 opening 107 aspherical lens 108 second holder 109 outer wall of second holder 110 first holder 111 inner wall of first holder 112 End face of the first holder 113 Optical fiber for alignment 113 Ferrule 115 Cylinder for support 116 Spacer 117, 118 Current supply line 130 Second base 131 Opening 132 Optical isolator 133 Optical fiber for mounting 134 Ferrule 135 Optical fiber holder 136 Optical fiber holder Inner wall surface 137 Second base wall portion 201 Semiconductor laser device 202 Submount 203 Stem 204 First base 205 First base wall 206 Aspherical lens 207 Lens lens Der 208 Opening 209 End face of jaw part of lens holder 210 Flange part of lens holder 211 End face of aspherical lens (coordinate origin) 212 Optical fiber for alignment 213 Ferrule 214 Cylinder for support 215 Spacer 216, 217 Current supply line 230 Second Base 231 Opening 232 Optical isolator 233 Mounting optical fiber 234 Ferrule 235 Optical fiber holder 236 Inner wall surface of optical fiber holder 237 End face of second base

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-313048 (JP, A) JP-A-1-310319 (JP, A) JP-A-3-10557 (JP, U) JP-A 64- 40808 (JP, U) JP-A 1-1111209 (JP, U) (58) Field surveyed (Int. Cl. ⁶ , DB name) G02B 6/42

Claims (5)

(57) [Claims] 1. A lens is provided at one end of a supporting cylindrical member.
Fit the held cylindrical lens holder and support it
Hold the alignment optical fiber on the other end of the cylindrical member.
And an outer diameter substantially equal to the inner diameter of the supporting cylindrical member.
Fits cylindrical optical fiber holder for alignment with diameter
And the laser inside the supporting cylindrical member.
Between the holder and the optical fiber holder for alignment.
The incident part of the optical fiber for alignment is the focus of the lens.
The lens holder and the alignment optical
Having a length that regulates the distance from the fiber holder, and
Cylindrical with an outer diameter approximately equal to the inner diameter of the supporting cylindrical member
By inserting the spacer of
Iva can obtain the maximum coupling efficiency for the lens
The alignment optical fiber holder in the lens holder
And the support cylindrical member and the lens holder.
A first step of obtaining a composite part comprising an optical fiber holder for alignment and a spacer; and a second step of arranging the composite part such that the lens is opposed to an emission part of a light emitting element held by a base. And emitting the light from the light emitting element and guiding the emitted light to an incident portion of the alignment optical fiber, and setting the composite component so that the amount of light incident on the alignment optical fiber is maximized. A third step of moving three-dimensionally with respect to the light emitting element, a fourth step of fixing the lens holder to the base in a state where the amount of light incident on the alignment optical fiber is maximized, A fifth step of removing the alignment optical fiber holder from the lens holder; and emitting light from the light emitting element and holding the emitted light by the mounting optical fiber holder. A sixth step of three-dimensionally moving the mounting optical fiber holder with respect to the light emitting element so as to guide the mounting optical fiber to the incident portion of the mounting optical fiber and to maximize the amount of light incident on the mounting optical fiber; Fixing the mounting optical fiber holder to the lens holder in a state where the amount of light incident on the mounting optical fiber is maximized. 7. A method for manufacturing an optical semiconductor module, comprising: 2. The method for manufacturing an optical semiconductor module according to claim 1, wherein a core diameter of the optical fiber for alignment is smaller than a core diameter of the optical fiber for mounting. 3. The base in the second step has a wall perpendicular to an optical axis of light emitted from a light-emitting element held by the base. 2. The method for manufacturing an optical semiconductor module according to claim 1, further comprising a step of fixing the optical semiconductor module to a wall of the base. 4. A lens is provided at one end of the supporting cylindrical member.
Fit the held cylindrical lens holder and support it
Hold the alignment optical fiber on the other end of the cylindrical member.
And an outer diameter substantially equal to the inner diameter of the supporting cylindrical member.
Fits cylindrical optical fiber holder for alignment with diameter
And the laser inside the supporting cylindrical member.
Between the holder and the optical fiber holder for alignment.
The incident part of the optical fiber for alignment is the focus of the lens.
The lens holder and the alignment optical
Having a length that regulates the distance from the fiber holder, and
Cylindrical with an outer diameter approximately equal to the inner diameter of the supporting cylindrical member
By inserting the spacer of
Iva can obtain the maximum coupling efficiency for the lens
The alignment optical fiber holder in the lens holder
And the support cylindrical member and the lens holder.
A first step of obtaining a composite component comprising an optical fiber holder for alignment and a spacer ; and holding the light emitting element on a base having a wall perpendicular to the optical axis of light emitted from the light emitting element. And a second step of arranging the composite component such that the lens faces an emission portion of the light emitting element held by the base and the lens holder is in contact with the wall, and emits light from the light emitting element. And guiding the emitted light to an incident portion of the alignment optical fiber, and moving the composite component through the optical axis of the light emitted from the light emitting element such that the amount of light incident on the alignment optical fiber is maximized. A third step of moving two-dimensionally in a plane perpendicular to and a fourth step of fixing the lens holder to the base in a state where the amount of light incident on the alignment optical fiber is maximized; The alignment light A fifth step of removing the fiber holder from the lens holder, and emitting light from the light emitting element and guiding the emitted light to an incident portion of the mounting optical fiber held by the mounting optical fiber holder; A sixth step of three-dimensionally moving the mounting optical fiber holder with respect to the light emitting element so that the amount of incident light is maximized; and the incident portion of the mounting optical fiber is located at the focal point of the lens Fixing the mounting optical fiber holder to the lens holder in a state. 5. The method for manufacturing an optical semiconductor module according to claim 4, wherein the core diameter of the optical fiber for alignment is smaller than the core diameter of the optical fiber for mounting.