JPS58147272U - electronic parts equipment - Google Patents
electronic parts equipmentInfo
- Publication number
- JPS58147272U JPS58147272U JP4446782U JP4446782U JPS58147272U JP S58147272 U JPS58147272 U JP S58147272U JP 4446782 U JP4446782 U JP 4446782U JP 4446782 U JP4446782 U JP 4446782U JP S58147272 U JPS58147272 U JP S58147272U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- lead pins
- electronic parts
- parts equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の電子部品装置を示す斜視図、第２図およ
び第３図は本考案の電子部品装置の一実施例を示す斜視
図および側面図、第４図は本考案の電子部品装置の他の
実施例を示す斜視図である。
１・・・・・・電子部品、′２・・・・・・側面、３・
・・・・・リードピ。
ン、４・・・・・・回路基板、５・・・・・・電子部品
の対向面、 。
６・・・・・・回路パターン、７・・・・・・折曲され
たリードピン、８・・・・・・貫通孔。FIG. 1 is a perspective view showing a conventional electronic component device, FIGS. 2 and 3 are perspective views and side views showing an embodiment of the electronic component device of the present invention, and FIG. 4 is a perspective view of the electronic component device of the present invention. FIG. 3 is a perspective view showing another embodiment of the invention. 1...Electronic parts, '2...Side, 3.
...Leadpi. 4... Circuit board, 5... Opposing surface of electronic components. 6...Circuit pattern, 7...Bent lead pin, 8...Through hole.
Claims (1)
その電子部品のリードピンを回路基板の回路パターンに
重ねて接続してなる電子部品装置において、前記電子部
品が前記リードピンのうち前記回路基板に対向する前記
電子部品を対向面を横切って突出するよう折曲された少
なくとも２本のリードピンを有し、この折曲されたリー
ドピンを前記回路基板に形成した貫通孔に挿通して前記
回路パターンに接続してなることを特徴とする電子部品
装置。Placing flat packaged electronic components on a circuit board,
In an electronic component device in which lead pins of the electronic component are overlapped and connected to a circuit pattern of a circuit board, the electronic component is folded such that one of the lead pins of the electronic component that faces the circuit board protrudes across the opposing surface. An electronic component device comprising at least two bent lead pins, the bent lead pins being inserted into through holes formed in the circuit board and connected to the circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4446782U JPS58147272U (en) | 1982-03-29 | 1982-03-29 | electronic parts equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4446782U JPS58147272U (en) | 1982-03-29 | 1982-03-29 | electronic parts equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58147272U true JPS58147272U (en) | 1983-10-03 |
Family
ID=30055522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4446782U Pending JPS58147272U (en) | 1982-03-29 | 1982-03-29 | electronic parts equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58147272U (en) |
-
1982
- 1982-03-29 JP JP4446782U patent/JPS58147272U/en active Pending
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