JPS60748A - Probe card for semiconductor - Google Patents
Probe card for semiconductorInfo
- Publication number
- JPS60748A JPS60748A JP10766783A JP10766783A JPS60748A JP S60748 A JPS60748 A JP S60748A JP 10766783 A JP10766783 A JP 10766783A JP 10766783 A JP10766783 A JP 10766783A JP S60748 A JPS60748 A JP S60748A
- Authority
- JP
- Japan
- Prior art keywords
- needle
- beams
- fixed
- point
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は半導体用プローブカードに係り、特に半導体用
ウェハーなどのプローブカードに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a probe card for semiconductors, and particularly to a probe card for semiconductor wafers and the like.
従来の半纏体用プローブカードは、第1図に示すように
プリント基板11こ固定されたニードル支持部2にニー
ドル3が固定されで構成されでいる。As shown in FIG. 1, a conventional probe card for a half-wrapped body consists of a needle 3 fixed to a needle support part 2 to which a printed circuit board 11 is fixed.
しかしながら、かかるプローブカードは、ブロービング
作秦中、半導体ウェハープローブパッド4にニードル先
端5を押付け、オーバードライブmyを与えた場合、ニ
ードル先端5が半径R7の円弧に近い弾性変形をし、水
平方向変位Xが発生する。この水平方向変位Xによりパ
ッド4に大きな傷跡が生じ、完成素子の信頼性を低下さ
せている。However, in such a probe card, when the needle tip 5 is pressed against the semiconductor wafer probe pad 4 and an overdrive my is applied during the blowing process, the needle tip 5 is elastically deformed into a circular arc with a radius R7, and the needle tip 5 deforms horizontally. A displacement X occurs. This horizontal displacement X causes large scars on the pad 4, reducing the reliability of the completed device.
またブロービング作栗中の目合せ作業においで水平方向
変位Xが生じるため、合せ地点の決定が難かしく、作業
に熟練を要するなどの欠点があった。In addition, since horizontal displacement X occurs during alignment work during brobbing chestnut making, it is difficult to determine the alignment point, and the work requires skill.
本発明の目的は、ニードル先端にオーバドライブがかか
つでも水平方向変位が発生しなく、また水平方向変位が
必要な場合にもこの値を一定にすることができる半導体
用プローブカードを提供する仁とにある。An object of the present invention is to provide a probe card for semiconductors that does not cause horizontal displacement even when overdrive is applied to the needle tip, and that can maintain a constant value even when horizontal displacement is required. There it is.
本発明は、ニードル支持部に固定された2個の梁と、こ
の梁の先端を結ぶニードル先端部とによリニードルを構
成し、前記ニードル支持部の前記梁の固定部間と、前記
2個の梁と、前記ニードル先端部とで四辺形形状または
これに類似する形状に、かつ前記ニードル支持部の梁固
定部間の長さを前記ニードル先端部の長さより長く形成
したことを特徴とする。In the present invention, a needle is configured by two beams fixed to a needle support part and a needle tip part connecting the tips of the beams, and a part between the fixed parts of the beams of the needle support part and a needle tip part connecting the tips of the beams. The beam and the needle tip have a quadrilateral shape or a shape similar to this, and the length between the beam fixing parts of the needle support part is longer than the length of the needle tip. .
以下、本発明の一実施例を第2図により説明する。プリ
ント基板10ζこ固定されたニードル支持部11に固定
されたニードル12は、前記ニードル支持部11に固定
された2個の梁13.14と、この梁13.14の先端
を結ぶニードル先端部15とにより構成されでいる。そ
して、第31M1fこ示すように、ニードル支持部11
の梁13.14の固定部間の長さをa1梁13.14の
長・さをそれぞれす、c、ニードル先端部15の長さを
dとすると、これら辺a1b、、c、dで四辺形状に、
かつ辺aを辺dより長く形成されている。An embodiment of the present invention will be described below with reference to FIG. The needle 12 fixed to the needle support 11 fixed to the printed circuit board 10ζ has two beams 13.14 fixed to the needle support 11 and a needle tip 15 connecting the tips of the beams 13.14. It is composed of. Then, as shown in the 31st M1f, the needle support part 11
Let the length between the fixed parts of the beams 13.14 be a1, the length of the beams 13.14 be respectively c, and the length of the needle tip 15 be d, then these sides a1b, c, and d are the four sides. In shape,
In addition, side a is formed longer than side d.
次に作用について説明する。オーバードライブ量yがか
かった場合、辺すは半径ル2、辺Cは半径R3の円弧に
近い形で弾性変形する。そこで、a ) dの条件の下
で適当にc、dの長さを定めると、ニードル先端15の
水平方向変位Xを殆んどなくすることができる。またウ
ェハープローブパッドへの良好な電気接触を得るため、
わずかに適当な水平方向変位Xが必要な場合も、a )
dの条件の下で適当にc、dの長さを定めることによ
り、オーバードライブ量yfこ殆んど影響されないで安
定した水平方向変位Xが得られる。Next, the effect will be explained. When an overdrive amount y is applied, the side is elastically deformed in a shape close to a circular arc with a radius of 2, and the side C with a radius of R3. Therefore, if the lengths of c and d are determined appropriately under the conditions of a) and d, the horizontal displacement X of the needle tip 15 can be almost eliminated. Also, to obtain good electrical contact to the wafer probe pad,
Even if a slightly appropriate horizontal displacement X is required, a)
By appropriately determining the lengths of c and d under the condition of d, a stable horizontal displacement X can be obtained with little influence on the overdrive amount yf.
なお、上記実施例においでは、梁13.14およびニー
ドル先端部15?ii汀線状に形成したが、曲線または
2つ以上の直線に造形し組会せでもよい。In the above embodiment, the beams 13, 14 and the needle tip 15? (ii) Although it is formed into a shoreline shape, it may be formed into a curved line or two or more straight lines and assembled.
本発明によれば、オーバードライブ量がかかった場合、
水平方向変位をなくすることができ、また水平方向変位
が必要な場合もオーバードライブ量ζこかかイつらず水
平方向変位の値を一定にすることができるので、ウエハ
ーブローブパッドノ傷跡状況の哲西里が容易になる。こ
のため、次工程のワイヤポンディング製作工程などの製
品信頼性が向上する。また水平方向変位がなくなること
により、プローブ作柔におけるウェハープローブパッド
との目合せ裕度が増え、作築が容易になり、プローブ検
査中におけるニードル位置ずれ不良も低減する。According to the present invention, when an overdrive amount is applied,
It is possible to eliminate horizontal displacement, and even if horizontal displacement is required, the value of horizontal displacement can be kept constant without overdrive amount ζ, so it is possible to improve the situation of wafer probe pad scars. Tetsuri becomes easier. Therefore, product reliability in the next process, such as the wire bonding manufacturing process, is improved. Furthermore, since there is no horizontal displacement, alignment margin with the wafer probe pad during probe fabrication increases, fabrication becomes easier, and defective needle misalignment during probe testing is reduced.
第1図は従来例の(lt’l itt+図、第2図は本
発明の一実施例を示す側面図、第3図は纂2図の機能説
明図である。
10・・・プリント基板、 11・・・ニードル支持部
、12・・・ニードル、 13.14・・・梁、15・
・・ニードル先端部。
第1図
第3図Fig. 1 is a diagram of a conventional example, Fig. 2 is a side view showing an embodiment of the present invention, and Fig. 3 is a functional explanatory diagram of Fig. 2. 10... Printed circuit board, DESCRIPTION OF SYMBOLS 11... Needle support part, 12... Needle, 13.14... Beam, 15...
...Needle tip. Figure 1 Figure 3
Claims (1)
固定されでなるプローブカードにおいて、前記ニードル
は、前記ニードル支持部に固定された2個の梁と、この
梁の先端を結ぶニードル先端部とよりなり、前記ニード
ル支持部の前記梁の固定部間と、前記2個の梁と、前記
ニードル先端部とで四辺形形状またはこれに類似する形
状に、かつ前記ニードル支持部の梁固定部間の長さを前
記ニードル先端部の長さより長く形成したことを特徴と
する半導体用プローブカード。In a probe card in which a needle is fixed to a needle support part fixed to a printed circuit board, the needle consists of two beams fixed to the needle support part and a needle tip part connecting the tips of the beams. , the distance between the fixed parts of the beams of the needle support part, the two beams and the tip of the needle have a quadrilateral shape or a shape similar thereto, and the length between the fixed parts of the beams of the needle support part. A probe card for a semiconductor, characterized in that the length of the needle is longer than the length of the tip of the needle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10766783A JPS60748A (en) | 1983-06-17 | 1983-06-17 | Probe card for semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10766783A JPS60748A (en) | 1983-06-17 | 1983-06-17 | Probe card for semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60748A true JPS60748A (en) | 1985-01-05 |
Family
ID=14464949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10766783A Pending JPS60748A (en) | 1983-06-17 | 1983-06-17 | Probe card for semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60748A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005121813A1 (en) * | 2004-06-08 | 2005-12-22 | University Of Durham | Improvements in or relating to probe cards |
JP2008164636A (en) * | 2008-03-17 | 2008-07-17 | Hioki Ee Corp | Fixing tool for contact probe |
JP2010078617A (en) * | 2010-01-08 | 2010-04-08 | Hioki Ee Corp | Fixing tool for contact probe |
JP2014035335A (en) * | 2012-08-10 | 2014-02-24 | Micronics Japan Co Ltd | Contact probe and probe card |
-
1983
- 1983-06-17 JP JP10766783A patent/JPS60748A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005121813A1 (en) * | 2004-06-08 | 2005-12-22 | University Of Durham | Improvements in or relating to probe cards |
JP2008164636A (en) * | 2008-03-17 | 2008-07-17 | Hioki Ee Corp | Fixing tool for contact probe |
JP2010078617A (en) * | 2010-01-08 | 2010-04-08 | Hioki Ee Corp | Fixing tool for contact probe |
JP2014035335A (en) * | 2012-08-10 | 2014-02-24 | Micronics Japan Co Ltd | Contact probe and probe card |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6211229A (en) | Electron-beam exposure method | |
JP2509285B2 (en) | Semiconductor device testing method | |
JPS60748A (en) | Probe card for semiconductor | |
JPH03231438A (en) | Probe card and probe device using the same | |
JPH1151970A (en) | Probe card | |
JPS5818948A (en) | Lead frame | |
JPH03290940A (en) | Wafer table of probing machine | |
JPH10223705A (en) | Probe card | |
JPS63234544A (en) | Semiconductor device | |
JPS6023983Y2 (en) | Package for semiconductor devices | |
JPH06260540A (en) | Prober | |
JPS59208469A (en) | Probe card | |
JPH01150863A (en) | Probe card | |
JPS6366957A (en) | Package for semiconductor integrated circuit | |
JP2639342B2 (en) | Pad for mounting electronic component and inspection method of pad and electronic component | |
KR100571383B1 (en) | Probe card | |
JPH04111328A (en) | Integrated circuit device | |
JPH03233950A (en) | Flexible tape and mounting structure of semiconductor chip | |
JPH10189192A (en) | High-frequency socket | |
JPS63169038A (en) | Probe card | |
JPH05267527A (en) | Structure of lead frame for semiconductor device | |
JPH022615A (en) | Manufacture of semiconductor device | |
JPH04150047A (en) | Wafer prober | |
JPH01293644A (en) | Socket provided with jig for lead connection | |
JPS60135882A (en) | Measurement of diameter of ion beam |