JPS58164160U - electrical equipment - Google Patents
electrical equipmentInfo
- Publication number
- JPS58164160U JPS58164160U JP6266282U JP6266282U JPS58164160U JP S58164160 U JPS58164160 U JP S58164160U JP 6266282 U JP6266282 U JP 6266282U JP 6266282 U JP6266282 U JP 6266282U JP S58164160 U JPS58164160 U JP S58164160U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- electrical equipment
- boards
- relay device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面はこの考案の一実施例を示し、第１図は電子タイマ
に使用されるリレー装置を示す縦断正面図。第２図はそ
の縦断側面図。第３図はリレー装置のメインプリント基
板を示す斜視図。第４図はそのハイブリツ）−ＩＣ基板
を示す斜視図である。
２・・・・・・リレ一本体、３・・・・・・メインプリ
ント基板、４・・・・・・ハイブリットＩＣ基板、５・
・・・・・ケース、８・・・・・・容量の大きい電子素
子、９・・・・・・容量の小さい電子素子。The drawings show an embodiment of this invention, and FIG. 1 is a longitudinal sectional front view showing a relay device used in an electronic timer. Figure 2 is a longitudinal side view. FIG. 3 is a perspective view showing the main printed circuit board of the relay device. FIG. 4 is a perspective view showing the hybrid IC board. 2... Relay body, 3... Main printed circuit board, 4... Hybrid IC board, 5...
...Case, 8...Electronic element with large capacity, 9...Electronic element with small capacity.
Claims (1)
基板とを備えたリレー装置であって、前記容量の大きい
電子素子をメインプリント基板に塔載し、それ以外の電
子素子をハイブリットＩＣ基板に塔載して設け、 前記両基板に塔載した各種素子が互いに干渉しあわない
間隔を隔てた直交位置にこれら基板を直交状態に一体に
接続してケースにね白したリレー装置。[Scope of Claim for Utility Model Registration] A relay device comprising a relay main body and a printed circuit board on which an electronic element is mounted in a case, wherein the electronic element with a large capacity is mounted on the main printed circuit board, The various electronic elements mounted on the two substrates are mounted on a hybrid IC board, and these boards are integrally connected in an orthogonal state at orthogonal positions spaced apart from each other so that the various elements mounted on the two boards do not interfere with each other, and the case is mounted. A blank relay device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6266282U JPS58164160U (en) | 1982-04-27 | 1982-04-27 | electrical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6266282U JPS58164160U (en) | 1982-04-27 | 1982-04-27 | electrical equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58164160U true JPS58164160U (en) | 1983-11-01 |
| JPH0129964Y2 JPH0129964Y2 (en) | 1989-09-12 |
Family
ID=30072804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6266282U Granted JPS58164160U (en) | 1982-04-27 | 1982-04-27 | electrical equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58164160U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019003697A1 (en) * | 2017-06-30 | 2019-01-03 | オムロン株式会社 | Relay |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558953U (en) * | 1978-07-05 | 1980-01-21 | ||
| JPS5546982U (en) * | 1978-09-19 | 1980-03-27 |
-
1982
- 1982-04-27 JP JP6266282U patent/JPS58164160U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558953U (en) * | 1978-07-05 | 1980-01-21 | ||
| JPS5546982U (en) * | 1978-09-19 | 1980-03-27 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019003697A1 (en) * | 2017-06-30 | 2019-01-03 | オムロン株式会社 | Relay |
| US11096280B2 (en) | 2017-06-30 | 2021-08-17 | Omron Corporation | Relay |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0129964Y2 (en) | 1989-09-12 |
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