JPS6067531A - 樹脂組成物 - Google Patents

樹脂組成物

Info

Publication number
JPS6067531A
JPS6067531A JP58174162A JP17416283A JPS6067531A JP S6067531 A JPS6067531 A JP S6067531A JP 58174162 A JP58174162 A JP 58174162A JP 17416283 A JP17416283 A JP 17416283A JP S6067531 A JPS6067531 A JP S6067531A
Authority
JP
Japan
Prior art keywords
group
compound
examples
nitrobenzyloxy
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58174162A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563488B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Shiyuichi Suzuki
鈴木　脩一
Moriyasu Wada
和田　守叶
Shuji Hayase
修二 早瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58174162A priority Critical patent/JPS6067531A/ja
Priority to US06/653,089 priority patent/US4599155A/en
Priority to EP84111291A priority patent/EP0139234B1/en
Priority to DE8484111291T priority patent/DE3480600D1/de
Publication of JPS6067531A publication Critical patent/JPS6067531A/ja
Publication of JPH0563488B2 publication Critical patent/JPH0563488B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/625—Hydroxyacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/625—Hydroxyacids
    • C08G59/626—Lactones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Silicon Polymers (AREA)
JP58174162A 1983-09-22 1983-09-22 樹脂組成物 Granted JPS6067531A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP58174162A JPS6067531A (ja) 1983-09-22 1983-09-22 樹脂組成物
US06/653,089 US4599155A (en) 1983-09-22 1984-09-21 Resin composition
EP84111291A EP0139234B1 (en) 1983-09-22 1984-09-21 Resin composition
DE8484111291T DE3480600D1 (de) 1983-09-22 1984-09-21 Harzzusammensetzung.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58174162A JPS6067531A (ja) 1983-09-22 1983-09-22 樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6067531A true JPS6067531A (ja) 1985-04-17
JPH0563488B2 JPH0563488B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-09-10

Family

ID=15973777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58174162A Granted JPS6067531A (ja) 1983-09-22 1983-09-22 樹脂組成物

Country Status (4)

Country Link
US (1) US4599155A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0139234B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS6067531A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3480600D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017081963A1 (ja) * 2015-11-10 2017-05-18 株式会社ダイセル 表面処理キット並びに複合成形体及びその製造方法
JP2017089494A (ja) * 2015-11-10 2017-05-25 株式会社ダイセル 自動車部品及びその製造方法
JP2018176516A (ja) * 2017-04-11 2018-11-15 株式会社ダイセル 積層体並びに複合成形体及びその製造方法
US10458360B2 (en) 2014-12-25 2019-10-29 Toyota Jidosha Kabushiki Kaisha Sliding member and method of manufacturing the same

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4822716A (en) * 1985-12-27 1989-04-18 Kabushiki Kaisha Toshiba Polysilanes, Polysiloxanes and silicone resist materials containing these compounds
US4738899A (en) * 1986-07-08 1988-04-19 Claire Bluestein Transparent abrasion-resistant flexible polymeric coating
CA1296124C (en) * 1986-11-06 1992-02-18 Shinji Nakano Paint resin
US4954534A (en) * 1987-07-23 1990-09-04 Ricoh Company, Ltd. Photodecomposing organosilicon compounds and photopolymerizable epoxy resin compositions containing the organosilicon compounds
JPH02173647A (ja) * 1988-12-27 1990-07-05 Hitachi Ltd パタン形成材料及びそれを用いたパタン形成方法
US5047444A (en) * 1989-05-31 1991-09-10 Minnesota Mining And Manufacturing Company Fluorescent degree of cure monitors
US5182316A (en) * 1989-05-31 1993-01-26 Minnesota Mining And Manufacturing Company Fluorescent degree of cure monitors
US5118559A (en) * 1989-05-31 1992-06-02 Minnesota Mining And Manufacturing Company Fluorescent degree of cure monitors
EP0467561B1 (en) * 1990-07-05 1995-10-18 Kabushiki Kaisha Toshiba Photosensitive resin composition for forming a polyimide film pattern
DE4125201C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1991-07-30 1992-10-01 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De
DE4133494C2 (de) * 1991-10-09 1996-03-28 Fraunhofer Ges Forschung Dentalharzmasse, Verfahren zu deren Herstellung und deren Verwendung
DE19619046A1 (de) * 1996-05-02 1997-11-06 Ivoclar Ag Verwendung einer Zusammensetzung als Dentalmaterial und Dentalmaterial
US6124076A (en) * 1998-07-01 2000-09-26 Lucent Technologies Inc. Material exhibiting compensation for polymerization-induced shrinkage and recording medium formed therefrom
JP5707662B2 (ja) * 2008-01-25 2015-04-30 デクセリアルズ株式会社 熱硬化型エポキシ樹脂組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4387215A (en) * 1973-03-30 1983-06-07 Bailey William J Polycyclic ring-opened polymers
US4066747A (en) * 1976-04-08 1978-01-03 Alza Corporation Polymeric orthoesters housing beneficial drug for controlled release therefrom
CH652731A5 (en) * 1979-06-21 1985-11-29 Tokyo Shibaura Electric Co Epoxy resin-based compositions
US4335367A (en) * 1979-08-17 1982-06-15 Tokyo Shibaura Denki Kabushiki Kaisha Electrically insulated coil
JPS6030337B2 (ja) * 1979-09-27 1985-07-16 株式会社日立製作所 熱硬化性樹脂組成物
JPS5672007A (en) * 1979-11-15 1981-06-16 Toagosei Chem Ind Co Ltd Polymerizable composition
US4368314A (en) * 1980-08-29 1983-01-11 Toagoesi Chemical Industry Co., Ltd. Curable composition comprising spiro-orthoester compound
US4434103A (en) * 1981-09-18 1984-02-28 General Electric Company Substituted silicon-oxygen-aluminum oligomers and preparation thereof
JPS5857428A (ja) * 1981-09-30 1983-04-05 Toshiba Corp 光重合組成物
JPS58174418A (ja) * 1982-04-07 1983-10-13 Toshiba Corp 光重合組成物
JPS5949227A (ja) * 1982-09-14 1984-03-21 Toshiba Corp 光重合組成物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10458360B2 (en) 2014-12-25 2019-10-29 Toyota Jidosha Kabushiki Kaisha Sliding member and method of manufacturing the same
WO2017081963A1 (ja) * 2015-11-10 2017-05-18 株式会社ダイセル 表面処理キット並びに複合成形体及びその製造方法
JP2017089494A (ja) * 2015-11-10 2017-05-25 株式会社ダイセル 自動車部品及びその製造方法
JP2018176516A (ja) * 2017-04-11 2018-11-15 株式会社ダイセル 積層体並びに複合成形体及びその製造方法

Also Published As

Publication number Publication date
JPH0563488B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-09-10
DE3480600D1 (de) 1990-01-04
US4599155A (en) 1986-07-08
EP0139234A3 (en) 1986-10-01
EP0139234B1 (en) 1989-11-29
EP0139234A2 (en) 1985-05-02

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