JPS6073244U - IC fixing device - Google Patents

IC fixing device

Info

Publication number
JPS6073244U
JPS6073244U JP16534283U JP16534283U JPS6073244U JP S6073244 U JPS6073244 U JP S6073244U JP 16534283 U JP16534283 U JP 16534283U JP 16534283 U JP16534283 U JP 16534283U JP S6073244 U JPS6073244 U JP S6073244U
Authority
JP
Japan
Prior art keywords
package body
fixing device
hole
pattern
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16534283U
Other languages
Japanese (ja)
Inventor
奈良　弘敏
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP16534283U priority Critical patent/JPS6073244U/en
Publication of JPS6073244U publication Critical patent/JPS6073244U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のものの一例を示す展開斜視図、第２図は
第１図のものの固定状態を示す要部の拡大断面図、第３
図はこの考案の一実施例を示す展開斜視図、第４図は第
３図のものの固定状態を示す要部の拡大断面図、第５図
はこの考案の他の実施例を示す展開斜視図である。 １．１１：ＩＣパッケージ本体、２，１２：端子ピン、
３：傾斜面、４，１４ニブリント基板、５：孔、６．１
６：パターン、７：切欠部、８：切残部。Fig. 1 is an exploded perspective view showing an example of the conventional one, Fig. 2 is an enlarged sectional view of the main part showing the fixed state of the one in Fig. 1, and Fig. 3
The figure is an exploded perspective view showing one embodiment of this invention, Fig. 4 is an enlarged sectional view of the main part of the one shown in Fig. 3 in a fixed state, and Fig. 5 is an exploded perspective view showing another embodiment of this invention. It is. 1.11: IC package body, 2, 12: terminal pin,
3: Inclined surface, 4, 14 Niblint substrate, 5: Hole, 6.1
6: pattern, 7: cutout, 8: cutout remaining.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板に、ＩＣパッケージ本体の大きさに適合し
た孔を形成するとともに、この孔にＩＣパッケージ本体
が嵌合されたときＩＣパッケージ本体の周囲から直線状
に延びた多数の端子ピンにそれぞれ対応する位置にはん
だ付は用パターンを形成してなるＩＣの固定装置。A hole is formed in the printed circuit board that matches the size of the IC package body, and when the IC package body is fitted into the hole, each corresponds to a large number of terminal pins extending linearly from the periphery of the IC package body. An IC fixing device formed by forming a pattern for soldering in position.
JP16534283U 1983-10-27 1983-10-27 IC fixing device Pending JPS6073244U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16534283U JPS6073244U (en) 1983-10-27 1983-10-27 IC fixing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16534283U JPS6073244U (en) 1983-10-27 1983-10-27 IC fixing device

Publications (1)

Publication Number Publication Date
JPS6073244U true JPS6073244U (en) 1985-05-23

Family

ID=30362268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16534283U Pending JPS6073244U (en) 1983-10-27 1983-10-27 IC fixing device

Country Status (1)

Country Link
JP (1) JPS6073244U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856447A (en) * 1981-09-11 1983-04-04 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Identification card and method of producing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856447A (en) * 1981-09-11 1983-04-04 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Identification card and method of producing same

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