JPS6073244U - IC fixing device - Google Patents
IC fixing deviceInfo
- Publication number
- JPS6073244U JPS6073244U JP16534283U JP16534283U JPS6073244U JP S6073244 U JPS6073244 U JP S6073244U JP 16534283 U JP16534283 U JP 16534283U JP 16534283 U JP16534283 U JP 16534283U JP S6073244 U JPS6073244 U JP S6073244U
- Authority
- JP
- Japan
- Prior art keywords
- package body
- fixing device
- hole
- pattern
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のものの一例を示す展開斜視図、第2図は
第1図のものの固定状態を示す要部の拡大断面図、第3
図はこの考案の一実施例を示す展開斜視図、第4図は第
3図のものの固定状態を示す要部の拡大断面図、第5図
はこの考案の他の実施例を示す展開斜視図である。
1.11:ICパッケージ本体、2,12:端子ピン、
3:傾斜面、4,14ニブリント基板、5:孔、6.1
6:パターン、7:切欠部、8:切残部。Fig. 1 is an exploded perspective view showing an example of the conventional one, Fig. 2 is an enlarged sectional view of the main part showing the fixed state of the one in Fig. 1, and Fig. 3
The figure is an exploded perspective view showing one embodiment of this invention, Fig. 4 is an enlarged sectional view of the main part of the one shown in Fig. 3 in a fixed state, and Fig. 5 is an exploded perspective view showing another embodiment of this invention. It is. 1.11: IC package body, 2, 12: terminal pin,
3: Inclined surface, 4, 14 Niblint substrate, 5: Hole, 6.1
6: pattern, 7: cutout, 8: cutout remaining.
Claims (1)
た孔を形成するとともに、この孔にICパッケージ本体
が嵌合されたときICパッケージ本体の周囲から直線状
に延びた多数の端子ピンにそれぞれ対応する位置にはん
だ付は用パターンを形成してなるICの固定装置。A hole is formed in the printed circuit board that matches the size of the IC package body, and when the IC package body is fitted into the hole, each corresponds to a large number of terminal pins extending linearly from the periphery of the IC package body. An IC fixing device formed by forming a pattern for soldering in position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16534283U JPS6073244U (en) | 1983-10-27 | 1983-10-27 | IC fixing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16534283U JPS6073244U (en) | 1983-10-27 | 1983-10-27 | IC fixing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6073244U true JPS6073244U (en) | 1985-05-23 |
Family
ID=30362268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16534283U Pending JPS6073244U (en) | 1983-10-27 | 1983-10-27 | IC fixing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6073244U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5856447A (en) * | 1981-09-11 | 1983-04-04 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Identification card and method of producing same |
-
1983
- 1983-10-27 JP JP16534283U patent/JPS6073244U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5856447A (en) * | 1981-09-11 | 1983-04-04 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Identification card and method of producing same |
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